Program resumption method of a lamination molding apparatus

Patent metadata

Field	Value
Publication number	US-10363604-B2
Application number	US-201615384786-A
Country	US
Kind code	B2
Filing date	Dec 20, 2016
Priority date	Dec 22, 2015
Publication date	Jul 30, 2019
Grant date	Jul 30, 2019

Abstract

A lamination molding apparatus, including a numerical control apparatus configured to form a desired lamination molding object by a repetition in accordance with a main program pre-created and numbered with a sequence number, the main program including a plurality of program lines, wherein the repetition includes forming a material powder layer of a predetermined thickness on a molding table for each divided layer, the molding table being vertically movable, the divided layer being obtained by dividing a shape of the desired lamination molding object at the predetermined thickness; and irradiating a predetermined area of the material powder layer with a laser beam to form a sintered layer.

First claim

What is claimed is:

1. A program resumption method of a lamination molding apparatus, comprising:
a starting step to start a main program including a plurality of program lines numbered with a sequence number; and
for each of the program lines to form a sintered layer:
a setting step to set a height of a molding table to a desired height,
a recoating step to form a material powder layer of a predetermined thickness on the molding table for each divided layer, the divided layer being obtained by dividing a shape of the desired lamination molding object at the predetermined thickness,
a sintering step to irradiate a predetermined area of the material powder layer with a laser beam, thereby sintering to form the sintered layer, and
a storing step to store a sequence number of the program line; and further comprising:
a comparing step to compare a first height and a second height, and to compare a first number and a second number when the main program is resumed after suspension of the main program, the first height being a height of the molding table at present, the second height being a height of the molding table appropriate for a timing of resumption, the first number being the sequence number of a program line to be resumed, the second number being the sequence number stored in the storing step.

2. The method of claim 1 , wherein in the storing step, a height of the molding table is further stored, and the second height is calculated based on the height of the molding table stored.

3. The method of claim 2 , wherein when each of the program lines is completed, the sequence number of a completed program line and a height of the molding table at a point of completion of the completed program line are stored.

4. The method of claim 1 , wherein a cumulative number of the sintered layer is further stored; and
the second height can be obtained with a difference between a height of the molding table at a start of molding, and a product of the cumulative number of the sintered layer and the predetermined thickness of the sintered layer.

5. The method of claim 4 , wherein when each of the program lines is completed, the sequence number of a completed program line is stored.

6. The method claim 1 , wherein after the main program is interrupted, in response to input of resumption instruction, the molding table is controlled to be the second height and the main program is resumed from a suspended program line.

7. The method of claim 1 , wherein as a result of the comparing step, a predetermined warning is issued when the first height and the second height are not consistent or the first number and the second number are not consistent.

8. The method of claim 1 , wherein as a result of the comparing step, resumption of the main program is allowed when the first height and the second height are consistent, and the first number and the second number are consistent.

Assignees

• Sodick Co Ltd

Inventors

• Kaneko Mikio

Classifications

• B29C64/393 Primary

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• B22F12/70

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• B22F10/85

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• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title