Insulating glass sealants based on polyurethanes and organically-modified nanoclays

US10370523B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10370523-B2
Application numberUS-201715477699-A
CountryUS
Kind codeB2
Filing dateApr 3, 2017
Priority dateApr 3, 2017
Publication dateAug 6, 2019
Grant dateAug 6, 2019

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Curable compositions are prepared using polyisocyanates, hydrophobic hydroxyl-terminated polymers (such as hydroxyl-terminated polyfarnesenes and hydroxyl-terminated polydienes) and organically-modified nanoclays, optionally in combination with chain extenders and/or urethane catalysts. When cured, the compositions yield polyurethane-based sealants useful in insulating glass units which have improved (lowered) moisture vapor transmission rate values as a consequence of the inclusion of the organically-modified nanoclays.

First claim

Opening claim text (preview).

What is claimed is: 1. A curable composition useful for producing an insulating glass sealant, wherein the curable composition comprises at least one organically-modified nanoclay, at least one hydroxyl-terminated polyfarnesene, and at least one polyisocyanate. 2. The curable composition of claim 1 , wherein the at least one hydroxyl-terminated polyfarnesene has a number average molecular weight of from about 1000 to about 20,000 g/mole. 3. The curable composition of claim 1 , wherein the at least one hydroxyl-terminated polyfarnesene has an average hydroxyl functionality of at least about 1.8. 4. The curable composition of claim 1 , wherein the at least one hydroxyl-terminated polyfarnesene comprises at least one hydroxyl-terminated polyfarnesene which is a hydroxyl-terminated polyfarnesene homopolymer. 5. The curable composition of claim 1 , wherein the at least one hydroxyl-terminated polyfarnesene comprises at least one hydroxyl-terminated polyfarnesene which is a hydroxyl-terminated polyfarnesene copolymer comprised of copolymerized units of farnesene and at least one diene co-monomer. 6. The curable composition of claim 1 , wherein the curable composition is additionally comprised of at least one chain extender. 7. The curable composition of claim 6 , wherein the at least one chain extender comprises at least one polyamine chain extender or polyol chain extender. 8. The curable composition of claim 1 , wherein the curable composition is comprised of from about 1 to about 12 weight % organically-modified nanoclay. 9. The curable composition of claim 1 , wherein the at least one organically-modified nanoclay comprises at least one organically-modified montmorillonite nanoclay. 10. The curable composition of claim 1 , wherein the at least one organically-modified nanoclay comprises at least one organically-modified nanoclay that is modified with quaternary alkylammonium. 11. A curable composition useful for producing an insulating glass sealant, wherein the curable composition comprises at least one organically-modified nanoclay, at least one hydroxyl-terminated polymer comprised of at least one hydroxyl-terminated polyfarnesene and at least one hydroxyl-terminated polybutadiene, and at least one polyisocyanate. 12. A curable composition useful for producing an insulating glass sealant, wherein the curable composition comprises at least one organically-modified nanoclay, at least one hydroxyl-terminated polymer selected from the group consisting of hydroxyl-terminated polyfarnesenes and hydroxyl-terminated polydienes, and at least one polyisocyanate, wherein the curable composition is comprised of from 5% to 100% by weight hydroxyl-terminated polyfarnesene and 0 to 95% by weight hydroxyl-terminated polybutadiene based on the total weight of hydroxyl-terminated polymer. 13. A curable composition useful for producing an insulating glass sealant, wherein the curable composition comprises at least one organically-modified nanoclay, at least one hydroxyl-terminated polymer selected from the group consisting of hydroxyl-terminated polyfarnesenes and hydroxyl-terminated polydienes, at least one polyisocyanate, and at least one urethane catalyst. 14. The curable composition of claim 13 , wherein the at least one organically-modified nanoclay comprises at least one organically-modified montmorillonite nanoclay. 15. The curable composition of claim 13 , wherein the curable composition is additionally comprised of at least one chain extender. 16. The curable composition of claim 13 , wherein the at least one hydroxyl-terminated polymer has an average hydroxyl functionality of at least about 1.8. 17. A method of making a sealant, comprising curing the curable composition of claim 1 . 18. A sealant, comprising at least one organically-modified nanoclay and a polyurethane produced by reaction of an admixture comprising at least one hydroxyl-terminated polyfarnesene and at least one polyisocyanate. 19. An insulated glass unit comprising at least two spaced-apart sheets of glass in spaced relationship to each other, a low thermal conductivity insulating gas or mixture of gases therebetween, and a gas sealant element comprising a sealant in accordance with claim 18 .

Assignees

Inventors

Classifications

  • Polyurethanes · CPC title

  • Polyureas; Polyurethanes · CPC title

  • Gas barrier composition · CPC title

  • Clay · CPC title

  • C08K9/04Primary

    Ingredients treated with organic substances {(treated with macromolecular compounds C08K9/08)} · CPC title

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Frequently asked questions

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What does patent US10370523B2 cover?
Curable compositions are prepared using polyisocyanates, hydrophobic hydroxyl-terminated polymers (such as hydroxyl-terminated polyfarnesenes and hydroxyl-terminated polydienes) and organically-modified nanoclays, optionally in combination with chain extenders and/or urethane catalysts. When cured, the compositions yield polyurethane-based sealants useful in insulating glass units which have im…
Who is the assignee on this patent?
Fina Technology
What technology area does this patent fall under?
Primary CPC classification C08K9/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 06 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).