Light emitting device

Patent metadata

Field	Value
Publication number	US-10361344-B2
Application number	US-201515534297-A
Country	US
Kind code	B2
Filing date	Dec 10, 2015
Priority date	Dec 11, 2014
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

A light-emitting device in which the emission intensity of light-emitting elements is improved by making heat generated by light emission of the light-emitting elements be effectively released is provided. The light-emitting device includes a mounting substrate including a mounting region, light-emitting elements mounted on the mounting region, a sealing resin which contains a phosphor and integrally seals the light-emitting elements, and at least one heat transfer member which is arranged among the light-emitting elements on the mounting region, is embedded in the sealing resin, and has a higher thermal conductivity than the sealing resin.

First claim

The invention claimed is:

1. A light-emitting device comprising:
a mounting substrate having flat upper and lower surfaces, the upper surface including a mounting region;
light-emitting elements mounted on the mounting region and arranged in a square lattice pattern on the mounting region;
a sealing resin which contains a phosphor and integrally seals the light-emitting elements;
wires for electrically connecting the light-emitting elements to one another in the sealing resin, the wires being arranged on sides of squares of the square lattice pattern; and
columnar heat transfer members respectively arranged at centers of square areas configured by the wires and the light-emitting elements on the mounting region, the columnar heat transfer members being embedded in the sealing resin, and made of a material having a higher thermal conductivity and higher hardness than the sealing resin, wherein each of the columnar heat transfer members is solid and has a flat upper surface and a lower part in contact with the mounting substrate, and wherein none of the columnar heat transfer members protrudes through the lower surface of the mounting substrate.

2. The light-emitting device according to claim 1 , wherein a lower end of the columnar heat transfer members is embedded in the mounting substrate.

3. The light-emitting device according to claim 1 ,
wherein the columnar heat transfer members include an upper end located at a position higher than upper ends of the wires.

4. The light-emitting device according to claim 3 , wherein the columnar heat transfer members are made of a metal material.

5. The light-emitting device according to claim 3 , wherein a whole of each of the columnar heat transfer members is made of a material having translucency or light diffusivity, and contains a phosphor, and
light from the light-emitting elements passes through the columnar heat transfer members.

6. The light-emitting device according to claim 1 , wherein
the sealing resin includes a first layer and a second layer in which a concentration of the phosphor is different from each other, in this order from a side near the mounting substrate, and
the concentration of the phosphor in the first layer is higher than the concentration of the phosphor in the second layer.

7. The light-emitting device according to claim 1 , further comprising a circuit substrate fixed onto the upper surface of the mounting substrate, the circuit substrate having an opening in which the mounting region is exposed,
wherein the mounting substrate is a metal substrate.

8. The light-emitting device according to claim 2 , wherein:
the columnar heat transfer members pass through the mounting substrate, and
lower surfaces of the columnar heat transfer members are flush with the lower surface of the mounting substrate.

9. The light-emitting device according to claim 6 , wherein each of the columnar heat transfer members has a first constant diameter in the first layer, and has a second constant diameter smaller than the first constant diameter in the second layer.

Assignees

• Citizen Electronics
• Citizen Watch Co Ltd

Inventors

• Fukasawa Koichi
• Oyamada Nodoka

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/00

  Package configurations · CPC title

• F21V31/04

  Provision of filling media · CPC title

• F21V31/00

  Gas-tight or water-tight arrangements · CPC title