Molded article covered with film

US10369770B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10369770-B2
Application numberUS-201514848735-A
CountryUS
Kind codeB2
Filing dateSep 9, 2015
Priority dateJul 12, 2011
Publication dateAug 6, 2019
Grant dateAug 6, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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CONSTITUTION: A molded article comprising a substrate whose surface is partially or wholly covered with a film, wherein the film has an adhesive layer, the adhesive layer is in contact with the substrate and the surface of the substrate, which surface is in contact with the adhesive layer, has a surface roughness (A) of 3 to 20 μm.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a molded article comprising a substrate whose outer surface is partially or wholly covered with a film, wherein the film has an adhesive layer and the adhesive layer is in contact with the outer surface of the substrate and the outer surface of the substrate has a surface roughness (A) of 3 to 20 μm, comprising a step of partially or wholly coveting the outer surface of the substrate with the film, wherein the adhesive layer on the film has a surface to be brought into contact with the substrate, the surface of the adhesive layer to be brought into contact with the substrate having a surface roughness (B) of 3 to 20 μm before the covering, wherein each of the surface roughness (A) and the surface roughness (B) is a mean maximum height (Rtm) obtained by extracting any part with an evaluation length L from a roughness profile, dividing the length L into five sections having equal lengths, measuring a maximum height from a bottom to a top in the roughness profile in each of the five sections and averaging the maximum heights of the five sections. 2. A method for producing a molded article according to claim 1 , wherein the covering is carried out by vacuum forming or vacuum and pressure forming. 3. A method for preparing a film-covered molded article, comprising: providing a substrate having an outer surface with a surface roughness of from 3 to 20 μm; providing a thermoplastic resin film comprising an adhesive layer having an outer surface with a surface roughness of from 3 to 20 μm; and partially or wholly covering the outer surface of the substrate with the film so that the outer surface of the film adhesive layer contacts the outer surface of the substrate; wherein each surface roughness is a mean maximum height (Rtm) obtained by extracting any part with an evaluation length L from a roughness profile, dividing the length L into five sections having equal lengths, measuring a maximum height from a bottom to a top in the roughness profile in each of the five sections and averaging the maximum heights of the five sections. 4. The method of claim 3 , wherein deaeration occurs between the substrate outer surface and the adhesive layer outer surface. 5. The method of claim 3 , wherein the thermoplastic resin is a polyvinyl chloride, non-crystalline polyester, or acrylic resin. 6. A method for producing a molded article comprising a substrate whose outer surface is partially or wholly covered with a film, wherein the film has an adhesive layer, the adhesive layer is in contact with the outer surface of the substrate and the outer surface of the substrate has a surface roughness (A) of 3 to 20 μm, comprising a step of partially or wholly covering the surface of the substrate with the film, wherein the covering is carried out by vacuum forming or vacuum and pressure forming, wherein the surface roughness (A) is a mean maximum height (Rtm) obtained by extracting any part with an evaluation length L from a roughness profile, dividing the length L into five sections having equal lengths, measuring a maximum height from a bottom to a top in the roughness profile in each of the five sections and averaging the maximum heights of the five sections. 7. The method of claim 1 , wherein the surface of the adhesive layer to be brought into contact with the substrate is roughened to have a surface roughness (B) of 3 to 20 μm.

Assignees

Inventors

Classifications

  • using multilayered preforms or sheets · CPC title

  • Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title

  • Combined thermoforming and prestretching, e.g. biaxial stretching · CPC title

  • Layered products · CPC title

  • around holes, apertures or channels present in at least one layer · CPC title

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What does patent US10369770B2 cover?
CONSTITUTION: A molded article comprising a substrate whose surface is partially or wholly covered with a film, wherein the film has an adhesive layer, the adhesive layer is in contact with the substrate and the surface of the substrate, which surface is in contact with the adhesive layer, has a surface roughness (A) of 3 to 20 μm.
Who is the assignee on this patent?
Riken Technos Corp
What technology area does this patent fall under?
Primary CPC classification B32B37/0023. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 06 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).