Luminescent substrate containing abrasive particles, and method for the production thereof

US10357869B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10357869-B2
Application numberUS-201615763011-A
CountryUS
Kind codeB2
Filing dateSep 29, 2016
Priority dateSep 30, 2015
Publication dateJul 23, 2019
Grant dateJul 23, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An abrasive sawing or polishing substrate includes a substrate, a binder C1 covering at least a portion of the substrate, and abrasive particles having an at least partial coating, C2. The abrasive sawing or polishing substrate also includes a coating C3 coating binder C1 and the abrasive particles coated with C2 and at least one light-emitting compound. The abrasive particles coated with C2 are in contact with binder C1 and with coating C3.

First claim

Opening claim text (preview).

The invention claimed is: 1. An abrasive sawing or polishing substrate, comprising: a substrate; a binder C 1 covering at least a portion of the substrate; abrasive particles having an at least partial coating, C 2 ; a coating C 3 coating binder C 1 and the abrasive particles coated with C 2 ; at least one light-emitting compound; the abrasive particles coated with C 2 being in contact with binder C 1 and with coating C 3 , and wherein the substrate is selected from the group comprising: a steel wire; a textile; and a metal plate; wherein binder C 1 is made of at least one layer of a nickel/cobalt alloy having a cobalt content in the range from 20% to 85% by weight with respect to the weight of the Ni/Co alloy; wherein coating C 2 of the abrasive particles is made of a material selected from the group comprising nickel; cobalt; iron; copper; and titanium; and wherein coating C 3 is made of at least one layer of a nickel/cobalt alloy having a cobalt content in the range from 10% to 90% by weight with respect to the weight of the Ni/Co alloy. 2. An abrasive sawing or polishing substrate, comprising: a substrate; a binder C 1 covering at least a portion of the substrate; abrasive particles having an at least partial coating, C 2 ; a coating C 3 coating binder C 1 and the abrasive particles coated with C 2 ; at least one light-emitting compound: the abrasive particles coated with C 2 being in contact with binder C 1 and with coating C 3 , wherein said substrate comprises a light-emitting compound CL 1 in binder C 1 . 3. An abrasive sawing or polishing substrate, comprising: a substrate; a binder C 1 covering at least a portion of the substrate; abrasive particles having an at least partial coating, C 2 ; a coating C 3 coating binder C 1 and the abrasive particles coated with C 2 ; at least one light-emitting compound: the abrasive particles coated with C 2 being in contact with binder C 1 and with coating C 3 , wherein said substrate comprises a light-emitting compound CL 2 in coating C 2 . 4. An abrasive sawing or polishing substrate, comprising: a substrate; a binder C 1 covering at least a portion of the substrate; abrasive particles having an at least partial coating, C 2 ; a coating C 3 coating binder C 1 and the abrasive particles coated with C 2 ; at least one light-emitting compound: the abrasive particles coated with C 2 being in contact with binder C 1 and with coating C 3 , wherein said substrate comprises a light-emitting compound CL 3 in coating C 3 . 5. The abrasive substrate of claim 1 , wherein the substrate comprises: a light-emitting compound CL 1 in binder C 1 ; a light-emitting compound CL 2 in coating C 2 ; a light-emitting compound CL 3 in coating C 3 ; CL 1 , CL 2 , and CL 3 being different from one another. 6. The abrasive substrate of claim 1 , wherein the abrasive particles are made of a material selected from the group comprising silicon carbide SiC; silica SiO 2 ; tungsten carbide WC; silicon nitride Si 3 N 4 ; cubic boron nitride cBN; chromium dioxide CrO 2 ; aluminum oxide Al 2 O 3 ; diamond; and diamonds pre-coated with nickel, iron, cobalt, copper, or titanium, or with alloys thereof. 7. The abrasive substrate of claim 1 , wherein the light-emitting compound is selected from the group comprising metal oxide; metal sesquioxide; metal oxyfluoride; metal vanadate; metal fluoride; and mixtures thereof. 8. A method of manufacturing an abrasive sawing or polishing substrate having (i) a substrate, (ii) a binder C 1 covering at least a portion of the substrate, (iii) abrasive particles having at least a partial coating, C 2 , (iv) a coating C 3 coating binder C 1 and the abrasive particles coated with C 2 , and (v) at least one light-emitting compound, wherein the abrasive particles coated with C 2 are in contact with binder C 1 and with coating C 3 , the method comprising the steps of: forming of an abrasive substrate by electrodeposition on a substrate of a binder C 1 and of abrasive particles, by passing through an electrolyte bath B 1 containing abrasive particles, said abrasive particles having an at least partial coating, C 2 , binder C 1 at least partially covering the substrate; electrodeposition of a coating C 3 , by passing through an electrolyte bath B 2 , coating C 3 at least partially covering binder C 1 and the abrasive particles, the abrasive particles being in contact with binder C 1 and coating C 3 ; integration of at least one light-emitting compound in at least one layer from among binder C 1 , coating C 2 , or coating C 3 , wherein the substrate is selected from the group comprising: a steel wire; a textile; and a metal plate; wherein binder C 1 is made of at least one layer of a nickel/cobalt alloy having a cobalt content in the range from 20% to 85% by weight with respect to the weight of the Ni/Co alloy; wherein coating C 2 of the abrasive particles is made of a material selected from the group comprising nickel; cobalt; iron; copper; and titanium; and wherein coating C 3 is made of at least one layer of a nickel/cobalt alloy having a cobalt content in the range from 10% to 90% by weight with respect to the weight of the Ni/Co alloy. 9. The method of manufacturing the abrasive substrate of claim 8 , wherein the light-emitting compound is introduced in the form of an aqueous solution of light-emitting nanoparticles or nanocolloids into bath B 1 or B 2 .

Assignees

Inventors

Classifications

  • characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties · CPC title

  • by electrolytic deposition · CPC title

  • involving optical means · CPC title

  • B24D3/346Primary

    utilised during polishing, or grinding operation · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10357869B2 cover?
An abrasive sawing or polishing substrate includes a substrate, a binder C1 covering at least a portion of the substrate, and abrasive particles having an at least partial coating, C2. The abrasive sawing or polishing substrate also includes a coating C3 coating binder C1 and the abrasive particles coated with C2 and at least one light-emitting compound. The abrasive particles coated with C2 ar…
Who is the assignee on this patent?
Commissariat Energie Atomique, Thermocompact Sa
What technology area does this patent fall under?
Primary CPC classification B24D3/346. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 23 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).