Pressure sensor chip

Patent metadata

Field	Value
Publication number	US-10352803-B2
Application number	US-201515300578-A
Country	US
Kind code	B2
Filing date	Mar 9, 2015
Priority date	Mar 31, 2014
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

A pressure sensor chip according to the present invention includes an annular diaphragm that surrounds a periphery of a low-differential-pressure diaphragm (1) as a high-differential-pressure diaphragm (2). A measurement pressure (Pa) for one surface of the low-differential-pressure diaphragm (1) is transmitted to one surface of the high-differential-pressure diaphragm (2) along a branched path, and a measurement pressure (Pb) for the other surface of the low-differential-pressure diaphragm (1) is transmitted to the other surface of the high-differential-pressure diaphragm (2) along a branched path. Thus, multiple differential-pressure measurement ranges can be provided.

First claim

The invention claimed is:

1. A pressure sensor chip comprising:
a substrate;
a sensor diaphragm of a first type that is formed in a central region of the substrate and that outputs a signal corresponding to a difference between pressures applied to one surface and the other surface of the sensor diaphragm of the first type;
a sensor diaphragm of a second type that is formed on the substrate so as to be apart from the sensor diaphragm of the first type, the sensor diaphragm of the second type outputting a signal corresponding to a difference between pressures applied to one surface and the other surface of the sensor diaphragm of the second type;
first and second holding members that are bonded to one surface and the other surface of the substrate in such a manner that the first and second holding members face each other with the sensor diaphragm of the second type disposed therebetween;
a first pressure introduction hole provided in the first holding member to transmit a first measurement pressure to the one surface of the sensor diaphragm of the first type;
a second pressure introduction hole provided in the second holding member to transmit a second measurement pressure to the other surface of the sensor diaphragm of the first type;
a first recess provided in the first holding member to prevent the sensor diaphragm of the first type from being excessively displaced when an excessive pressure is applied to the sensor diaphragm of the first type;
a second recess provided in the second holding member to prevent the sensor diaphragm of the first type from being excessively displaced when an excessive pressure is applied to the sensor diaphragm of the first type;
a first chamber provided in a peripheral portion of the first holding member as a space that faces the one surface of the sensor diaphragm of the second type, one of the first measurement pressure for the one surface of the sensor diaphragm of the first type and the second measurement pressure for the other surface of the sensor diaphragm of the first type being transmitted to the first chamber; and
a second chamber provided in a peripheral portion of the second holding member as a space that faces the other surface of the sensor diaphragm of the second type, the other of the first measurement pressure for the one surface of the sensor diaphragm of the first type and the second measurement pressure for the other surface of the sensor diaphragm of the first type being transmitted to the second chamber.

2. The pressure sensor chip according to claim 1 ,
wherein the sensor diaphragm of the second type is an annular diaphragm that extends continuously so as to surround a periphery of the sensor diaphragm of the first type.

3. The pressure sensor chip according to claim 1 ,
wherein the sensor diaphragm of the second type is an annular diaphragm that is divided into portions arranged so as to surround a periphery of the sensor diaphragm of the first type.

4. The pressure sensor chip according to claim 1 ,
wherein the sensor diaphragm of the second type is a diaphragm provided at a portion of a periphery of the sensor diaphragm of the first type.

5. The pressure sensor chip according to claim 1 ,
wherein a pressure sensitivity of the sensor diaphragm of the second type is lower than a pressure sensitivity of the sensor diaphragm of the first type.

6. The pressure sensor chip according to claim 1 ,
wherein the sensor diaphragm of the second type is provided in a plurality, and
wherein the plurality of sensor diaphragms of the second type each have a pressure sensitivity lower than a pressure sensitivity of the sensor diaphragm of the first type, and the pressure sensitivity of the sensor diaphragms of the second type decreases stepwise.

7. The pressure sensor chip according to claim 1 ,
wherein the first holding member includes a non-bonding region provided inside the first holding member and connected to a periphery of the first pressure introduction hole,
wherein the non-bonding region in the first holding member is a region in which a first surface and a second surface face each other along a portion of a plane parallel to the one surface of the substrate,
wherein a plurality of protrusions are discretely formed on at least one of the first surface and the second surface that face each other in the non-bonding region in the first holding member,
wherein passages between the plurality of protrusions formed in the first holding member form channels between the periphery of the first pressure introduction hole and a peripheral edge of the non-bonding region,
wherein the second holding member includes a non-bonding region provided inside the second holding member and connected to a periphery of the second pressure introduction hole,
wherein the non-bonding region in the second holding member is a region in which a first surface and a second surface face each other along a portion of a plane parallel to the other surface of the substrate,
wherein a plurality of protrusions are discretely formed on at least one of the first surface and the second surface that face each other in the non-bonding region in the second holding member, and
wherein passages between the plurality of protrusions formed in the second holding member form channels between the periphery of the second pressure introduction hole and a peripheral edge of the non-bonding region.

Assignees

• Azbil Corp

Inventors

• Tokuda Tomohisa

Classifications

• G01L13/02

  using elastically-deformable members or pistons as sensing elements · CPC title

• G01L9/0054

  integral with a semiconducting diaphragm · CPC title

• G01L19/0618

  Overload protection · CPC title

• G01L9/0052

  of piezoresistive elements (circuits therefor G01L9/06) · CPC title

• G01L13/025 Primary

  using diaphragms · CPC title