Method and device for polymerizing a composition comprising hydridosilanes and subsequently using the polymers to produce silicon-containing layers
US-2016297997-A1 · Oct 13, 2016 · US
US10370392B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10370392-B2 |
| Application number | US-201616062195-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2016 |
| Priority date | Dec 15, 2015 |
| Publication date | Aug 6, 2019 |
| Grant date | Aug 6, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention relates to compositions comprising at least one hydridosilane of the generic formula SinHm with n≥5 and m=(2n) and (2n+2) and at least one compound of the formula HnB (OR)3−n with R=C1-C10-alkyl, C6-C10-aryl, C7-C14-aralkyl, halogen, n=0, 1, 2, to processes for preparation thereof and use thereof.
Opening claim text (preview).
The invention claimed is: 1. A composition comprising: (i) at least one hydridosilane of formula Si n H m with n≥5 and m=(2n) to (2n+2), and (ii) at least one compound of formula H n B(OR) 3−n with R=C 1 -C 10 -alkyl, C 6 -C 10 -aryl, C 7 -C 14 -arylalkyl, or halogen, and n=0, 1, or 2. 2. The composition according to claim 1 , wherein the at least one hydridosilane is a hydridosilane oligomer prepared from a hydridosilane of formula Si x H 2x+2 with x≥3 or a cyclic hydridosilane of formula Si x H 2x with x≥5. 3. The composition according to claim 2 , wherein the hydridosilane oligomer is obtained via thermal oligomerization of a composition comprising, as hydridosilane, at least one hydridosilane of formula Si x H 2x+2 with x≥3-20 in the absence of a catalyst at a temperature of less than 235° C. 4. The composition according to claim 3 , wherein the hydridosilane of the formula Si x H 2x+2 is neopentasilane. 5. The composition according to claim 2 , wherein the hydridosilane of the formula Si x H 2x with x≥5 is cyclopentasilane. 6. The composition according to claim 1 , wherein the compound of the formula H n B(OR) 3−n has a formula H n B(OC 4 H 9 ) 3−n with n=1 or 2. 7. The composition according to claim 1 , further comprising at least one solvent. 8. The composition according to claim 3 , further comprising a hydridosilane of formula Si n H 2n+2 with n=5-9. 9. A process for preparing the composition according to claim 1 , comprising mixing the at least one hydridosilane, the at least one compound of the formula H n B(OR) 3−n and any further constituents.
Boronic and borinic acid compounds · CPC title
in which all the silicon atoms are connected by linkages other than oxygen atoms · CPC title
in which all the silicon atoms are connected by linkages other than oxygen atoms · CPC title
Hydrides of silicon · CPC title
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.