Heat dissipation structure

Patent metadata

Field	Value
Publication number	US-10356946-B2
Application number	US-201314407257-A
Country	US
Kind code	B2
Filing date	Jun 6, 2013
Priority date	Jun 15, 2012
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.

First claim

The invention claimed is:

1. A heat dissipation structure, obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition comprising a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture wherein a cured product of the thermally conductive curable resin composition has a 180-degree peel strength on a SUS 304 plate of 0.05 N/25 mm to 1.00 N/25 mm.

2. The heat dissipation structure according to claim 1 , wherein the curable liquid resin (I) is at least one of a curable acrylic resin and a curable polypropylene oxide resin.

3. The heat dissipation structure according to claim 1 , wherein the cured product of the thermally conductive curable resin composition is in contact with both the electromagnetic shielding case and the electronic component.

4. The heat dissipation structure according to claim 1 , wherein the thermally conductive curable resin composition after curing has a thermal conductivity of 0.5 W/(m·K) or more.

5. A personal digital assistant, comprising the heat dissipation structure as defined in claim 1 .

6. An electronic device, comprising the heat dissipation structure as defined in claim 1 .

7. The heat dissipation structure according to claim 2 , wherein the curable liquid resin (I) comprises the curable acrylic resin and the curable polypropylene oxide resin.

8. The head dissipation structure according to claim 1 , wherein the curable liquid resin (I) contains a hydrolysable silyl group at an end.

Assignees

• Kaneka Corp

Inventors

• OGUMA Keisuke
• KOUKAMI Aki
• Hagiwara Kazuo

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W76/17

  characterised by their materials · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title