Antennas with improved reception of satellite signals
US-10181646-B2 · Jan 15, 2019 · US
US10374274B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10374274-B2 |
| Application number | US-201715786384-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 17, 2017 |
| Priority date | Oct 17, 2016 |
| Publication date | Aug 6, 2019 |
| Grant date | Aug 6, 2019 |
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A multifunctional electromagnetic structure is presently disclosed. Said structure is a true electromagnetic bandgap (“EBG”) material, with both surface and leaky waves suppressed from the whole structure along all lateral directions. It is also an antenna element, configured to radiate to the broadside direction. The structure has two metallization layers of concentric rings between a square-shaped radiating top metal layer and a bottom ground plane. The lower concentric ring is connected to the ground plane through a plurality of vias, while the patch of the top metal layer is fed with a probe. The EBG unit cells may be used as antenna elements in a phased array environment, where they eliminate scan blindness from the array structure along all scan directions.
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What is claimed is: 1. A bandgap-antenna structure ( 100 ) configured to operate as an antenna element integrating mode-free omnidirectional bandgap behavior to effectively eliminate effects of substrate waves, wherein said structure ( 100 ) comprises: (a) an antenna layer ( 103 ) disposed on a top surface of a solid cubic substrate ( 101 ) having a height, D, close to a half-wavelength of a bandgap frequency lying within a bandgap frequency region, wherein the antenna layer ( 103 ) comprises a metallic patch, having a square geometry, radiating energy from an excitation probe in a direction perpendicular to the bandgap-antenna structure ( 100 ), wherein a frequency of said energy is within a given antenna frequency region; (b) an upper embedded metallic layer ( 105 ), disposed within said substrate ( 101 ) below the antenna layer, comprising a first set of concentric metallic rings; (c) a lower embedded metallic layer ( 107 ), electrically coupled to and disposed below the upper embedded metallic layer ( 105 ) within the substrate ( 101 ), comprising a second set of concentric metallic rings; and (d) a backing ground plane ( 109 ) operatively coupled to a bottom surface of the substrate ( 101 ), wherein the backing ground plane ( 109 ) is electrically coupled to the lower embedded metallic layer ( 107 ) via a plurality of vias ( 111 ), wherein the antenna layer ( 103 ), the upper and lower embedded metallic layers ( 105 , 107 ), and the backing ground plane ( 109 ) are aligned such that a center of each is disposed along an axis normal to the substrate ( 101 ), wherein the given antenna frequency region and the bandgap frequency region overlap so that said mode-free omnidirectional bandgap behavior is exhibited during said energy radiation by said antenna layer ( 103 ). 2. The bandgap-antenna structure ( 100 ) of claim 1 , wherein h1 is a distance between the antenna layer ( 103 ) and the upper embedded metallic layer ( 105 ), wherein h2 is a distance between the upper and lower embedded metallic layers ( 105 , 107 ), wherein h3 is a distance between the lower embedded metallic layer ( 107 ) and the backing ground plane, wherein h1, h2, and h3 are selected to obtain mode-free bandgap behavior at the selected bandgap frequency. 3. The bandgap-antenna structure ( 100 ) of claim 2 , wherein h1 is selected to ensure that the antenna layer ( 103 ) is electrically uncoupled or disconnected from the upper and lower embedded metallic layers ( 105 , 107 ), thereby eliminating a degradation of radiation properties of the metallic patch. 4. The bandgap-antenna structure ( 100 ) of claim 1 , wherein each ring in the first and second sets of concentric metallic rings has one or more gaps of a given width, w0, wherein each gap is positioned to allow each ring to be rotationally symmetric with all other rings, wherein the one or more gaps effectively optimize a radiation frequency response of said structure. 5. The bandgap-antenna structure ( 100 ) of claim 1 , wherein said structure ( 100 ) is used as an antenna element in a phased array, wherein the structure ( 100 ) eliminates scan blindness along all directions as a result of said integrated mode-free omnidirectional bandgap behavior. 