Glue bleeding prevention cap for optical sensor packages

Patent metadata

Field	Value
Publication number	US-10355146-B2
Application number	US-201816027647-A
Country	US
Kind code	B2
Filing date	Jul 5, 2018
Priority date	Aug 26, 2016
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.

First claim

The invention claimed is:

1. An optical sensor package, comprising:
a substrate;
a sensor die coupled to the substrate;
a light-emitting device coupled to the substrate; and
a cap positioned around side surfaces of the sensor die and covering at least a portion of the substrate, the cap including:
first and second sidewalls,
an inner wall having first and second side surfaces and a mounting surface, the first and second side surfaces being transverse to the mounting surface, the inner wall including an opening extending into the inner wall from the mounting surface,
a cover in contact with the first and second sidewalls and the inner wall, and
at least one stepped extension at a junction between one of the first and second sidewalls and the cover, the at least one stepped extension facing the inner wall.

2. The optical sensor package of claim 1 wherein the at least one stepped extension includes a first surface extending inwardly from the one of the first and second sidewalls and a second surface extending between the first surface and a lower surface of the cover.

3. The optical sensor package of claim 2 wherein the first surface of the at least one stepped extension extends in a direction parallel to a surface of the substrate, and the second surface of the at least one stepped extension extends in a direction transverse to the surface of the substrate.

4. The optical sensor package of claim 1 , further comprising an adhesive on the sensor die and at least partially within the opening, the adhesive securing the inner wall to the sensor die.

5. The optical sensor package of claim 1 wherein the opening includes a slot extending from the mounting surface of the inner wall through the inner wall and through the cover.

6. The optical sensor package of claim 1 wherein the opening includes:
a first recess extending into the inner wall from the mounting surface and from the first side surface of the inner wall; and
a second recess extending into the inner wall from the mounting surface and from the second side surface of the inner wall.

7. The optical sensor package of claim 6 , further comprising an adhesive between the mounting surface of the inner wall and the sensor die, the adhesive at least partially disposed in the first recess and in the second recess.

8. The optical sensor package of claim 1 wherein the light-emitting device comprises at least one of a vertical cavity surface emitting laser (VCSEL) and a light-emitting diode (LED).

9. The optical sensor package of claim 8 wherein the cap includes:
a first air vent between the first transparent window and the light emitting opening, and
a second air vent between the second transparent window and the light receiving opening.

10. The optical sensor package of claim 1 wherein the cap includes:
a light emitting opening over the light-emitting device,
a light receiving opening over the sensor die,
a first transparent window covering the light emitting opening, and
a second transparent window covering the light receiving opening.

11. An optical sensor package, comprising:
a substrate;
a sensor die coupled to the substrate;
a light-emitting device coupled to the substrate; and
a cap positioned around side surfaces of the sensor die and covering at least a portion of the substrate, the including:
first and second sidewalls,
an inner wall having first and second side surfaces and a mounting surface, the first and second side surfaces being transverse to the mounting surface, the inner wall including an opening extending into the inner wall from the mounting surface, the mounting surface of the inner wall is attached to the sensor die with an adhesive,
a cover in contact with the first and second sidewalls and the inner wall, and
at least one stepped extension at a junction between one of the first and second sidewalls and the cover.

12. The cap of claim 11 wherein the mounting surface of the inner wall is attached to the sensor die with the adhesive further comprises the adhesive being positioned within the opening extending into the inner wall from the mounting surface.

13. The cap of claim 11 wherein the first and second sidewalls are coupled to the substrate by a glue.

14. An optical sensor package, comprising:
a substrate;
a sensor die on the substrate; and
a cap positioned around side surfaces of the sensor die and attached to the substrate, the cap including:
first and second sidewalls attached to the substrate with a first adhesive,
an inner wall having first and second side surfaces and a mounting surface, the first and second side surfaces being transverse to the mounting surface, the inner wall including an opening extending into the inner wall from the mounting surface, the inner wall attached to the sensor die with a second adhesive, and
a cover in contact with the first and second sidewalls and the inner wall, the cover including a first through hole and a second through hole spaced apart from the first through hole,
a first transparent window covering the first through hole between the cover and the substrate, and
a second transparent window covering the second through hole between the cover and the substrate.

15. The optical sensor package of claim 14 wherein the cap includes at least one stepped extension at a junction between one of the first and second sidewalls and the cover.

16. The optical sensor package of claim 14 wherein the cap includes:
a first air vent between the first transparent window and the light emitting opening, and
a second air vent between the second transparent window and the light receiving opening.

17. A cap for an optical sensor package, comprising:
first and second outer sidewalls;
an inner wall between the first and second outer sidewalls;
a cover in contact with the first and second outer sidewalls and the inner wall, the inner wall including an opening extending into the inner wall from a first surface of the inner wall; and
at least one stepped extension at a junction between one of the first and second outer sidewalls and the cover.

18. The cap of claim 17 wherein the opening extending into the inner wall from a first surface of the inner wall extends to a second surface of the inner wall.

19. The cap of claim 17 wherein the stepped extension further comprises a first surface facing the inner wall and a second surface facing away from the cover.

20. The cap of claim 17 wherein the opening includes wherein the opening includes a slot extending from the mounting surface of the inner wall through the inner wall and through the cover.

21. A cap for an optical sensor package, comprising:
first and second sidewalls;
an inner wall between the first and second sidewalls;
a cover in contact with the first and second sidewalls and the inner wall, the inner wall including an opening extending into the inner wall from a first surface of the inner wall, wherein the opening includes a first recess extending into the inner wall from the first surface of the inner wall and from a first side surface of the inner wall, the first side surface being transverse to the first surface; and
at least one stepped extension at a junction between one of the first and second sidewalls and the cover.

22. The cap of claim 21 wherein the opening includes a second recess extending into the inner wall from the first surface of the inner wall and from a second side surface of the inner wall, the second side surface being opposite the first sid

Assignees

• St Microelectronics Pte Ltd

Inventors

• Luan Jing-En
• Herard Laurent
• LEI Yong Jiang

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• G01S17/46

  Indirect determination of position data · CPC title

• G01S17/04

  Systems determining the presence of a target · CPC title

• G01S7/4813

  Housing arrangements · CPC title

• G01S7/481

  Constructional features, e.g. arrangements of optical elements · CPC title