Hybrid magnetic material structures for electronic devices and circuits

Patent metadata

Field	Value
Publication number	US-10354786-B2
Application number	US-201615283350-A
Country	US
Kind code	B2
Filing date	Oct 1, 2016
Priority date	Oct 1, 2016
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.

First claim

What is claimed is:

1. An inductor comprising:
a first layer of magnetic film material applied on a substrate, wherein the first layer has a top surface with one or more tapered sides;
an insulating layer disposed on a surface of the first layer of magnetic film material;
one or more conductors placed directly on the insulating layer above the first layer of magnetic film material, wherein the insulating layer and the conductors have approximately the same lateral width; and
a second layer of magnetic particles, the magnetic particles being suspended in an insulating medium, wherein the second layer is disposed on and around one or more sides of the one or more conductors, one or more sides of the insulating layer, and the one or more tapered sides of the first layer.

2. The inductor of claim 1 , wherein the second layer is a coating applied with a particle application process.

3. The inductor of claim 2 , wherein the particle application process includes one or more of:
3D printing;
cold spraying;
spin coating; or
screen printing.

4. The inductor of claim 1 , wherein the insulating medium includes one of a polyimide or an adhesive.

5. The inductor of claim 1 , wherein the magnetic particles include carbonyl iron particles.

6. The inductor of claim 5 , wherein the carbonyl iron particles are anodized.

7. The inductor of claim 1 , wherein the magnetic particles have a diameter in a range of 0.5 micrometers to 10.0 micrometers.

8. The inductor of claim 1 , wherein the second layer is wrapped around one or more sides of the inductor and is in contact with the first layer.

9. The inductor of claim 1 , wherein the magnetic film material includes one or more of a cobalt alloy, a nickel alloy, an iron alloy, Permalloy (alloy of nickel and iron), or other soft magnetic material.

10. The inductor of claim 9 , wherein a cobalt alloy is one of CZT (CoZrTa, or Cobalt Zirconium Tantalum), CoZrNb (Cobalt Zirconium Niobium), or CoP (Cobalt Phosphorus).

11. The inductor of claim 1 , wherein the first layer is applied by sputter deposition or electroplating of the magnetic film material.

12. A method to fabricate an inductor comprising:
applying a first layer of magnetic film material on a substrate, wherein the first layer has a top surface with one or more tapered sides;
disposing an insulating layer on a surface of the first layer of magnetic film material;
placing one or more conductors placed directly on the insulating layer above the first layer of magnetic film material, wherein the insulating layer and the conductors have approximately the same lateral width; and
applying a second layer of magnetic particles, the magnetic particles being suspended in an insulating medium, wherein the second layer is disposed on and around one or more sides of the one or more conductors, one or more sides of the insulating layer, and the one or more tapered sides of the first layer.

13. The method of claim 12 , wherein applying the second layer includes applying a coating with a particle application process.

14. The method of claim 13 , wherein applying the second layer includes one or more additive manufacturing techniques, the techniques including:
3D printing;
cold spraying;
spin coating; or
screen printing.

15. The method of claim 12 , wherein the insulating medium includes one of a polyimide or an adhesive.

16. The method of claim 12 , wherein applying the second layer includes applying carbonyl iron particles.

17. The method of claim 12 , wherein applying the first layer includes applying one or more of a cobalt alloy, a nickel alloy, an iron alloy, Permalloy (alloy of nickel and iron), or other soft magnetic material.

18. The method of claim 17 , wherein a cobalt alloy is one of CZT (CoZrTa, or Cobalt Zirconium Tantalum), CoZrNb (Cobalt Zirconium Niobium), or CoP (Cobalt Phosphorus).

19. The method of claim 12 , wherein applying the first layer includes sputter deposition or electroplating of the magnetic film material.

20. The method of claim 12 , further comprising tapering one or more sides of the first layer.

21. The method of claim 20 , wherein applying the second layer of magnetic particles includes applying the second layer around one or more sides of the inductor, the second layer being applied to contact the one or more tapered sides of the first layer.

22. A method for generating electromagnetic shielding comprising:
fabricating an electronic device or circuit on a circuit board or package;
applying a layer of magnetic film material on the circuit board or package, wherein the layer of magnetic film material has a top surface with one or more tapered sides; disposing an insulating layer on a surface of the layer of magnetic film material; and applying an electromagnetic coating on all or a portion of electronic device or circuit, wherein the electronic device or circuit is placed directly on the insulating layer above the first layer of magnetic film material, wherein the insulating layer and the electronic device or circuit have approximately the same lateral width;
wherein applying the electromagnetic coating includes applying a layer of magnetic particles with a particle application process, the magnetic particles being suspended in an insulating medium, wherein the layer of magnetic particles is disposed on and around one or more sides of all or the portion of electronic device or circuit, one or more sides of the insulating layer, and the one or more tapered sides of the layer of magnetic film material.

23. The method of claim 22 , wherein the particle application process includes one or more of:
3D printing;
cold spraying;
spin coating; or
screen printing.

24. The method of claim 22 , wherein the magnetic particles include carbonyl iron particles.

25. A system on chip (SoC) comprising:
a central processing unit (CPU);
memory to store data for the CPU;
a transmitter or receiver for transmitting or receiving data via wireless communication; and
one or more passive components including one or more hybrid magnetic material inductors, a hybrid magnetic material inductor including:
a first layer of magnetic film material applied on a substrate, wherein the first layer has a top surface with one or more tapered sides;
an insulating layer disposed on a surface of the first layer of magnetic film material;
one or more conductors placed directly on the insulating layer above the first layer of magnetic film material, wherein the insulating layer and the conductors have approximately the same lateral width; and

a second layer of magnetic particles, the magnetic particles being suspended in an insulating medium, wherein the second layer is disposed on and around one or more sides of the one or more conductors, one or more sides of the insulating layer, and the one or more tapered sides of the first layer.

26. The system on chip of claim 25 , wherein the second layer is a coating applied with a particle application process.

27. The system on chip of claim 26 , wherein the particle application process includes one or more of:
3D printing;
cold spraying;
spin coating; or
screen printing.

Assignees

• Intel Corp

Inventors

• Gardner Donald S
• Schrom Gerhard
• Burton Edward A

Classifications

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F41/32

  for applying conductive, insulating or magnetic material on a magnetic film {, specially adapted for a thin magnetic film} · CPC title