Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Patent metadata

Field	Value
Publication number	US-10349568-B2
Application number	US-201414485504-A
Country	US
Kind code	B2
Filing date	Sep 12, 2014
Priority date	Mar 4, 2004
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

According to certain aspects, a circuit board panel includes a first module circuit board and a second module circuit board arranged to define a space that runs between a first portion of the periphery of the first module circuit board and a portion of the periphery of the second module circuit board; and a plurality of shield components each extending across the space and including a first conductive portion mounted along the first portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the second module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and second module circuit boards, respectively.

First claim

What is claimed is:

1. An overmolded electronic module comprising:
a module circuit board;
at least one electronic component mounted on the module circuit board;
a plurality of shield components mounted on the module circuit board, each shield component dimensioned to be at least as high as a top portion of the at least one electronic component, arranged along a periphery of the module circuit board to electromagnetically shield the at least one electronic component, and including a conductive portion being in electrical contact with a surface of the electronic module, at least some of the plurality of shield components having cut surfaces resulting from being cut along a saw street defined by the shield components after being mounted on the circuit board;
an overmold material at least partially encapsulating the at least one electronic component and the plurality of shield components; and
a top conductive shield electrically coupled to exposed conductive portions of the plurality of shield components.

2. The overmolded electronic module of claim 1 wherein the overmold material includes a polymer resin.

3. The overmolded electronic module of claim 1 wherein the overmold material defines an upper surface resulting from removal of material to yield the exposed conductive portions.

4. The overmolded electronic module of claim 1 wherein the top conductive shield includes a conductive layer on the upper surface of the overmold material.

5. The overmolded electronic module of claim 4 wherein the conductive layer includes at least one of conductive paint, conductive epoxy, and metal deposition layer.

6. The overmolded electronic module of claim 1 wherein the overmolded electronic module is one of: a radio frequency module, a power amplifier module, a transmit front-end module, a voltage-controlled oscillator, and a radio frequency mixer.

7. A portable electronic device comprising:
one or more overmolded electronic modules, each of the overmolded electronic modules including a module circuit board, at least one electronic component mounted on the module board, and a plurality of shield components mounted on the module circuit board, each shield component dimensioned to be at least as high as a top portion of the at least one electronic component, arranged along a periphery of the module circuit board to electromagnetically shield the at least one electronic component, and including a conductive portion being in electrical contact with a surface of the electronic module, at least some of the plurality of shield components having cut surfaces resulting from being cut along a saw street defined by the shield components after being mounted on the circuit board, each of the overmolded electronic modules further including an overmold material at least partially encapsulating the at least one electronic component and the plurality of shield components and a top conductive shield electrically coupled to exposed conductive portions of the plurality of shield components.

8. The portable electronic device of claim 7 wherein the overmold material includes a polymer resin.

9. The portable electronic device of claim 7 wherein the overmold material defines an upper surface resulting from removal of material to yield the exposed conductive portions.

10. The portable electronic device of claim 7 wherein the top conductive shield includes a conductive layer on the upper surface of the overmold material.

11. The portable electronic device of claim 7 wherein the portable electronic device is a cell phone.

12. The portable electronic device of claim 7 wherein the overmolded electronic module is one of a radio frequency module, a power amplifier module, a transmit front-end module, a voltage-controlled oscillator, and a radio frequency mixer.

13. A wireless device comprising:
one or more overmolded electronic modules, each of the overmolded electronic modules including a module circuit board, at least one electronic component mounted on the module board, and a plurality of shield components mounted on the module circuit board, each shield component dimensioned to be at least as high as a top portion of the at least one electronic component, arranged along a periphery of the module circuit board to electromagnetically shield the at least one electronic component, and including a conductive portion being in electrical contact with a surface of the electronic module, each of the overmolded electronic modules further including an overmold material at least partially encapsulating the at least one electronic component and the plurality of shield components and a top conductive shield electrically coupled to exposed conductive portions of the plurality of shield components.

14. The wireless device of claim 13 wherein the overmold material includes a polymer resin.

15. The wireless device of claim 13 wherein the overmold material defines an upper surface resulting from removal of material to yield the exposed conductive portions.

16. The wireless device of claim 13 wherein the top conductive shield includes a conductive layer on the upper surface of the overmold material.

17. The wireless device of claim 13 wherein the overmolded electronic module is one of a radio frequency module, a power amplifier module, a transmit front-end module, a voltage-controlled oscillator, and a radio frequency mixer.

Assignees

• Skyworks Solutions Inc

Inventors

• Thompson Philip H
• Pottebaum Larry D

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W42/20 Primary

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title