Dissipating an electrostatic charge from an optical element

Patent metadata

Field	Value
Publication number	US-10356389-B2
Application number	US-201514865330-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Sep 25, 2015
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

A method and apparatus for dissipating an electrostatic charge from an optical element are described. An apparatus includes the optical element, a microelectromechanical system (MEMS) device located proximate to the optical element, and a conductive coating over the optical element, wherein the conductive coating is substantially transparent, and wherein the conductive coating dissipates the electrostatic charge.

First claim

What is claimed is:

1. An apparatus for dissipating an electrostatic charge from an optical element, comprising:
the optical element;
a microelectromechanical system (MEMS) device located proximate to the optical element;
a conductive coating over the optical element, wherein the conductive coating is substantially transparent, and wherein the conductive coating dissipates the electrostatic charge; and
a dichroic layer over the optical element proximate to or on an opposite side of the optical element from the conductive layer.

2. The apparatus of claim 1 , comprising an electrical coupling from the conductive coating to a ground connection.

3. The apparatus of claim 1 , wherein the dichroic layer is under the conductive coating.

4. The apparatus of claim 1 , wherein the conductive coating comprises a layer of indium-tin-oxide (ITO).

5. The apparatus of claim 1 , wherein the conductive coating comprises a metal coating.

6. The apparatus of claim 1 , wherein the conductive coating comprises a silver coating.

7. A method for protecting a microelectromechanical system (MEMS) device from effects caused by an electrostatic charge on an optical element, comprising:
applying a conductive coating to the optical element;
applying a dichroic layer to the optical element proximate to or on an opposite side of the optical element from the conductive layer; and
installing the optical element in a case proximate to the MEMS device.

8. The method of claim 7 , comprising applying the conductive coating to a side of the optical element to be installed facing towards the MEMS device.

9. The method of claim 7 , comprising applying the conductive coating to a side of the optical element to be installed facing away from the MEMS device.

10. The method of claim 7 , comprising applying the conductive coating to both sides of the optical element.

11. The method of claim 7 , comprising coupling the conductive coating to a ground connection.

12. The method of claim 7 , comprising applying the dichroic layer and then applying the conductive coating over the dichroic layer.

13. The method of claim 7 , comprising sputtering a metal coating on the optical element as the conductive coating.

14. A computing device comprising an optoelectronic device, wherein the optoelectronic device comprises:
an optical element configured to allow light to pass from inside a case to outside the case;
a microelectromechanical system (MEMS) device to control a mirror located proximate to the optical element;
a conductive coating over the optical element, wherein the conductive coating is substantially transparent, and wherein the conductive coating dissipates an electrostatic charge; and
a dichroic layer over the optical element proximate to or on an opposite side of the optical element from the conductive layer.

15. The computing device of claim 14 , comprising a collimated light source directed at the mirror.

16. The computing device of claim 14 , comprising a laser directed at the mirror.

17. The computing device of claim 14 , comprising the conductive coating on a side of the optical element opposite the MEMS device.

18. The computing device of claim 14 , comprising the conductive coating on a side of the optical element facing the MEMS device and on the side of the optical element opposite the MEMS device.

19. The computing device of claim 14 , comprising an electrical coupling from the conductive coating to a ground connection.

20. The computing device of claim 14 wherein the dichroic layer is under the conductive coating.

21. The computing device of claim 14 , wherein the dichroic layer is over the conductive coating.

22. The computing device of claim 14 , wherein the conductive coating comprises a layer of indium-tin-oxide (ITO).

23. The computing device of claim 14 , comprising a three-dimensional scanner comprising the MEMS device.

24. The computing device of claim 14 , comprising an imaging device.

25. The computing device of claim 24 , wherein the imaging device comprises a still shot camera, a three dimensional (3D) camera, or a video recording device, or any combinations thereof.

Assignees

• Intel Corp

Inventors

• Hirshberg Arnon
• Freedman Barak

Classifications

• H05F3/02

  by means of earthing connections · CPC title

• H04N5/2254

  Electricity · mapped topic

• G02B1/16 Primary

  having an anti-static effect, e.g. electrically conducting coatings · CPC title

• G02B26/0833

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• G02B1/11

  Anti-reflection coatings · CPC title