Curable organosilicon resin composition

US10351703B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10351703-B2
Application numberUS-201715608151-A
CountryUS
Kind codeB2
Filing dateMay 30, 2017
Priority dateJul 8, 2016
Publication dateJul 16, 2019
Grant dateJul 16, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R 1 SiO 3/2 unit, 30 to 80 mol % of an (R 2 ) 2 SiO 2/2 unit, and 1 to 30 mol % of an (R 3 ) 3 SiO 1/2 unit. At least a part of the (R 2 ) 2 SiO 2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curable organosilicon resin composition comprising; (A) an organopolysiloxane having a resin structure comprising 10 to 60 mol % of an R 1 SiO 3/2 unit, 30 to 80 mol % of an (R 2 ) 2 SiO 2/2 unit, and 1 to 30 mol % of an (R 3 ) 3 SiO 1/2 unit, wherein at least a part of the (R 2 ) 2 SiO 2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80, wherein each of R 1 and R 3 independently represents any of a hydrogen atom, a hydroxy group, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted aryl group having 6 to 10 carbon atoms, and a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms; each R 2 independently represents any of a hydrogen atom, a hydroxy group, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted aryl group having 6 to 10 carbon atoms, and a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, and among the whole R 2 s, 40 to 100 mol % is a methyl group; the organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms of the organopolysiloxane is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms of the organopolysiloxane is 1.0 mol/100 g or less; further comprising an organosilicon compound shown by the following formula (1), or its ring-opening polymer as a component (C), wherein “p”, “q”, and “r” each represents an integer of 0 to 4, and p+q+r=3 or 4; wherein the curable organosilicon resin composition is in a liquid state at 25° C. 2. The curable organosilicon resin composition according to claim 1 , wherein the organopolysiloxane does not contain an alkoxy group. 3. The curable organosilicon resin composition according to claim 1 , further comprising a condensation catalyst as a component (B). 4. The curable organosilicon resin composition according to claim 2 , further comprising a condensation catalyst as a component (B). 5. The curable organosilicon resin composition according to claim 1 , further comprising a fluorescent substance as a component (D). 6. The curable organosilicon resin composition according to claim 2 , further comprising a fluorescent substance as a component (D). 7. The curable organosilicon resin composition according to claim 3 , further comprising a fluorescent substance as a component (D). 8. The curable organosilicon resin composition according to claim 4 , further comprising a fluorescent substance as a component (D).

Assignees

Inventors

Classifications

  • containing silicon bound to oxygen-containing groups · CPC title

  • C08G77/18Primary

    to alkoxy or aryloxy groups · CPC title

  • containing silicon bound to oxygen-containing groups (C09D183/12 takes precedence) · CPC title

  • Siloxanes having aromatic substituents, e.g. phenyl side groups · CPC title

  • Block-or graft-polymers containing polysiloxane sequences (polymerising aliphatic unsaturated monomers on to a polysiloxane C08F283/12) · CPC title

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What does patent US10351703B2 cover?
A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R 1 SiO 3/2 unit, 30 to 80 mol % of an (R 2 ) 2 SiO 2/2 unit, and 1 to 30 mol % of an (R 3 ) 3 SiO 1/2 unit. At least a part of the (R 2 ) 2 SiO 2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organ…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification C08G77/18. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 16 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).