Method for manufacturing resin substrate with hard coating film and resin substrate with hard coating film

US10357908B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10357908-B2
Application numberUS-201615091233-A
CountryUS
Kind codeB2
Filing dateApr 5, 2016
Priority dateOct 25, 2013
Publication dateJul 23, 2019
Grant dateJul 23, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided are: a method for efficiently manufacturing an abrasion-resistant resin substrate with a hard coating film with adhesiveness and weather resistance obtained by sequentially laminating a primer layer and a hard coating layer on a resin substrate without decreasing the adhesiveness and the weather resistance; and a resin substrate with hard coat film obtained by this method. A method for manufacturing a resin substrate with a hard coating film having a primer layer and a hard coating layer, includes: a step of forming a primer layer containing an acrylic polymer on one main surface of a resin film to obtain a resin film laminate; a step of forming a resin substrate by injection molding on another main surface of the resin film in the resin film laminate; and a step of applying a hard coating layer forming composition on the primer layer and curing the hard coating layer forming composition.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a resin substrate with a hard coating film having a resin substrate formed by injection molding, a resin film on one main surface of the resin substrate and a hard coating film including at least a primer layer and a hard coating layer laminated on the resin film, the method comprising: a step (1) of preparing the resin film with a thickness of 150 to 400 μm and made of a same kind of resin as a resin constituting the resin substrate, applying a primer layer forming composition containing a primer resin component containing an acrylic polymer (A) having a mass average molecular weight of 200,000 to 1,000,000 as a main component and a solvent by a wet method on one main surface of the resin film and drying the primer layer forming composition to form the primer layer having a content of the solvent of less than 1.5 mass % relative to 100 mass % of a total solid content, to obtain a resin film laminate; a step (2) of forming the resin substrate by injection molding on another main surface of the resin film in the resin film laminate, to obtain a resin substrate with a resin film laminate; and a step (3) of applying a hard coating layer forming composition containing an organopolysiloxane (S) as a main component on the primer layer in the resin substrate with a resin film laminate and curing the hard coating layer forming composition, to obtain the resin substrate with a hard coating film. 2. The manufacturing method according to claim 1 , wherein the resin constituting the resin substrate and the resin film is polycarbonate. 3. The manufacturing method according to claim 1 , wherein the primer layer forming composition contains a non-polymerizable ultraviolet absorbent, and a content of the ultraviolet absorbent is 5 to 50 mass % relative to 100 mass % of the primer resin component. 4. The manufacturing method according to claim 1 , wherein the organopolysiloxane (S) contains: an organopolysiloxane (a) containing silicon-containing bond units represented by following T1 to T3 at a ratio among numbers of the units of T1:T2:T3=0 to 5:30 to 45:50 to 70 and a ratio of T3/T2≥1.5, and having a ratio of the number of hydroxyl groups (Hy) bonded to silicon atoms relative to the number of alkoxy groups (Al) bonded to silicon atoms in a molecule, (Hy)/(Al) of 12.0 to 100 on a molecular average, and a mass average molecular weight of 800 to 8,000; and an organopolysiloxane (b) having silicon-containing bond units represented by the following T1 to T3 and having a mass average molecular weight of 1/10 to 1/1.5 times the mass average molecular weight of the organopolysiloxane (a) at a ratio of 100 to 500 mass % relative to 100 mass % of the organopolysiloxane (a), T1: R—Si(—OX) 2 (—O*—) T2: R—Si(—OX)(—O*—) 2 T3: R—Si(—O*—) 3 where R represents an alkyl group having 1 to 6 carbon atoms, X represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and O* represents an oxygen atom linking two silicon atoms. 5. The manufacturing method according to claim 1 , wherein the application of the hard coating layer forming composition in the step (3) is performed by a flow coating method. 6. The manufacturing method according to claim 1 , wherein the application of the hard coating layer forming composition in step (3) is performed by a wet method.

Assignees

Inventors

Classifications

  • Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate · CPC title

  • Polymeric substrate or laminate · CPC title

  • Weight, e.g. weight per square meter · CPC title

  • of synthetic resin · CPC title

  • Use of polyesters {or derivatives thereof}, as moulding material · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10357908B2 cover?
Provided are: a method for efficiently manufacturing an abrasion-resistant resin substrate with a hard coating film with adhesiveness and weather resistance obtained by sequentially laminating a primer layer and a hard coating layer on a resin substrate without decreasing the adhesiveness and the weather resistance; and a resin substrate with hard coat film obtained by this method. A method for…
Who is the assignee on this patent?
Agc Inc
What technology area does this patent fall under?
Primary CPC classification B29C45/14811. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 23 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).