Insulated wire, coil, and electrical/electronic equipment, and method of preventing cracking of insulated wire
US-2016322126-A1 · Nov 3, 2016 · US
US10366809B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10366809-B2 |
| Application number | US-201916250501-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 17, 2019 |
| Priority date | Jul 19, 2016 |
| Publication date | Jul 30, 2019 |
| Grant date | Jul 30, 2019 |
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n: the number of orientation peak at a β angle of 0° or more and 360° or less.
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The invention claimed is: 1. An insulated wire comprising a thermosetting resin layer on the outer periphery of a conductor, and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer, wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 μm or more and 250 μm or less, and a degree of orientation of a thermoplastic resin in the thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less; Formula 1 Degree of orientation H (%)=[(360−ΣW n )/360]×100 W n : A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction n: the number of orientation peak at a β angle of 0° or more and 360° or less. 2. The insulated wire described in claim 1 , wherein the thermoplastic resin layer comprises at least one thermoplastic resin selected from the group consisting of a polyetheretherketone, a thermoplastic polyimide, and a polyphenylene sulfide, and a melting point of the thermoplastic resin is 260° C. or more and 390° C. or less. 3. The insulated wire described in claim 1 , wherein a thickness of the thermoplastic resin layer is 15 μm or more and 100 μm or less. 4. The insulated wire described in claim 1 , wherein the thermosetting resin layer comprises at least one thermosetting resin selected from the group consisting of a polyamideimide, a polyimide, and a polyesterimide. 5. A coil comprising the insulated wire described in claim 1 . 6. An electric or electronic equipment formed with using the coil described in claim 5 .
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Polyimides or polyesterimides · CPC title
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