Integral hot melt adhesive packaging films and use thereof

Patent metadata

Field	Value
Publication number	US-10364079-B2
Application number	US-201615004187-A
Country	US
Kind code	B2
Filing date	Jan 22, 2016
Priority date	May 17, 2012
Publication date	Jul 30, 2019
Grant date	Jul 30, 2019

Abstract

Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.

First claim

We claim:

1. A method of forming a cylindrical integral hot melt adhesive package comprising the steps of:
1. preparing packaging film as an encapsulating vessel;
2. pumping or pouring the hot melt adhesive in a molten state into the packaging film, wherein the packaging film is in direct contact with a heat sink;
3. sealing the packaging film; and
4. cooling the sealed package; and
wherein the packaging film comprises a polymer blend comprising at least 70 wt % of propylene and up to 15 wt % of ethylene content; and the packaging film has (a) a viscosity range of about 200,000 to 3,000,000 cps at 200° C. with a rheometer with near-zero shear; (b) a peak melting temperature range of about 90 to 140° C.; (c) a Tm offset temperature below 149° C.; and (d) a storage modulus (G′) range of about 1×10 6 to about 1×10 8 Pascal at 100° C. with frequency at 10 rad/s;
wherein the hot melt adhesive selected is from the group consisting of poly-alpha-olefins, rubbers, styrenic block-copolymers, ethylene-vinyl acetates, ethylene-butyl acetates, and mixtures thereof; and
wherein the cooled sealed package is non-tacky.

2. The method of forming an integral hot melt adhesive package of claim 1 wherein pumping or pouring the hot melt adhesive in a molten state is conducted at temperatures of about 150° C. or below.

3. The method of forming an integral hot melt adhesive package of claim 1 wherein the heat sink is water.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Chen Jinyu
• Hu Yuhong
• Desai Darshak

Classifications

• B32B27/20

  using fillers, pigments, thixotroping agents · CPC title

• B32B2553/00

  Packaging equipment or accessories not otherwise provided for · CPC title

• B32B27/327

  comprising polyolefins obtained by a metallocene or single-site catalyst · CPC title

• C08L23/0815

  with aliphatic 1-olefins containing one carbon-to-carbon double bond · CPC title

• C08L2314/06

  Metallocene or single site catalysts · CPC title