Rapid deployment communication tile

US10364577B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10364577-B2
Application numberUS-201715590353-A
CountryUS
Kind codeB2
Filing dateMay 9, 2017
Priority dateFeb 12, 2015
Publication dateJul 30, 2019
Grant dateJul 30, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various embodiments are described that relate to a rapid deployment communications tile. As opposed to running various data and/or power wires, a construction crew can use set of tiles that have built in data and/or power transmission capabilities. These tiles can be keyed such that they interlock together to form a relatively uniform surface, such that the surface can also be used as a floor. Further, the tiles can have hardware components that enable the data and/or power transmission capabilities. These hardware components can be environmentally protected such that their performance is not subject to environmental factors.

First claim

Opening claim text (preview).

What is claimed is: 1. A first tile, comprising: a conduit that transmits a media; an external access portion that enables direct access to the media from the conduit to a non-tile; and a rubber-based outer layer configured to environmentally seal the conduit of the first tile when the first tile is operatively coupled at a first location with the second tile and at a second location with a third tile, where the first tile and a second tile interconnect with one another to form a substantially flat surface, where a conduit of the second tile transmits the media across the second tile, where the conduit of the first tile and the conduit of the second tile engage with one another, where the media travels across the conduit of the first tile and the conduit of the second tile in series, where the outer layer of the first tile and an outer layer of the second tile are keyed such that the first tile and second tile fit together when the conduit of the first tile and the conduit of the second tile align and such that the first tile and second tile do not fit together when the conduit of the first tile and the conduit of the second tile do not align, and where the outer layer of the first tile and an outer layer of a third tile are keyed such that the first tile and third tile fit together when the conduit of the first tile and the conduit of the third tile align and such that the first tile and third tile do not fit together when the conduit of the first tile and the conduit of the third tile do not align. 2. The first tile of claim 1 , where the media comprises data and power, where the conduit comprises a data cable that transmits the data; a power cable that transmits the power; and a rubber-based outer layer that environmentally seals the data cable and the power cable. 3. The first tile of claim 2 , where the media comprises telephone communication, where the conduit comprises a telephone cable that transmits the telephone communication. 4. The first tile of claim 2 , where the conduit of the first tile and the conduit of the second tile engage with one another by way of the data cable engaging with a data cable of the second tile and the power cable engaging with a power cable of the second tile when the first tile and second tile are keyed together. 5. The first tile of claim 1 , comprising: a top side; a bottom side; and an edge side between the top side and the bottom side, where the conduit is not exposed on the bottom side of the first tile, where the external access portion affords access by way of the top side of the first tile, where a second tile accesses the first tile by way of the edge side. 6. The first tile of claim 1 , comprising: an engagement mechanism configured to cause extension of a connector, that is part of the conduit, from within the first tile to outside of the first tile and into the conduit of the second tile. 7. The first tile of claim 1 , where the conduit of the first tile and the conduit of the second tile engage with one another in response to an engagement mechanism being placed in a first position. 8. The first tile of claim 1 , comprising: an engagement mechanism, where the conduit of the first tile and the conduit of the second tile engage with one another in response to the engagement mechanism being placed in a first position, where the conduit of the first tile and the conduit of the second tile disengage with one another in response to the engagement mechanism being placed in a second position different from the first position, and where the conduit comprises a data cable, a power cable, and a telephone cable. 9. A transmission tile, comprising: a channel comprising a data cable configured to transmit data and a power cable configured to transmit power; an outer layer configured to environmentally seal the data cable and the power cable; a transmission tile top side; a transmission tile bottom side; and a transmission tile edge side between the transmission tile top side and the transmission tile bottom side, where the outer layer is configured to interconnect with an outer layer of a supply tile in a keyed manner, where outer layer is configured to interconnect with an outer layer of an access tile in a keyed manner, where the outer layer is a rubber composite, where the supply tile comprises a supply tile top side, a supply tile bottom side, and a supply tile edge side between the supply tile top side and the supply tile bottom side, where the supply tile is configured to receive the power and the data from a first non-tile when the channel is operatively coupled to a channel of the supply tile, where the channel of the transmission tile and the channel of the supply tile are configured to couple by way of their respective edge sides, where the supply tile receives the power and the data from the supply tile top side where the access tile comprises an access tile top side, an access tile bottom side, and an access tile edge side between the access tile top side and the access tile bottom side, where the access tile is configured to provide external access of the data and the power to a non-tile when the channel is operatively coupled to a channel of the access tile, where the channel of the transmission tile and the channel of the access tile are configured to couple by way of their respective edge sides, and where the access tile provides access to the power and the data from the access tile top side. 10. The transmission tile of claim 9 , where the supply tile, the access tile, and the transmission tile, at least when operatively coupled together, form a substantially flat floor surface. 11. The transmission tile of claim 9 , where the channel comprises a telephone cable configured to transmit telephone communication, where the outer layer is configured to environmentally seal the telephone cable, where the supply tile is configured to receive the telephone from the first non-tile when the channel is operatively coupled to the channel of the supply tile, where the supply tile receives the telephone communication from the supply tile top side, and where the access tile provides access to the telephone communication from the access tile top side. 12. The transmission tile of claim 9 , comprising: a flex point configured to allow for connection with the supply tile and the access tile on an uneven surface. 13. A transmission tile, comprising: a channel comprising a data cable configured to transmit data and a power cable configured to transmit power; and an outer layer configured to environmentally seal the data cable and the power cable, where the outer layer is configured to interconnect with an outer layer of a supply tile in a keyed manner; where outer layer is configured to interconnect with an outer layer of an access tile in a keyed manner, where when the outer layer of the transmission tile interconnects with the outer layer of the supply tile, the channel proactively operatively couples with a channel of the supply tile, and where when the outer layer of the transmission tile interconnects with the outer layer of the access tile, the channel proactively operatively couples with a channel of the access tile. 14. The transmission tile of claim 13 , where the outer layer is a rubber composite. 15. The transmission tile of claim 13 , where the channel proactively operatively couples with the channel of the supply tile through male-female configuration. 16. The transmission tile of claim 15 , where the channel proactively operatively couples with the chan

Assignees

Inventors

Classifications

  • Arrangements for providing or supporting expansion · CPC title

  • with both connection parts, i.e. male and female connection parts alternating on one edge · CPC title

  • E04F15/105Primary

    of organic plastics with or without reinforcements or filling materials · CPC title

  • for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets · CPC title

  • wherein the interlocking male and female edge-parts have a dovetail, mushroom or similar shape · CPC title

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Frequently asked questions

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What does patent US10364577B2 cover?
Various embodiments are described that relate to a rapid deployment communications tile. As opposed to running various data and/or power wires, a construction crew can use set of tiles that have built in data and/or power transmission capabilities. These tiles can be keyed such that they interlock together to form a relatively uniform surface, such that the surface can also be used as a floor. …
Who is the assignee on this patent?
Us Army
What technology area does this patent fall under?
Primary CPC classification E04F15/105. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Jul 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).