Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition

US10364152B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10364152-B2
Application numberUS-201715791860-A
CountryUS
Kind codeB2
Filing dateOct 24, 2017
Priority dateMar 25, 2010
Publication dateJul 30, 2019
Grant dateJul 30, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit 6 for supplying the powder material into processing section 3, and processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, and a high-pressure gas (air) generating unit 11. Processing liquid spraying device 70 is configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

First claim

Opening claim text (preview).

What is claimed is: 1. A particle production method by which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, which particle production method uses a particle production apparatus, wherein the particle production apparatus comprises: a chamber including a side portion having a cylindrical shape, wherein in the chamber the powder material is separated from gas carrying the powder material; a processing section including a tubular portion with two ends, an outlet port provided at one of the ends and a wall portion provided at the other end and having a through-hole, the tubular portion of the processing section directly connected to the side portion of the chamber through the outlet port of the processing section so as to protrude from the chamber, wherein in the processing section the processing liquid is allowed to adhere to the surface of each of the inorganic particles; a processing liquid spraying device including a nozzle having a distal end, the nozzle connected to the wall portion of the processing section via the through-hole of the wall portion; and a powder material supply device including a supply portion having an outlet port, said outlet port having an edge closest to the nozzle, the supply portion connected to the tubular portion of the processing section through the outlet port of the supply portion such that a gap is formed along a longitudinal direction of the nozzle between the distal end of the nozzle and the edge of the outlet port of the supply portion closest to the nozzle, wherein the particle production method comprises: supplying the powder material into the processing section; spraying the processing liquid as droplets to the powder material just after the powder material is supplied into the processing section; allowing the processing liquid to adhere to the surface of each of the inorganic particles contained in the powder material; and transferring the powder material into the chamber so that the powder material is separated from the gas carrying the powder material. 2. The particle production method as claimed in claim 1 , wherein the processing liquid and a gas having a pressure being equal to or higher than 0.3 MPa are supplied to the nozzle so that the processing liquid is sprayed from the nozzle into the processing section. 3. The particle production method as claimed in claim 1 , wherein an average particle size of the inorganic particles is in the range of 0.5 to 100 μm. 4. The particle production method as claimed in claim 1 , wherein when the processing liquid is sprayed to the powder material so that the processing liquid adheres to the surface of each of the inorganic particles contained in the powder material, there is a case that the powder material includes aggregated particles each comprised of the inorganic particle and the adhering processing liquid wherein each aggregated particle having a particle size of 150 μm or more, but a ratio of such aggregated particles to the whole of the powder material is equal to or less than 1 wt % of the powder material. 5. The particle production method as claimed in claim 1 , wherein a ratio of the droplets having a particle size being equal to or less than 20 μm to the total of the sprayed droplets is in the range of 80 to 100 wt %. 6. The particle production method as claimed in claim 5 , wherein an average particle size of the droplets of the processing liquid sprayed from the nozzle is in the range of 0.5 to 20 μm. 7. The particle production method as claimed in claim 6 , wherein when the average particle size of the droplets of the processing liquid sprayed from the nozzle is “a” and the average particle size of the inorganic particles is “b”, a/b is in the range of about 0.02 to 1. 8. The particle production method as claimed in claim 1 , wherein the inorganic particles are constituted of silica and the processing liquid is a coupling agent. 9. The particle production method as claimed in claim 1 , wherein a radius of the processing section is in the range of 20 to 100 mm and a length thereof is in the range of 50 to 250 mm. 10. The particle production method as claimed in claim 1 , wherein a distance of the gap is in the range of 5 to 20 mm. 11. The particle production method as claimed in claim 1 , wherein the chamber is provided in a vertical direction and the processing section protrudes from the chamber in a horizontal direction.

Assignees

Inventors

Classifications

  • containing a filler · CPC title

  • using moulds · CPC title

  • Electricity · mapped topic

  • C01B33/18Primary

    Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof (preparation of aerogels by dehydrating gels C01B33/158; treatment to enhance the pigmenting or filling properties C09C) · CPC title

  • B01J2/006Primary

    Coating of the granules without description of the process or the device by which the granules are obtained (to prevent the granules sticking together B01J2/30) · CPC title

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What does patent US10364152B2 cover?
Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit …
Who is the assignee on this patent?
Sumitomo Bakelite Co
What technology area does this patent fall under?
Primary CPC classification C01B33/18. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).