Thermal solution for transceiver module

Patent metadata

Field	Value
Publication number	US-10368464-B2
Application number	US-201715783043-A
Country	US
Kind code	B2
Filing date	Oct 13, 2017
Priority date	Jun 23, 2017
Publication date	Jul 30, 2019
Grant date	Jul 30, 2019

Abstract

A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.

First claim

What is claimed is:

1. An apparatus for cooling a transceiver, the apparatus comprising:
a cooling jacket configured to receive the transceiver, wherein the transceiver is secured within the cooling jacket via a connecting structure;
a plurality of cooling devices secured to an exterior surface of a housing, wherein the plurality of cooling devices comprises a highly thermal conductivity material, the plurality of cooling devices including a heat pipe running along the topside of the transceiver; and
a heat dissipation device connected to a distal end of each of the plurality of cooling devices,
wherein the heat dissipation device comprises a radiator connected to a pipe comprising cool water from a reservoir.

2. The apparatus of claim 1 , wherein the cooling jacket comprises a thermal conductivity material, selected from a group of aluminum, copper, diamond, alloys, or composite materials.

3. The apparatus of claim 1 , wherein the heat dissipation device comprises at least one of a heat sink, a passive heat exchanger, and a fin.

4. The apparatus of claim 1 , wherein the heat pipe comprises highly conductive material.

5. The apparatus of claim 1 , wherein the plurality of cooling devices comprises at least one vapor chamber, comprising highly conductive material.

6. A switch device having an inlet side, an outlet side, a first sidewall, and a second sidewall, the first sidewall, and the second sidewall extending from the inlet side to the outlet side, the switch device comprising:
at least one row of transceivers extending at least partially from the first sidewall to the second sidewall, where the at least one row of transceivers is configured to receive a plurality of cooling assemblies, wherein each of the plurality of cooling assemblies comprises:
a different cooling jacket configured to secure a transceiver of the at least one row of transceivers via a connecting structure;
a plurality of cooling devices secured to an exterior surface of the cooling jacket, wherein the plurality of cooling devices comprises a highly thermal conductivity material, the plurality of cooling devices including a heat pipe running along the topside of the transceiver; and
a heat dissipation device connected to a distal end of each of the plurality of cooling devices.

7. The switch device of claim 6 , wherein the heat dissipation device comprises a radiator connected to a pipe comprising cool water from a reservoir.

8. The switch device of claim 6 , wherein the cooling jacket comprises a thermal conductivity material, selected from the group of aluminum, copper, diamond, alloys, or composite materials.

9. The switch device of claim 6 , wherein the heat dissipation device comprises at least one of a heat sink, a passive heat exchanger, and a fin.

10. The switch device of claim 6 , wherein the plurality of cooling devices comprises at least one heat pipe comprising highly conductive material.

11. The switch device of claim 6 , wherein the plurality of cooling devices comprises at least one vapor chamber comprising highly conductive material.

Assignees

• Quanta Comp Inc

Inventors

• Chen Chao-Jung
• Huang Yu-Nien
• Wu Kuen-Hsien
• Lee Kuo-Wei

Classifications

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20218 Primary

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• G02B6/4266

  Thermal aspects, temperature control or temperature monitoring (thermal aspect of electrical circuits H05K7/20, H05K5/0213, temperature control in general G05D23/19) · CPC title