6. A bandgap-antenna array comprising two or more of the bandgap-antenna structures of claim 1 , wherein said array operates as an antenna integrating said mode-free omnidirectional bandgap behavior. 7. A method for constructing a bandgap-antenna structure ( 100 ) configured to operate as an antenna element integrating mode-free omnidirectional bandgap behavior, wherein the method comprises: (a) operatively coupling an antenna layer ( 103 ), comprising a metallic patch having a square geometry, to a top surface of a substrate, wherein the substrate ( 101 ) is a solid cube having a height, D, close to half-wavelength of a phased array frequency that lies within a bandgap frequency region; (b) placing an upper embedded metallic layer ( 105 ) within the substrate a distance h1 below the antenna layer, wherein the upper embedded metallic layer ( 105 ) comprises a first set of concentric metallic rings; (c) placing a lower embedded metallic layer ( 107 ) within the substrate a distance h2 below the upper embedded metallic layer ( 105 ) such that the lower and upper metallic layers ( 105 , 107 ) are electrically coupled, wherein the lower embedded metallic layer ( 107 ) comprises a second set of concentric metallic rings; (d) operatively coupling a backing ground plane ( 109 ) to a bottom surface of the substrate at a distance h3 from a bottom surface of the lower embedded metallic layer ( 107 ), wherein the backing ground plane ( 109 ) is electrically coupled to the lower embedded metallic layer ( 107 ) via a plurality of vias ( 111 ), wherein the antenna layer ( 103 ), the upper and lower embedded metallic layers ( 105 , 107 ), and the backing ground plane ( 109 ) are aligned such that a center of each is disposed along an axis normal to the substrate ( 101 ); and (e) feeding the metallic patch with energy within a given antenna frequency region via an excitation probe, which causes the metallic patch to radiate said energy in a direction perpendicular to the substrate ( 101 ), wherein the given antenna frequency region and the bandgap frequency region overlap so that mode-free omnidirectional bandgap behavior is exhibited during said energy radiation by said antenna layer ( 103 ). 8. The method of claim 7 , wherein h1, h2, and h3 are selected to obtain mode-free bandgap behavior at the selected bandgap frequency. 9. The method of claim 7 , wherein h1 is selected to ensure that the antenna layer ( 103 ) is electrically uncoupled or disconnected from the upper and lower embedded metallic layers ( 105 , 107 ), thereby eliminating a degradation of radiation properties of the metallic patch. 10. The method of claim 7 , wherein each ring in the first and second sets of concentric metallic rings has one or more gaps of a given width, w0, wherein each gap is positioned to allow each ring to be rotationally symmetric with all other rings, wherein the one or more gaps effectively optimize a radiation frequency response of said structure. 11. The method of claim 7 , wherein the bandgap-antenna structure ( 100 ) is used as an antenna element in a phased array, wherein the structure ( 100 ) eliminates scan blindness along all directions as a result of said integrated mode-free omnidirectional bandgap behavior. 12. A method of generating mode-free omnidirectional bandgap behavior in an antenna element, comprising: (a) operatively coupling an antenna layer ( 103 ), comprising a metallic patch having a square geometry, to a top surface of a substrate, wherein the substrate ( 101 ) is a solid cube having a height, D, close to half-wavelength of a phased array frequency that lies within a bandgap frequency region; (b) placing an upper embedded metallic layer ( 105 ) within the substrate a distance h1 below the antenna layer, wherein the upper embedded metallic layer ( 105 ) comprises a first set of concentric metallic rings; (c) placing a lower embedded metallic layer ( 107 ) within the substrate a distance h2 below the upper embedded metallic layer ( 105 ) such that the lower and upper metallic layers ( 105 , 107 ) are electrically coupled, wherein the lower embedded metallic layer ( 107 ) comprises a second set of concentric metallic rings; (d) operatively coupling a backing ground plane ( 109 ) to a bottom surface of the substrate at a distance h3 from a bottom surface of the lower embedded metallic layer ( 107 ), wherein the backing ground plane ( 109 ) is electrically coupled to the lower embedded metall
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