Electronic device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10373889-B2
Application number	US-201716079128-A
Country	US
Kind code	B2
Filing date	Mar 24, 2017
Priority date	Apr 13, 2016
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.

First claim

The invention claimed is:

1. An electronic device, comprising:
an electronic component;
a sealing resin body sealing the electronic component;
a first member having at least a portion located in the sealing resin body; and
a second member connected to the first member via a solder in the sealing resin body, wherein
the first member has a facing surface facing the second member and a back surface opposite to the facing surface, the first member includes a base material formed of a metal material and a coated film provided at least on a surface of the base material which is adjacent to the back surface of the first member,
the coated film includes a metal thin film provided on the surface of the base material and an uneven oxide film provided on the metal thin film and made of an oxide of a metal that is a same metal as a main component of the metal thin film, and
the uneven oxide film is provided in the back surface of the first member so as to overlap at least an entirety of a connection region of the facing surface of the first member which is connected to the solder in a projected view along a stacking direction in which the first member, the solder, and the second member are stacked.

2. The electronic device according to claim 1 , wherein
the sealing resin body has a thickness in the stacking direction in such a manner that a portion of the sealing resin body which covers the back surface of the first member is thinner than a portion of the sealing resin body which covers a back surface of the second member opposite to a facing surface of the second member facing the first member.

3. The electronic device according to claim 1 , wherein
the electronic device provides one of three pairs of upper and lower arms of a three-phase inverter,
the electronic component is one of semiconductor chips each having one surface and a back surface opposite to the one surface in the stacking direction, the one surface and the back surface being provided with respective electrodes, and
the semiconductor chips include an upper-arm chip providing the upper arm and a lower-arm chip providing the lower arm, the upper-arm chip and the lower-arm chip are arranged in an orthogonal direction orthogonal to the stacking direction such that the respective one surfaces of the upper- and lower-arm chips are located on a same side of the upper- and lower-arm chips in the stacking direction,
the electronic device further comprising:
a first heat sink and a second heat sink providing a pair of heat sinks disposed such that each of the semiconductor chips is individually interposed between the pair of heat sinks in the stacking direction so as to dissipate heat generated from the semiconductor chip, wherein the first heat sink is disposed adjacent to the one surface of the semiconductor ship in the stacking direction and electrically connected to the electrode on the one surface, the second heat sink is provided by the first member, and the second heat sink is disposed adjacent to the back surface of the semiconductor chip in the stacking direction and includes a main body part electrically connected to the electrode on the back surface and an extending part extending from the main body part in the orthogonal direction; and
a joint part and a main terminal which are provided by the second member, disposed closer to the semiconductor chip than the extending part so as to face the extending part in the stacking direction and electrically connected to the extending part via the solder, wherein the joint part is connected to the extending part of one of the upper arm and the lower arm, and the main terminal is connected to the extending part of the other of the upper arm and the lower arm.

4. The electronic device according to claim 1 , wherein
the first member has a groove part on the facing surface so as to surround the connection region and a protruding part on the back surface to correspond to the groove part and serving as a positional reference part.

5. The electronic device according to claim 4 , wherein
the uneven oxide film is provided on the positional reference part of the back surface of the first member.

6. The electronic device according to claim 1 , wherein
the first member has a first groove part on the facing surface so as to surround the connection region and a second groove part on the back surface to correspond to the first groove part and serving as a positional reference part.

7. The electronic device according to claim 1 , wherein
the uneven oxide film is provided over an entirety of the back surface of the first member.

8. The electronic device according to claim 1 , wherein
the metal thin film has a plurality of depressed parts in a surface of a portion of the metal thin film where the uneven oxide film is provided.

9. The electronic device according to claim 1 , wherein
the portion of the metal thin film where the uneven oxide film is provided has an average thickness smaller than an average thickness of a portion of the metal thin film where the uneven oxide film is not provided.

10. A method of manufacturing an electronic device, the electronic device including:
an electronic component;
a sealing resin body sealing the electronic component;
a first member having at least a portion located in the sealing resin body; and
a second member connected to the first member via a solder in the sealing resin body, wherein
the first member includes a base material formed of a metal material and a coated film provided at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member,
the coated film includes a metal thin film provided on the surface of the base material and an uneven oxide film provided on the metal thin film and made of an oxide of a metal that is a same metal as a main component of the metal thin film, and
the uneven oxide film is provided in the back surface of the first member so as to overlap at least an entirety of a connection region of the facing surface of the first member which is connected to the solder in a projected view along a stacking direction in which the first member, the solder, and the second member are stacked,
the method comprising:
preparing the base material formed with the metal thin film;
forming the uneven oxide film by irradiating a surface of the metal thin film on the back surface of the first member with a pulse oscillation laser beam, the surface of the metal think film irradiated includes at least a portion that corresponds to an entire region of the connection region;
connecting the first member and the second member via the solder;
after the forming of the uneven oxide film and the connecting of the first member and the second member, molding the sealing resin body; and,
after the molding of the sealing resin body, inspecting the solder from a side adjacent to the first member in the stacking direction using a supersonic flaw detector.

Assignees

• Denso Corp

Inventors

• Ooshima Masanori
• Hayashi Eiji

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title