Microfluidic assembly and methods of forming same

Patent metadata

Field	Value
Publication number	US-10357964-B2
Application number	US-201815917231-A
Country	US
Kind code	B2
Filing date	Mar 9, 2018
Priority date	Feb 12, 2016
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.

First claim

The invention claimed is:

1. A printhead, comprising:
an outer surface; and
a microfluidic assembly coupled to the outer surface, the microfluidic assembly including:
a microfluidic die having a first surface and a plurality of nozzles on the first surface, the plurality of nozzles being configured to expel a fluid, the microfluidic die including a ledge having a second surface that is offset from the first surface, the second surface including a plurality of bond pads, the microfluidic die including a lateral surface extending from the ledge;
an interconnect substrate having a lateral surface at a first end abutting the lateral surface of the microfluidic die, the interconnect substrate having first and second surfaces, the first surface of the interconnect substrate being coplanar with the second surface of the ledge, the interconnect substrate including a plurality of contacts laterally arranged with the plurality of bond pads;
conductive elements having first ends coupled to the bond pads of the microfluidic die and second ends coupled to the contacts of the interconnect substrate; and
encapsulant material over the plurality of bond pads, the plurality of contacts, and the conductive elements.

2. The printhead of claim 1 wherein the plurality of contacts are laterally aligned with the plurality of bond pads, respectively.

3. The printhead of claim 1 wherein the first surface of the microfluidic die and the second surface of the ledge are facing the same direction.

4. The printhead of claim 1 , comprising a reservoir and a lid, the outer surface being an outer surface of one of the reservoir and the lid, wherein the fluid is contained in the reservoir.

5. A printhead comprising:
an outer surface; and
a microfluidic assembly coupled to the outer surface, the microfluidic assembly including:
a microfluidic die having a first surface and a plurality of nozzles on the first surface, the plurality of nozzles being configured to expel a fluid, the microfluidic die including a ledge having a second surface that is offset from the first surface, the second surface including a plurality of bond pads, the microfluidic die including a lateral surface extending from the ledge;
an interconnect substrate having a first end coupled to the lateral surface of the microfluidic die, the interconnect substrate including a plurality of contacts laterally arranged with the plurality of bond pads;
conductive elements having first ends coupled to the bond pads of the microfluidic die and second ends coupled to the contacts of the interconnect substrate; and
encapsulant material over the plurality of bond pads, the plurality of contacts, and the conductive elements,
wherein the interconnect substrate has first and second surfaces, wherein the first surface of the interconnect substrate is coplanar with the second surface of the ledge, wherein the microfluidic die includes a back surface that is opposite the first surface, and wherein the second surface of the interconnect substrate is offset from the back surface of the microfluidic die.

6. The printhead of claim 5 wherein the encapsulant couples the microfluidic die to the interconnect substrate.

7. The printhead of claim 5 wherein a lateral surface of the first end of the interconnect substrate abuts the lateral surface of the microfluidic die.

8. An electronic device, comprising:
an upper surface; and
one or more microfluidic assemblies mounted to the upper surface, each of the one or more microfluidic assemblies including:
a microfluidic die having a first surface and a plurality of nozzles on the first surface, the plurality of nozzles being configured to expel a fluid, the microfluidic die having a second surface that is offset from the first surface, a plurality of bond pads located on the second surface and along a first edge of the microfluidic die;
an interconnect substrate having a lateral surface abutting a first lateral surface of the microfluidic die, the interconnect substrate including a plurality of contacts laterally arranged with the plurality of bond pads of the microfluidic die, wherein a surface of the interconnect substrate is substantially coplanar with the second surface of the microfluidic die;
conductive elements having first ends coupled to the bond pads of the microfluidic die and second ends coupled to the contacts of the interconnect substrate; and
encapsulant over the plurality of bond pads, the plurality of contacts, and the conductive elements.

9. The electronic device of claim 8 wherein the plurality of contacts of the interconnect substrate are aligned with the plurality of bond pads of the microfluidic die.

10. The electronic device of claim 8 wherein the plurality of contacts are aligned with the plurality of bond pads.

11. The electronic device of claim 8 wherein the encapsulant aids in coupling the interconnect substrate to the microfluidic die.

12. The electronic device of claim 11 wherein the microfluidic die includes a ledge that extends from a second side surface of the microfluidic die, the plurality of bond pads being located on a surface of the microfluidic die that is between the first side surface and the second side surface.

13. The electronic device of claim 12 wherein conductive elements are conductive wires.

14. A microfluidic assembly, comprising:
a microfluidic die having a nozzle plate with a plurality of nozzles configured to expel a fluid, the microfluidic die including a ledge that extends from a first lateral surface of the microfluidic die, the ledge having a surface that is offset from a surface of the nozzle plate, the surface of the ledge including a plurality of bond pads, the microfluidic die including a second lateral surface extending from the surface of the ledge;
an interconnect substrate having a surface that includes a plurality of contacts at a first end, the first end of the interconnect substrate including a lateral surface that abuts the second lateral surface of the microfluidic die, the plurality of contacts being laterally arranged relative to the plurality of bond pads, wherein the surface of the interconnect substrate is substantially coplanar with the surface of the ledge;
conductive elements coupling the bond pads of the microfluidic die to the contacts of the interconnect substrate; and
encapsulant over the plurality of bond pads, the plurality of contacts, and the conductive elements.

15. The microfluidic assembly of claim 14 wherein the plurality of bond pads are laterally aligned with the plurality of contacts.

16. The microfluidic assembly of claim 14 wherein a back surface of the microfluidic die is spaced apart from a back surface of the interconnect substrate.

17. The microfluidic assembly of claim 14 wherein the encapsulant couples the interconnect substrate to the microfluidic die.

Assignees

• St Microelectronics Inc
• Stmicroelectronics Malta Ltd

Inventors

• Dodd Simon
• Ellul Ivan
• Brincat Christopher

Classifications

• B41J2002/14362

  Assembling elements of heads · CPC title

• B41J2002/14491

  Electrical connection · CPC title

• B41J2/01 Primary

  Ink jet · CPC title

• B41J2/1433

  Structure of nozzle plates · CPC title

• B41J2/04548

  Details of power line section of control circuit · CPC title