Infrared sensor and infrared sensor device

Patent metadata

Field	Value
Publication number	US-10352771-B2
Application number	US-201314376343-A
Country	US
Kind code	B2
Filing date	Feb 1, 2013
Priority date	Feb 6, 2012
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

Provided are an infrared sensor and an infrared sensor device that are less susceptible to effects from the casing and lead wires, can be surface-mounted, and can measure the temperature of the object to be measured in a more accurate manner. This invention has: an insulating film; a first and a second heat sensitive element provided on the insulating film; a first and a second wiring film that are respectively connected to the heat sensitive elements; an infrared reflecting film; a terminal support body, arranged on the one face; and a plurality of mounting terminals provided to the terminal support body, wherein the mounting terminals have support convex parts protruding upward, the support convex parts are connected to the corresponding first and second wiring films, and the insulating film is supported such that a gap is provided between the terminal support body and the insulating film.

First claim

What is claimed is:

1. An infrared sensor device comprising:
a mounting substrate having a plurality of substrate-side wirings patterned on the surface thereof; and
an infrared sensor having a plurality of mounting terminals and that is mounted on the surface of the mounting substrate and to which the corresponding mounting terminals and substrate-side wirings are connected;
wherein the infrared sensor comprises:
an insulating film;
a first heat sensitive element and a second heat sensitive element provided on one face of the insulating film so as to be spaced apart from one another;
a first conductive wiring film and a second conductive wiring film that are formed on said one face of the insulating film and are respectively connected to the first heat sensitive element and the second heat sensitive element;
an infrared reflecting film provided on the other face of the insulating film so as to face the second heat sensitive element; and
a terminal support body having a through hole under the insulating film, made of a resin, arranged on the one face,
wherein the mounting terminals are built into the terminal support body, and the lower portions of the mounting terminals are disposed on the lower portion of the terminal support body,
wherein the mounting terminals extend to an upper surface of the terminal support body opposite to the insulating film and have support convex parts protruding from the upper surface to the insulating film, and the support convex parts are connected to the corresponding first and second wiring films and support the insulating film such that a first gap is provided between the terminal support body and the insulating film,
wherein the lower portions of the mounting terminals protrude downward from a bottom surface of the terminal support body,
wherein the infrared sensor is mounted on the surface of the mounting substrate such that a second gap is provided between the terminal support body and the mounting substrate, and
wherein the first gap communicates with the second gap through the through hole.

2. The infrared sensor device according to claim 1 , wherein the lower portions of the mounting terminals are provided so as to protrude below the bottom face of the terminal support body.

3. The infrared sensor device according to claim 2 , wherein the first wiring film is disposed around the first heat sensitive element and is formed to have a larger area than that of the second wiring film.

4. The infrared sensor device according to claim 1 , wherein the terminal support body is formed in a frame shape along at least the outer edge of the insulating film.

5. The infrared sensor device according to claim 4 ,
wherein the first wiring film is disposed around the first heat sensitive element and is formed to have a larger area than that of the second wiring film.

6. The infrared sensor device according to claim 1 , wherein the first wiring film is disposed around the first heat sensitive element and is formed to have a larger area than that of the second wiring film.

7. The infrared sensor device according to claim 1 , wherein a metal foil is formed on the substantially entire back face of the mounting substrate.

8. The infrared sensor device according to claim 1 , wherein the substrate-side wirings have a pair of first substrate-side wirings connected to the first wiring films and a pair of second substrate-side wirings connected to the second wiring films, the pair of first substrate-side wirings and the pair of second substrate-side wirings are set to have the same line width and thickness as each other, and the total length of the pair of first substrate-side wirings is set to be the same as that of the pair of second substrate-side wirings.

9. The infrared sensor device according to claim 1 , further comprising:
a cylindrical optical guide path member that is disposed on the surface of the mounting substrate so as to surround the infrared sensor with the cylindrical optical guide path member opened immediately above the infrared sensor.

Assignees

• Mitsubishi Materials Corp

Inventors

• Tari Kazuyoshi
• Ishikawa Mototaka
• Shirata Keiji
• Nakamura Kenzo

Classifications

• G01J5/10 Primary

  using electric radiation detectors · CPC title

• G01J5/14 Primary

  Electrical features thereof · CPC title

• G01J5/0803

  Arrangements for time-dependent attenuation of radiation signals · CPC title

• G01J5/04

  Casings · CPC title

• G01J5/0879

  Optical elements not provided otherwise, e.g. optical manifolds, holograms, cubic beamsplitters, non-dispersive prisms or particular coatings · CPC title