Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-10370536-B2
Application number	US-201515118302-A
Country	US
Kind code	B2
Filing date	Feb 19, 2015
Priority date	Mar 6, 2014
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).

First claim

The invention claimed is:

1. A resin composition comprising:
a polyphenylene ether (A) having a number average molecular weight of 500 to 5000 and comprising a compound represented by the following formula (4):

wherein X represents a group represented by the following formula (5) or the following formula (6), Y each independently represents a group represented by the following formula (7), a and b each represent an integer of 0 to 100, and at least either one of a and b is 1 or more,

wherein R 21 , R 22 , R 23 , R 27 ,and R 28 each independently represent an alkyl group having 6 or less carbon atoms or a phenyl group, and R 24 , R 25 , and R 26 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group,

wherein R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , and R 36 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group, and A represents a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms,

wherein R 39 and R 40 each independently represent an alkyl group having 6 or less carbon atoms or a phenyl group, and R 37 and R 38 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group;
a cyclophosphazene compound (B) represented by the following formula (13);
a non-halogen-based epoxy resin (C);
a cyanate compound (D); and
a filler (E),

wherein Z 1 and Z 2 each independently represents a vinyl group or a hydrogen atom, at least either one of Z 1 and Z 2 is a vinyl group, and n represents an integer of 3 to 8 and
wherein a ratio of the vinyl group equivalent of the cyclophosphazene compound (B) to the vinyl group equivalent of the polyphenylene ether (A) is from 0.2 to 4.

2. The resin composition according to claim 1 , wherein a content of the polyphenylene ether (A) is 40 to 80 parts by mass based on 100 parts by mass of a total of the (A) to (D) components.

3. The resin composition according to claim 1 , wherein a content of the cyclophosphazene compound (B) is 10 to 30 parts by mass based on 100 parts by mass of the total of the (A) to (D) components.

4. The resin composition according to claim 1 , wherein the non-halogen-based epoxy resin (C) comprises any one or more selected from the group consisting of a naphthalene-modified epoxy resin, a cresol novolac-based epoxy resin, and a bisphenol A-based epoxy resin.

5. The resin composition according to claim 1 , wherein a content of the non-halogen-based epoxy resin (C) is 2 to 20 parts by mass based on 100 parts by mass of the total of the (A) to (D) components.

6. The resin composition according to claim 1 , wherein the cyanate compound (D) comprises a bisphenol A-based cyanate compound and/or a naphthol aralkyl-based cyanate compound.

7. The resin composition according to claim 1 , wherein a content of the cyanate compound (D) is 5 to 30 parts by mass based on 100 parts by mass of the total of the (A) to (D) components.

8. The resin composition according to claim 1 , wherein a content of the filler (E) is 20 to 150 parts by mass based on 100 parts by mass of the total of the (A) to (D) components.

9. The resin composition according to claim 1 , wherein the filler (E) comprises a silica.

10. The resin composition according to claim 1 , for use in a prepreg, a metal foil-clad laminate, a single-layer resin sheet, a laminated resin sheet, or a printed wiring board for in-vehicle use.

11. A prepreg comprising:
a base material; and
the resin composition according to claim 1 with which the base material is impregnated or coated.

12. A metal foil-clad laminate comprising:
a laminate of one or more of the prepregs according to claim 11 ; and
metal foil laminate-molded on one surface or both surfaces of the laminate.

13. A single-layer resin sheet obtained by molding the resin composition according to claim 1 into a sheet shape.

14. A laminated resin sheet comprising:
a sheet base material; and
the resin composition according to claim 1 applied and dried on one surface or both surfaces of the sheet base material.

15. A printed wiring board comprising:
an insulating layer; and
a conductor layer formed on one surface or both surfaces of the insulating layer, wherein
the insulating layer comprises the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Ueno Yoshitaka
• Kudo Masataka
• Yaginuma Michio

Classifications

• H05K1/0346

  containing N · CPC title

• B32B27/06

  as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title

• H05K2201/0145

  Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08K7/18

  inorganic · CPC title