Medical apparatus and X-ray high voltage apparatus

Patent metadata

Field	Value
Publication number	US-10349507-B2
Application number	US-201414263173-A
Country	US
Kind code	B2
Filing date	Apr 28, 2014
Priority date	Sep 11, 2012
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

A medical apparatus includes a power device, a temperature sensor, a conversion processing unit and a prediction time period calculation unit. The temperature sensor detects temperature data. The conversion processing unit refers to temperature data obtained by the temperature sensor in a table in which at least one of temperature data for inside a case covering the power device and temperature data for a wire bonded to the power device is associated with data of actually measured temperatures, and obtains at least one of the temperature data for inside the case and the temperature data for the wire. The prediction time period calculation unit calculates a prediction time period until a failure of the power device based on the obtained temperature data.

First claim

What is claimed is:

1. A medical apparatus, comprising:
an X-ray tube configured to emit an X-ray;
an X-ray high voltage apparatus configured to apply X-ray high voltage to the X-ray tube;
a power device;
a temperature sensor configured to detect a temperature while the X-ray high voltage apparatus applies the high voltage to the X-ray tube;
processing circuitry configured to
refer, using the detected temperature, to a table in which at least one of a case temperature for inside a case covering the power device and a wire temperature for a wire bonded to the power device is associated with data of actually detected temperatures, and obtain at least one of the case temperature and the wire temperature; and
calculate a prediction time period until a failure of the power device based on the obtained temperature data,

wherein the processing circuitry is further configured to
calculate a cycle count for each temperature amplitude of a plurality of temperature amplitudes using a rainflow counting algorithm that takes as the temperature amplitude a temperature change from one temperature peak value to another temperature peak value of the obtained at least one of the case temperature and the wire temperature,
calculate a cumulative damage value based on the plurality of temperature amplitudes and cycle counts corresponding to the plurality of temperature amplitudes, respectively, and
calculate the prediction time period based on the cumulative damage value.

2. The medical apparatus according to claim 1 , wherein the processing circuitry is further configured to:
compare the prediction time period and a threshold value; and
output when the prediction time period is less than the threshold value, information to that effect.

3. The medical apparatus according to claim 2 , wherein the processing circuitry is further configured to cause a display device to display information indicating that the prediction time period is less than the threshold value, or to transmit such information to an external apparatus through a communication line.

4. The medical apparatus according to claim 1 , wherein the processing circuitry is further configured to:
compare the prediction time period and a threshold value; and
change an operating condition of the power device when the prediction time period is less than the threshold value.

5. The medical apparatus according to claim 1 , wherein the processing circuitry is further configured to calculate the cumulative damage value using a rainflow-counting algorithm as the cycle counting algorithm.

6. An X-ray high voltage apparatus, comprising:
a power device;
a temperature sensor configured to detect a temperature while the X-ray high voltage apparatus applies a high voltage to an X-ray tube;
processing circuitry configured to
refer, using the detected temperature data obtained by the temperature sensor, to a table in which at least one of a case temperature for inside a case covering the power device and a wire temperature for a wire bonded to the power device is associated with data of actually detected temperatures, and obtain at least one of the case temperature and the wire temperature; and
calculate a prediction time period until a failure of the power device based on the obtained temperature data,

wherein the processing circuitry is further configured to
calculate a cycle count for each temperature amplitude of a plurality of temperature amplitudes using a rainflow counting algorithm that takes as the temperature amplitude a temperature change from one temperature peak value to another temperature peak value of the obtained at least one of the case temperature and the wire temperature,
calculate a cumulative damage value based on the plurality of temperature amplitudes and cycle counts corresponding to the plurality of temperature amplitudes, respectively and
calculate the prediction time period based on the cumulative damage value.

7. The X-ray high voltage apparatus according to claim 6 , wherein the processing circuitry is further configured to:
compare the prediction time period and a threshold value; and
output when the prediction time period is less than the threshold value, information to that effect.

8. The X-ray high voltage apparatus according to claim 7 , wherein
the processing circuitry is further configured to cause a display device to display information indicating that the prediction time period is less than the threshold value, or to transmit such information to an external apparatus through a communication line.

9. The X-ray high voltage apparatus according to claim 6 , wherein the processing circuitry is further configured to:
compare the prediction time period and a threshold value; and
change an operating condition of the power device when the prediction time period is less than the threshold value.

10. The X-ray high voltage apparatus according to claim 6 , wherein the processing circuitry is further configured to calculate the cumulative damage value using a rainflow-counting algorithm as the cycle counting algorithm.

Assignees

• Toshiba Medical Sys Corp

Inventors

• Ishiyama Fumio
• Hirohata Kenji

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title