Connector with thermal management

US10367283B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10367283-B2
Application numberUS-201715699775-A
CountryUS
Kind codeB2
Filing dateSep 8, 2017
Priority dateAug 16, 2013
Publication dateJul 30, 2019
Grant dateJul 30, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A connector is disclosed that includes a cage that defines a first port and second port that are vertically spaced apart. Card slots are positioned in the ports. A thermal management module is positioned between the two ports. The thermal management module directs thermal energy from one or both ports past a rear wall of the connector. A heat sink can be coupled to the thermal management module to improve thermal dissipation.

First claim

Opening claim text (preview).

We claim: 1. A connector assembly, comprising: a wafer set, the wafers having terminals that have contacts that extend from the wafer in a first direction and tails that extend from the wafer on a second side, the contacts being arranged in rows; a first card slot and a second card slot spaced apart vertically, wherein the rows of contacts are positioned in the first and second card slots; a cage positioned around the wafers and the card slots and having a rear wall, the cage defining a space having a first port and a second port, the first port aligned with the first card slot and the second port aligned with the second card slot; and a thermal management module with a nose and a rear, the nose positioned between the first and second port, the thermal management module including a first thermal interface configured to extend into the first port, the thermal management module including a heat pipe that extends from the nose to the rear, the rear extending rearward of the rear wall, wherein the heat pipe is configured to direct thermal energy from the nose to the rear and the first thermal interface is configured to direct thermal energy to the heat pipe. 2. The connector of claim 1 , wherein the first thermal interface is configured to engage a plug connector when a plug connector is inserted into the first port. 3. The connector of claim 1 , wherein the first thermal interface is configured to direct thermal energy to the heat pipe from a plug connector when a plug connector is inserted into the first port. 4. The connector of claim 1 , further comprising a heat sink that is thermally coupled to the rear. 5. The connector of claim 4 , wherein the heat pipe extends out of an aperture in the rear wall. 6. The connector of claim 5 , wherein the cage has a first wall and a second wall and a top wall and the heat sink is configured to be positioned within a region defined by the first, second and top wall. 7. The connector of claim 6 , wherein the first thermal interface includes a plurality of fingers. 8. The connector of claim 7 , wherein the cage further includes an insert that helps define the first and second port, the thermal management module supported by the insert. 9. A connector assembly, comprising: a cage defining a space having a first port and a second port, the cage including a rear wall and having a front edge that collectively define a first distance; a first card slot positioned in the first port and a second card slot positioned in the second port, the first and second card slots recess from the front edge; a thermal management module with a nose and a rear, the nose positioned between the first and second port, the thermal management module including a first thermal interface that extends into the first port, the thermal management module including a heat pipe that extends from proximate the nose to the rear, the rear extending rearward of the rear wall, wherein the heat pipe is configured to direct thermal energy from the nose to the rear and the first thermal interface is configured to direct thermal energy to the heat pipe. 10. The connector assembly of claim 9 , wherein the heat pipe extends past the rear wall a second distance, the second distance being at least 10 percent of the first distance. 11. The connector assembly of claim 10 , wherein the second distance is at least 30% of the first distance. 12. The connector assembly of claim 9 , wherein the heat pipe is a first heat pipe and the thermal management module has a second heat pipe that extends from proximate the nose to the rear. 13. The connector assembly of claim 12 , wherein at least a portion of the first and second heat pipes extend along opposite sides of the cage. 14. The connector assembly of claim 12 , wherein the first and second heat pipe are closer together proximate the nose than they are as they extend rearward past the rear wall. 15. The connector assembly of claim 14 , wherein a plurality of fins connects the first and second heat pipes together. 16. The connector assembly of claim 9 , wherein a plurality of fins are connected to the heat pipe, the fins being located rearward of the rear wall. 17. The connector assembly of claim 9 , wherein the first thermal interface is configured to engage a plug connector when a plug connector is inserted into the first port. 18. The connector assembly of claim 9 , wherein the first thermal interface is configured to direct thermal energy to the heat pipe from a plug connector when a plug connector is inserted into the first port.

Assignees

Inventors

Classifications

  • G02B6/4268Primary

    Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title

  • the shield being mounted on a PCB and connected to conductive members · CPC title

  • with heat sinks or radiation fins · CPC title

  • H01R12/721Primary

    cooperating directly with the edge of the rigid printed circuits · CPC title

  • co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit (H01R12/72 takes precedence) · CPC title

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What does patent US10367283B2 cover?
A connector is disclosed that includes a cage that defines a first port and second port that are vertically spaced apart. Card slots are positioned in the ports. A thermal management module is positioned between the two ports. The thermal management module directs thermal energy from one or both ports past a rear wall of the connector. A heat sink can be coupled to the thermal management module…
Who is the assignee on this patent?
Molex Llc
What technology area does this patent fall under?
Primary CPC classification G02B6/4268. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).