Polyphenylene sulfide resin composition, and moulding and manufacturing process for moulding thereof

Patent metadata

Field	Value
Publication number	US-10370522-B2
Application number	US-201414912859-A
Country	US
Kind code	B2
Filing date	Aug 5, 2014
Priority date	Aug 22, 2013
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

The invention provides a polyphenylene sulfide resin composition which comprises polyphenylene sulfide resin and a deformed cross-section glass fiber, wherein the chlorine content of the polyphenylene sulfide resin composition is equal to or lower than 1,000 ppm. The obtained polyphenylene sulfide resin composition is excellent in flowability, toughness and rigidity. The invention further provides a molding prepared from the polyphenylene sulfide resin composition and a manufacturing process for the polyphenylene sulfide resin composition. The polyphenylene sulfide resin composition is particularly suitable for products for forming frames of a portable computer, a mobile phone and a portable electronic device.

First claim

The invention claimed is:

1. A polyphenylene sulfide resin composition, comprising:
polyphenylene sulfide resin (A),
a deformed cross-section glass fiber (B), and
amorphous resin (C) having a glass-transition temperature a equal to or higher than 100° C. and being selected from polycarbonate, polyphenyl ether, amorphous polyarylate, polysulfone, polyether sulfone, polyetherimide, polyimide and one or more copolymers thereof,
wherein:
the chlorine content of the polyphenylene sulfide resin composition is equal to or lower than 1,000 ppm, and
the recrystallization temperature of the polyphenylene sulfide resin composition is equal to or higher than 210° C. and lower than 220° C.

2. The polyphenylene sulfide resin composition according to claim 1 , wherein the recrystallization temperature of the polyphenylene sulfide resin composition is equal to or higher than 210° C. and lower than 215° C.

3. The polyphenylene sulfide resin composition according to claim 1 , wherein the polyphenylene sulfide is an end-capped polyphenylene sulfide.

4. The polyphenylene sulfide resin composition according to claim 1 , comprising 50 to 200 weight parts of the deformed cross-section glass fiber (B) relative to 100 weight parts of the polyphenylene sulfide resin (A).

5. The polyphenylene sulfide resin composition according to claim 1 , comprising
1.5 to 35 weight parts of the amorphous resin (C) with the glass-transition temperature being equal to or higher than 100° C. relative to 100 weight parts of the polyphenylene sulfide resin (A).

6. The polyphenylene sulfide resin composition according to claim 1 , wherein the amorphous resin (C) with the glass-transition temperature being equal to or higher than 100° C. generates a dispersion of islands in the polyphenylene sulfide resin composition, and the average area of an island in a cross section is smaller than one μm 2 .

7. The polyphenylene sulfide resin composition according to claim 1 , wherein the flatness ratio of the deformed cross-section glass fiber (B) is equal to or larger than 1.5.

8. The polyphenylene sulfide resin composition according to claim 1 , wherein the melting viscosity of a capillary rheometer of the polyphenylene sulfide resin composition, which has the shearing rate of 1,000 s −1 under 315° C., is lower than 180 Pa·s.

9. The polyphenylene sulfide resin composition according to claim 1 , further comprising an elastomer.

10. The polyphenylene sulfide resin composition according to claim 9 , wherein the elastomer is one or more of an olefin elastomer, a modified olefin elastomer and a styrene elastomer.

11. A moulding prepared from the polyphenylene sulfide resin composition according to claim 1 .

12. The moulding according to claim 11 , wherein the thickness of the moulding is equal to or lower than 1.5 mm.

13. The moulding according to claim 11 , wherein the crystallization degree of the moulding is smaller than 50 percent.

14. A product for forming frames of a portable computer, a mobile phone or a portable electronic device, which is prepared from the moulding according to claim 11 .

15. A manufacturing process of the moulding according to claim 11 , wherein the manufacturing process adopts an in-mould insert injection or in-mould transfer moulding technology, and comprises the following steps: firstly putting a cut plastic thin film into a mould, and then performing injection moulding on the polyphenylene sulfide resin composition by an injection moulding machine; the temperature of the mould is equal to or lower than the glass-transition temperature of the polyphenylene sulfide resin (A).

16. The manufacturing process of the moulding according to claim 15 , wherein the temperature of the mould is 5 to 95° C.

17. The polyphenylene resin composition according to claim 1 , wherein the polyphenylene sulfide resin is a polymer that comprises a repeating unit represented formula (I),

in an amount of 70 mole percent or more.

18. The polyphenylene resin composition according to claim 17 , wherein the polyphenylene sulfide resin is a polymer that comprises, in addition to the repeating unit represented formula (I), one or more repeating units selected from the group comprising formulas (II), (III), (IV), (V), (VI), (VII) and (VIII) having structures listed below:

Assignees

• Toray Industries

Inventors

• Peng Kai
• Tang Xianwen
• Liu Qiang
• Ouyang Fen
• Kono Shunji
• Matsuda Masashi
• Hu Ping
• Chan Ying Wai Julian

Classifications

• C08K7/14 Primary

  Glass · CPC title

• B29C45/14008

  Inserting articles into the mould (B29C45/14827 takes precedence) · CPC title

• C08L81/04

  Polysulfides · CPC title

• C08L81/02 Primary

  Polythioethers; Polythioether-ethers · CPC title

• C08G75/02

  Polythioethers · CPC title