Apparatus for reducing fabric dimpling in electronic devices and associated methods
US-11260639-B2 · Mar 1, 2022 · US
US10369770B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10369770-B2 |
| Application number | US-201514848735-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 9, 2015 |
| Priority date | Jul 12, 2011 |
| Publication date | Aug 6, 2019 |
| Grant date | Aug 6, 2019 |
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CONSTITUTION: A molded article comprising a substrate whose surface is partially or wholly covered with a film, wherein the film has an adhesive layer, the adhesive layer is in contact with the substrate and the surface of the substrate, which surface is in contact with the adhesive layer, has a surface roughness (A) of 3 to 20 μm.
Opening claim text (preview).
The invention claimed is: 1. A method for producing a molded article comprising a substrate whose outer surface is partially or wholly covered with a film, wherein the film has an adhesive layer and the adhesive layer is in contact with the outer surface of the substrate and the outer surface of the substrate has a surface roughness (A) of 3 to 20 μm, comprising a step of partially or wholly coveting the outer surface of the substrate with the film, wherein the adhesive layer on the film has a surface to be brought into contact with the substrate, the surface of the adhesive layer to be brought into contact with the substrate having a surface roughness (B) of 3 to 20 μm before the covering, wherein each of the surface roughness (A) and the surface roughness (B) is a mean maximum height (Rtm) obtained by extracting any part with an evaluation length L from a roughness profile, dividing the length L into five sections having equal lengths, measuring a maximum height from a bottom to a top in the roughness profile in each of the five sections and averaging the maximum heights of the five sections. 2. A method for producing a molded article according to claim 1 , wherein the covering is carried out by vacuum forming or vacuum and pressure forming. 3. A method for preparing a film-covered molded article, comprising: providing a substrate having an outer surface with a surface roughness of from 3 to 20 μm; providing a thermoplastic resin film comprising an adhesive layer having an outer surface with a surface roughness of from 3 to 20 μm; and partially or wholly covering the outer surface of the substrate with the film so that the outer surface of the film adhesive layer contacts the outer surface of the substrate; wherein each surface roughness is a mean maximum height (Rtm) obtained by extracting any part with an evaluation length L from a roughness profile, dividing the length L into five sections having equal lengths, measuring a maximum height from a bottom to a top in the roughness profile in each of the five sections and averaging the maximum heights of the five sections. 4. The method of claim 3 , wherein deaeration occurs between the substrate outer surface and the adhesive layer outer surface. 5. The method of claim 3 , wherein the thermoplastic resin is a polyvinyl chloride, non-crystalline polyester, or acrylic resin. 6. A method for producing a molded article comprising a substrate whose outer surface is partially or wholly covered with a film, wherein the film has an adhesive layer, the adhesive layer is in contact with the outer surface of the substrate and the outer surface of the substrate has a surface roughness (A) of 3 to 20 μm, comprising a step of partially or wholly covering the surface of the substrate with the film, wherein the covering is carried out by vacuum forming or vacuum and pressure forming, wherein the surface roughness (A) is a mean maximum height (Rtm) obtained by extracting any part with an evaluation length L from a roughness profile, dividing the length L into five sections having equal lengths, measuring a maximum height from a bottom to a top in the roughness profile in each of the five sections and averaging the maximum heights of the five sections. 7. The method of claim 1 , wherein the surface of the adhesive layer to be brought into contact with the substrate is roughened to have a surface roughness (B) of 3 to 20 μm.
using multilayered preforms or sheets · CPC title
Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title
Combined thermoforming and prestretching, e.g. biaxial stretching · CPC title
Layered products · CPC title
around holes, apertures or channels present in at least one layer · CPC title
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