Device faraday cage

Patent metadata

Field	Value
Publication number	US-10359818-B2
Application number	US-201514828400-A
Country	US
Kind code	B2
Filing date	Aug 17, 2015
Priority date	Aug 17, 2015
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.

First claim

The invention claimed is:

1. A device, comprising:
a circuit board that includes a heat generating component;
a thermal module positioned over the heat generating component;
an engagement frame, the thermal module being secured to the engagement frame;
an electrically conductive structure positioned under the heat generating component; and,
springs or clips secured to the circuit board and configured to engage the engagement frame and impact a force on the engagement frame that physically biases the thermal module toward the heat generating component, the springs or clips operating cooperatively with the thermal module and the electrically conductive structure to form a Faraday cage around the heat generating component,
wherein the thermal module and the electrically conductive structure form generally parallel planar surfaces of the Faraday cage, the springs or clips form sides of the Faraday cage between the generally parallel planar surfaces, and the springs or clips define openings that facilitate airflow between the thermal module and the circuit board.

2. The device of claim 1 , wherein the heat generating component comprises a processor and/or memory.

3. The device of claim 1 , wherein the thermal module comprises a vapor chamber, a heat pipe, a heat spreader, or a heat sink.

4. The device of claim 1 , further comprising a thermal interface material between the heat generating component and the thermal module.

5. The device of claim 1 , wherein the springs or clips comprise a first type of spring and a second type of spring.

6. The device of claim 1 , wherein the electrically conductive structure is incorporated into the circuit board.

7. The device of claim 1 , wherein the engagement frame is secured to a bottom portion of the thermal module.

8. The device of claim 1 , wherein individual springs or individual clips are configured to deflect outward as the thermal module is moved toward the circuit board.

9. The device of claim 1 , further comprising one or more other springs configured to oppose the force imparted by the springs or clips.

10. The device of claim 9 , wherein a maximum dimension of the openings is less than a wavelength of radio frequency energy that the Faraday cage is configured to shield from the heat generating component.

11. A device, comprising:
a circuit board that includes a heat generating component;
a thermal module positioned over the heat generating component;
an electrically conductive structure positioned under the heat generating component; and,
a biasing sub-assembly that physically biases the thermal module toward the heat generating component and that operates cooperatively with the thermal module and the electrically conductive structure to form a Faraday cage around the heat generating component,
wherein the biasing sub-assembly defines openings that facilitate airflow between the thermal module and the circuit board and wherein a maximum dimension of the openings is less than a wavelength of radio frequency energy that the Faraday cage is configured to shield from the heat generating component.

12. The device of claim 11 , wherein the maximum dimension is about 2.5 millimeters or less.

13. A device, comprising:
a circuit board having a processor; and,
a Faraday cage formed around the processor, at least one portion of the Faraday cage comprising a thermal module and another portion of the Faraday cage comprising a plurality of clips that bias the thermal module toward the processor,
the plurality of clips being secured to the circuit board and comprising upper clips and lower clips, the upper clips engaging a top portion of the thermal module and the lower clips engaging a bottom portion of the thermal module,
the plurality of clips defining openings that facilitate airflow between the thermal module and the circuit board.

14. The device of claim 13 , wherein the openings are 2.5 millimeters or less.

15. The device of claim 13 , further comprising a spring component configured to create a downward force biasing the thermal module toward the processor.

16. The device of claim 15 , wherein the spring component forces the thermal module and the processor into direct physical contact with one another.

17. The device of claim 13 , wherein a maximum dimension of the openings is less than a wavelength of radio frequency energy that the Faraday cage is configured to shield from the processor.

18. A device, comprising:
a shielded and cooled circuit board including multiple spring components that bias a heat generating component and a thermal module together,
the multiple spring components forming a side portion of a Faraday cage around the heat generating component and having openings between the multiple spring components of the side portion,
wherein a maximum dimension of the openings is less than a wavelength of radio frequency energy that the Faraday cage is configured to shield from the heat generating component.

19. The device of claim 18 , wherein the multiple spring components include multiple springs that are resiliently biased over the thermal module to bias the heat generating component and the thermal module together.

20. The device of claim 19 , wherein the resilient bias of the multiple springs over the thermal module can be temporarily overcome to separate the heat generating component and the thermal module.

21. The device of claim 19 , wherein the heat generating component forms a generally planar surface that extends through the multiple springs and the openings.

22. The device of claim 18 , wherein the thermal module comprises a vapor chamber, a heat pipe, or a heat spreader.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Stellman Taylor
• Buxton Bert B
• Thome Nathan M

Classifications

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title