Semiconductor device

Patent metadata

Field	Value
Publication number	US-10354940-B2
Application number	US-201815898676-A
Country	US
Kind code	B2
Filing date	Feb 19, 2018
Priority date	Aug 9, 2017
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

According to the present invention, a semiconductor device includes a first metal plate, a second metal plate provided above the first metal plate, a third metal plate provided above the second metal plate, a first semiconductor chip provided between the first metal plate and the second metal plate, a second semiconductor chip provided between the second metal plate and the third metal plate and a cooling member, wherein the first metal plate has a first cooling portion that is in contact with the cooling member, the second metal plate has a second cooling portion that is in contact with the cooling member, and the third metal plate has a third cooling portion that is in contact with the cooling member.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a first metal plate having a first mounting surface;
a second metal plate having a second mounting surface facing the first mounting surface, and a third mounting surface which is a surface on an opposite side to the second mounting surface, the second metal plate being provided above the first metal plate;
a third metal plate that has a fourth mounting surface facing the third mounting surface, and is provided above the second metal plate;
a first semiconductor chip that is provided between the first metal plate and the second metal plate, the first semiconductor chip including a back-side electrode joined to the first mounting surface and an upper-side electrode joined to the second mounting surface;
a second semiconductor chip that is provided between the second metal plate and the third metal plate, and has another back-side electrode joined to the third mounting surface and another upper-side electrode joined to the fourth mounting surface; and
a cooling member,
wherein the first metal plate has a first cooling portion that extends from a portion to which the first semiconductor chip is joined, and is in contact with the cooling member,
the second metal plate has a second cooling portion that extends from a portion to which the first semiconductor chip and the second semiconductor chip are joined, and is in contact with the cooling member, and
the third metal plate has a third cooling portion that extends from a portion to which the second semiconductor chip is joined, and is in contact with the cooling member.

2. The semiconductor device according to claim 1 , further comprising
a sealing member for sealing the first semiconductor chip and the second semiconductor chip,
wherein the second cooling portion and the third cooling portion protrude from a side surface of the sealing member.

3. The semiconductor device according to claim 1 ,
wherein a plurality of the cooling members are provided,
the first cooling portion, the second cooling portion and the third cooling portion are provided so as to overlap one another when viewed from a direction perpendicular to the first mounting surface, and
the plurality of the cooling members are provided between the first cooling portion and the second cooling portion and between the second cooling portion and the third cooling portion respectively.

4. The semiconductor device according to claim 3 , wherein the plurality of the cooling members are provided to a surface of the first cooling portion on an opposite side to the second cooling portion and to a surface of the third cooling portion on an opposite side to the second cooling portion respectively.

5. The semiconductor device according to claim 3 ,
wherein the first metal plate has a plurality of first cooling portions extending from both sides of the portion to which the first semiconductor chip is joined,
the second metal plate has a plurality of second cooling portions extending from both sides of the portion to which the first semiconductor chip and the second semiconductor chip are joined, and
the third metal plate has a plurality of third cooling portions extending from both sides of the portion to which the second semiconductor chip is joined.

6. The semiconductor device according to claim 1 ,
wherein a plurality of the cooling members are provided,
the first cooling portion and the third cooling portion are provided so as to overlap each other when viewed from a direction perpendicular to the first mounting surface,
the second cooling portion extends from the portion to which the first semiconductor chip and the second semiconductor chip are joined, in a direction different from a directions in which the first cooling portion and the third cooling portion extend when viewed from a direction perpendicular to the first mounting surface, and
the plurality of the cooling members are provided between the first cooling portion and the third cooling portion and on both sides of the second cooling portion in the direction perpendicular to the first mounting surface respectively.

7. The semiconductor device according to claim 6 , wherein the second cooling portion extends from the portion to which the first semiconductor chip and the second semiconductor chip are joined, in a direction toward an opposite side to the first cooling portion and the third cooling portion when viewed from the direction perpendicular to the first mounting surface.

8. The semiconductor device according to claim 1 , wherein the cooling member is provided outside an area where the first semiconductor chip and the second semiconductor chip are provided when viewed from a direction perpendicular to the first mounting surface.

9. The semiconductor device according to claim 3 , wherein the plurality of the cooling members are provided just below the first semiconductor chip and just above the second semiconductor chip respectively.

10. The semiconductor device according to claim 1 ,
wherein the first metal plate is provided on an upper surface of the cooling member,
the first cooling portion extends on the upper surface of the cooling member,
the second cooling portion has a first crooked portion crooked to the cooling member, an end portion of the second cooling portion on an opposite side to the second semiconductor chip with respect to the first crooked portion extends on the upper surface of the cooling member,
the third cooling portion has a second crooked portion crooked to the cooling member, and an end portion of the third cooling portion on an opposite side to the second semiconductor chip with respect to the second crooked portion extends on the upper surface of the cooling member,
the second cooling portion extends in a direction different from a directions in which the first cooling portion extends when viewed from a direction perpendicular to the first mounting surface, and
the third cooling portion extends in a direction different from directions in which the first cooling portion and the second cooling portion extend when viewed from the direction perpendicular to the first mounting surface.

11. The semiconductor device according to claim 10 , wherein one of the first cooling portion, the second cooling portion and the third cooling portion is larger in width than the upper surface of the cooling member.

12. The semiconductor device according to claim 1 , wherein the surfaces of the first cooling portion, the second cooling portion and the third cooling portion which are in contact with the cooling member are each provided with a plurality of irregularities.

13. The semiconductor device according to claim 10 , wherein the cooling member includes a heat sink.

14. The semiconductor device according to claim 1 , wherein the cooling member includes a cooling flow channel which is a flow passage for cooling liquid.

15. The semiconductor device according to claim 14 , wherein a high thermal-conductive insulator is provided between each of the first cooling portion, the second cooling portion and the third cooling portion and the cooling flow channel.

16. The semiconductor device according to claim 1 , wherein the cooling member includes a heat pipe.

Assignees

• Mitsubishi Electric Corp

Inventors

• Tsunoda Tetsujiro
• Ichimura Toru

Classifications

• F28F2265/24

  for electrical insulation · CPC title

• F28F1/22

  the means having portions engaging further tubular elements · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D1/0476

  the conduits having a non-circular cross-section · CPC title

• F28D2021/0029

  Heat sinks · CPC title