Polycrystalline diamond sintered/rebonded on carbide substrate containing low tungsten

Patent metadata

Field	Value
Publication number	US-10358705-B2
Application number	US-201515536826-A
Country	US
Kind code	B2
Filing date	Nov 20, 2015
Priority date	Dec 17, 2014
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

A method of forming a polycrystalline diamond cutting element includes assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly. The substrate includes an attachment material including a refractory metal. The assembly is subjected to a first high-pressure/high temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material and subjected to a second high-pressure/high temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to bond the infiltrated diamond material to the substrate.

First claim

What is claimed is:

1. A method of forming a polycrystalline diamond cutting element, comprising:
assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly, the substrate comprising an attachment material comprising a refractory metal, and the diamond material comprising diamond powder;
subjecting the assembly to a first high-pressure/high-temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material; and
subjecting the assembly to a second high-pressure/high-temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to attach the infiltrated diamond material to the substrate.

2. The method of claim 1 , wherein the attachment material comprises metal carbide particles and metal binder.

3. The method of claim 1 , wherein the substrate comprises tungsten carbide grains bonded together by a cobalt binder.

4. The method of claim 1 , wherein the catalyst material or infiltrant material infiltrates into the diamond material before the attachment material infiltrates into the diamond material.

5. The method of claim 1 , wherein the temperature of the second high-pressure/high-temperature condition is higher than the temperature of the first high-pressure/high-temperature condition.

6. The method of claim 1 , wherein the first high-pressure/high-temperature condition comprises a temperature of about 1100° C. to about 1360° C., and the second high-pressure/high-temperature condition comprises a temperature from about 1300° C. to about 1600° C.

7. The method of claim 1 , further comprising holding the first high-pressure/high-temperature condition for about 0.1 minutes to about 10 minutes prior to the second high-pressure/high-temperature condition.

8. The method of claim 1 , wherein the source of catalyst material or infiltrant material distinct from the substrate comprises a transition layer comprising a mixture of catalyst material and diamond powder placed between the diamond material and the substrate.

9. The method of claim 8 , wherein the catalyst material is included at about 10 wt % to about 70 wt % based on the total weight of the transition layer.

10. The method of claim 1 , wherein the source of catalyst material or infiltrant material comprises metal foil or metal powder placed adjacent to the diamond material opposite the substrate.

11. The method of claim 1 , wherein the catalyst material or infiltrant material comprises a metal or a metal alloy including an element from Group VIII of the Periodic Table.

12. The method of claim 11 , wherein the catalyst material or infiltrant material comprises cobalt.

13. The method of claim 1 , wherein after the second high-pressure/high-temperature condition, a region of the infiltrated diamond material opposite the substrate includes less than 1.0 wt % refractory metal based on the total weight of the region.

Assignees

• Smith International

Inventors

• Bao Yahua
• Wang Fulong
• Belnap J Daniel
• Eyre Ronald K
• Fang Yi

Classifications

• E21B10/5735

  Interface between the substrate and the cutting element · CPC title

• C22C2026/006

  with additional metal compounds being carbides · CPC title

• C22C26/00 Primary

  Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

• B22F2005/001

  Cutting tools, earth boring or grinding tool other than table ware · CPC title

• B22F3/14 Primary

  simultaneously · CPC title