Scrim attachment system

US10352041B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10352041-B2
Application numberUS-201715720176-A
CountryUS
Kind codeB2
Filing dateSep 29, 2017
Priority dateOct 28, 2015
Publication dateJul 16, 2019
Grant dateJul 16, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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The present invention is directed to ceiling panels formed from a porous scrim that is coupled to an acoustical substrate using a scrim attachment system that includes an adhesive.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of forming a ceiling panel, the method comprising: a) applying an aqueous mixture comprising water and a gel-forming polymer to at least one of a first major substrate surface of an acoustical substrate or to a second major scrim surface of a porous scrim in a substantially non-discrete pattern, b) bringing the first major substrate surface of the acoustical substrate into contact with the second major scrim surface of the porous scrim to form a laminate structure; and c) drying the laminate structure to adhere the acoustical substrate and the porous scrim together; wherein the gel-forming polymer is present in an amount ranging from 1 wt. % to 20 wt. % based on the total weight of the aqueous mixture and the aqueous mixture is applied to at least one of the first major substrate surface of the acoustical substrate or the second major scrim surface of the porous scrim in an amount ranging from 30 g/m 2 to 170 g/m 2 . 2. The method of forming a ceiling panel according to claim 1 , wherein the gel-forming polymer is present in an amount ranging from 3 wt. % to 12 wt. % based on the total weight of the aqueous mixture. 3. The method of forming a ceiling panel according to claim 1 , wherein subsequent to step c) the gel-forming polymer forms a discontinuous layer between the acoustical substrate and the porous scrim. 4. The method of forming a ceiling panel according to claim 1 , wherein the aqueous mixture has a viscosity ranging from 100 cPs to 2,000 cPs at temperature ranging from 21° C. to 24° C. 5. The method of forming a ceiling panel according to claim 1 , wherein the gel-forming polymer comprises a film-forming polymer selected from the group consisting of polyvinyl alcohol (PVOH), starch polymer, polysaccharide polymer, cellulosic polymer, protein solution polymer, acrylic polymer, polymaleic anhydride, or a combination of two or more thereof. 6. The method of forming a ceiling panel according to claim 5 , wherein at least 85% of the polyvinyl alcohol has been hydrolyzed. 7. The method of forming a ceiling panel according to claim 6 , wherein at least 90% of the polyvinyl alcohol has been hydrolyzed. 8. The method of forming a ceiling panel according to claim 1 , wherein subsequent to step c), the amount of gel-forming polymer is present between the acoustical substrate and the porous scrim ranges from 4 g/m 2 to about 13 g/m 2 . 9. A method of forming a ceiling panel, the method comprising: a) applying an aqueous mixture in a non-discrete pattern to a first major surface of a substrate or a second major surface of a scrim, the aqueous mixture including water and a gel-forming polymer comprising polyvinyl alcohol, wherein at least 85% of the polyvinyl alcohol has been hydrolyzed; b) bringing the first major surface of the substrate into contact with the second major surface of the scrim to form a laminate structure; and c) drying the laminate structure to adhere the substrate and the scrim together. 10. The method of forming a ceiling panel according to claim 9 , wherein the aqueous mixture has a viscosity ranging from 100 cPs to 2,000 cPs at temperature ranging from 21° C. to 24° C. 11. The method of forming a ceiling panel according to claim 9 , wherein at least 90% of the polyvinyl alcohol has been hydrolyzed. 12. The method of forming a ceiling panel according to claim 9 , wherein subsequent to step c), the amount of gel-forming polymer is present between the acoustical substrate and the porous scrim ranges from 4 g/m 2 to about 13 g/m 2 . 13. The method of forming a ceiling panel according to claim 9 , wherein the gel-forming polymer is present in the aqueous mixture of step a) in an amount ranging from 1 wt. % to 20 wt. % based on the total weight of the aqueous mixture. 14. The method of forming a ceiling panel according to claim 13 , wherein the gel-forming polymer in the aqueous mixture of step a) is present in an amount ranging from 3 wt. % to 12 wt. % based on the total weight of the aqueous mixture. 15. The method of forming a ceiling panel according to claim 9 , wherein the gel-forming polymer comprises a film-forming polymer selected from the group consisting of polyvinyl alcohol (PVOH), starch polymer, polysaccharide polymer, cellulosic polymer, protein solution polymer, acrylic polymer, polymaleic anhydride, or a combination of two or more thereof. 16. The method of forming a ceiling panel according to claim 9 , wherein subsequent to step c) the gel-forming polymer forms a discontinuous layer between the acoustical substrate and the porous scrim. 17. The method of forming a ceiling panel according to claim 9 , wherein the aqueous mixture of step a) is applied in an amount ranging from 30 g/m 2 to 170 g/m 2 .

Assignees

Inventors

Classifications

  • E04B9/04Primary

    comprising slabs, {panels,} sheets or the like · CPC title

  • E04B9/045Primary

    being laminated · CPC title

  • comprising extruded supporting beams · CPC title

  • with inverted T-shaped cross-section · CPC title

  • slab-shaped · CPC title

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Frequently asked questions

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What does patent US10352041B2 cover?
The present invention is directed to ceiling panels formed from a porous scrim that is coupled to an acoustical substrate using a scrim attachment system that includes an adhesive.
Who is the assignee on this patent?
Armstrong World Ind Inc, Awi Licensing Llc
What technology area does this patent fall under?
Primary CPC classification E04B9/04. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Jul 16 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).