Moisture resistant layered sleeve heater and method of manufacture thereof

Patent metadata

Field	Value
Publication number	US-10361019-B2
Application number	US-201514728515-A
Country	US
Kind code	B2
Filing date	Jun 2, 2015
Priority date	Nov 16, 2007
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

A method of forming a layered heater assembly includes: forming a plurality of layers onto a substrate, the plurality of layers including a resistive element layer; forming electrical terminations in contact with the resistive element layer; securing a protective cover over the layers using a laser welding process, wherein edges of the protective cover are welded circumferentially around raised end portions of the substrate and welded longitudinally along a slotted portion of the substrate; securing a pair of lead wires to the electrical terminations; and securing a lead cap assembly around the pair of lead wires and to the protective cover using a laser welding process.

First claim

What is claimed is:

1. A method of forming a heater assembly comprising:
preparing a preformed protective cover, the preformed protective cover having a preformed shape and defining longitudinal edges, the longitudinal edges defining a longitudinal slot therebetween, the preformed protective cover including at least one flat surface extending along at least one of the longitudinal edges;
forming a plurality of layers onto a substrate using a thermal spray process, the plurality of layers including a resistive element layer, wherein a recessed area for a termination is disposed on the layers;
forming electrical terminations proximate the recessed area;
disposing the preformed protective cover around the substrate with the longitudinal slot of the preformed protective cover aligned with a slotted portion of the substrate, the slotted portion of the substrate including at least one flat surface overlapping and parallel to the at least one flat surface of the preformed protective cover;
securing the preformed protective cover over the layers after the forming of the plurality of layers onto a substrate, wherein edges of the preformed protective cover are secured circumferentially around raised end portions of the substrate and the longitudinal edges of the preformed protective cover are secured longitudinally along the slotted portion of the substrate by bonding the at least one flat surface of the preformed protective cover to the at least one flat surface of the slotted portion of the substrate;
securing a pair of lead wires to the electrical terminations within the recessed area; and
securing a lead cap assembly around the pair of lead wires and to the protective cover,
wherein the protective cover is sealed to the substrate and the lead cap assembly to the protective cover to protect the thermally sprayed layers from moisture intrusion.

2. The method according to claim 1 , wherein the plurality of layers includes a resistive element layer that is formed by a laser removal process.

3. The method according to claim 1 , wherein the lead wires are secured to the electrical terminations using a laser welding process.

4. The method according to claim 1 , wherein the lead cap assembly is secured to the protective cover using a laser welding process.

5. The method according to claim 1 , wherein the lead wires are secured to the electrical terminations with a termination spring, and the termination spring is severed after the termination spring is secured to the electrical terminations.

6. A method of forming a layered heater assembly comprising:
preparing a preformed protective cover, the preformed protective cover having a preformed shape and defining longitudinal edges, the longitudinal edges defining a longitudinal slot therebetween, the preformed protective cover including at least one flat surface extending along at least one of the longitudinal edges;
forming a plurality of layers onto a substrate, the plurality of layers including a resistive element layer;
forming electrical terminations in contact with the resistive element layer;
disposing the preformed protective cover around the substrate with the longitudinal slot of the preformed protective cover aligned with a slotted portion of the substrate, the slotted portion of the substrate including at least one flat surface overlapping and parallel to the at least one flat surface of the preformed protective cover;
securing a preformed protective cover over the layers using a laser welding process after the forming of the plurality of layers onto the substrate, wherein circular edges of the protective cover are welded circumferentially around raised end portions of the substrate and the longitudinal edges of the protective cover are welded longitudinally along the slotted portion of the substrate by welding the at least one flat surface of the preformed protective cover to the at least one flat surface of the slotted portion of the substrate;
securing a pair of lead wires to the electrical terminations; and
securing a lead cap assembly around the pair of lead wires and to the protective cover using a laser welding process,
wherein the lead wires are secured to the electrical terminations with a termination spring, and a portion of the termination spring is severed after the termination spring is secured to the electrical terminations, and
wherein the laser welding process seals the protective cover to the substrate and the lead cap assembly to the protective cover to protect the plurality of layers from moisture intrusion.

7. The method according to claim 6 , wherein the plurality of layers are formed by a thermal spray process.

8. The method according to claim 6 further comprising forming a recessed area for the electrical terminations.

9. The method according to claim 6 , wherein the resistive element layer is formed by a laser removal process.

10. A method of forming a heater assembly comprising:
preparing a preformed protective cover, the preformed protective cover having a preformed shape and including a longitudinal slot, the preformed protective cover including at least one flat surface extending along the longitudinal slot;
preparing a substrate having an outer surface and a recessed area recessed from the outer surface, the substrate having a slotted portion, the slotted portion including at least one flat surface;
thermally spraying a resistive layer on the outer surface of the substrate;
forming a pair of terminal pads in the recessed area and connecting the terminal pads to the resistive layer;
disposing the preformed protective cover around the substrate with the longitudinal slot of the preformed protective cover aligned with the slotted portion of the substrate such that the at least one flat surface of the preformed protective cover overlaps and is parallel to the at least one flat surface of the slotted portion of the substrate; and
securing the preformed protective cover to the substrate using a laser welding process after the thermally spraying of the resistive layer to protect the resistive layer and the terminal pads against moisture intrusion, the longitudinal edges of the preformed protective cover being secured longitudinally along the slotted portion of the substrate by bonding the at least one flat surface of the preformed protective cover to the at least one flat surface of the slotted portion of the substrate,
wherein the laser welding process seals the preformed protective cover to the substrate to protect the thermally sprayed resistive layer from moisture intrusion.

11. The method according to claim 10 , wherein the preformed protective cover defines an aperture.

12. The method according to claim 11 , further comprising aligning the aperture with the terminal pads.

13. The method according to claim 11 , further comprising inserting a pair of leads wires through the aperture to connect the pair of lead wires to the terminal pads.

14. The method according to claim 13 , further comprising securing a pair of lead wires to a termination spring.

15. The method according to claim 14 , further comprising placing the termination spring in the recessed area to connect the termination spring to the terminal pads.

16. The method according to claim 15 , further comprising severing the termination spring into at least two pieces so that the terminal pads are electrically disconnected.

17. The method according to claim 13 , further comprising inserting the lead wires through a lead cap assembly.

18. The method according to claim 17 , further comprising securing the lead c

Assignees

• Watlow Electric Mfg

Inventors

• Russegger Elias
• Schefbanker Gerhard
• Antosch Gernot
• Poeschl Wolfgang
• Wallinger Martin
• Ptasienski Kevin
• Kenchel Matt
• Fennewald Kenneth
• Boldt Allen

Classifications

• H01C17/00 Primary

  Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) · CPC title

• Y10T29/49169

  Assembling electrical component directly to terminal or elongated conductor · CPC title

• H05B3/46

  heating conductor mounted on insulating base · CPC title

• B29C45/2737 Primary

  Heating or cooling means therefor (B29C45/7331 takes precedence) · CPC title

• Y10T29/49083

  Heater type · CPC title