Methods for solid freeform fabrication

US10370530B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10370530-B2
Application numberUS-201615054500-A
CountryUS
Kind codeB2
Filing dateFeb 26, 2016
Priority dateFeb 26, 2016
Publication dateAug 6, 2019
Grant dateAug 6, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention provides high performance polymer (HPP) compositions, methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using molding or 3D printing. The HPP compositions comprise a first HPP dissolved in a solvent and a second HPP present as a solid.

First claim

Opening claim text (preview).

We claim: 1. A method for manufacturing a three-dimensional article, the method comprising: a. depositing a powder of a first high performance polymer (HPP) on a build plate to form a powder bed; b. depositing a composition at selected locations on the powder bed wherein the composition comprises: a homogeneous mixture of a second HPP dissolved in a solvent; wherein the composition further comprises particles of a third HPP that are dispersed in the homogeneous mixture of the second HPP and the solvent; and wherein the particles of the third HPP are insoluble in the homogeneous mixture; c. exposing the deposited composition to a stimulus to form a polymer layer of the three-dimensional article; and d. repeating steps (a)-(c) to manufacture remainder of the three-dimensional article. 2. The method of claim 1 , wherein the composition has a viscosity of about 1 cP to about 50 cP. 3. The method of claim 1 , wherein the second HPP comprises a polyketone. 4. The method of claim 2 , wherein the polyketone comprises polyetheretherketone (PEEK), polyaryletherketone (PAEK), polyetherketone (PEK), polyetherketoneketone (PEKK) polyetheretheretherketone (PEEEK), polyetheretherketoneketone (PEEKK), polyetherketoneetheretherketone (PEKEKK), or polyetherketoneketoneketone (PEKKK). 5. The method of claim 1 , wherein the third HPP comprises polyimides, polyketones, reduced forms of polyketones, and polyethersulfones, and wherein the third HPP is not soluble in the solvent. 6. The method of claim 1 , where the stimulus is radiation or heat. 7. The method of claim 5 , wherein radiation is ultraviolet radiation, visible radiation, infrared radiation, electron beam radiation, or combinations thereof. 8. The method of claim 1 , further comprising the step of curing wherein curing is done by chemical curing or thermal curing. 9. The method of claim 5 , wherein the thermal curing is carried out at about 300° C. or above. 10. A method for manufacturing a three-dimensional article, the method comprising: a. depositing a composition comprising: a homogeneous mixture of a first high performance polymer (HPP) dissolved in a solvent; wherein the composition further comprises particles of a second HPP that are dispersed in the homogeneous mixture of the first HPP and the solvent; and wherein the particles of the second HPP are insoluble in the homogeneous mixture; into a mold to form the three-dimensional article; and b. removing the three-dimensional article from the mold. 11. The method of claim 10 , wherein the first HPP comprises a polyketone. 12. The method of claim 10 , wherein the second HPP comprises polyimides, polyketones, reduced forms of polyketones, and polyethersulfones, and wherein the second HPP is not soluble in the solvent. 13. The method of claim 10 , further comprising the step of curing wherein curing is done by chemical curing or thermal curing. 14. The method of claim 13 , wherein the thermal curing is carried out at a temperature below the glass transition temperature of the first HPP. 15. The method of claim 13 , wherein the thermal curing is carried out at a temperature above the glass transition temperature of the first HPP.

Assignees

Inventors

Classifications

  • Yield strength; Tensile strength · CPC title

  • Compositions of polyethers obtained by reactions forming an ether link in the main chain (of polyacetals C08L59/00; of epoxy resins C08L63/00; of polythioether-ethers C08L81/02; of polyether-sulfones C08L81/06); Compositions of derivatives of such polymers · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

  • C08L61/16Primary

    of ketones with phenols · CPC title

  • Processes of additive manufacturing · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10370530B2 cover?
The present invention provides high performance polymer (HPP) compositions, methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using molding or 3D printing. The HPP compositions comprise a first HPP dissolved in a solvent and a second HPP present as a solid.
Who is the assignee on this patent?
Boydston Andrew J, Goetz Adam Edward, Lee Chang Uk, and 6 more
What technology area does this patent fall under?
Primary CPC classification C08L61/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 06 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).