Light emitting device package and light system including the same

US10347803B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10347803-B2
Application numberUS-201514931140-A
CountryUS
Kind codeB2
Filing dateNov 3, 2015
Priority dateNov 10, 2014
Publication dateJul 9, 2019
Grant dateJul 9, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light emitting device package may include a package body, a light emitting device on the package body, a first molding member that surrounds the light emitting device, and a second molding member having a hemi-spherical structure to surround the first molding member. The molding member includes a viscous material.

First claim

Opening claim text (preview).

What is claimed is: 1. A light emitting device package comprising: a body part including a cavity having a bottom surface and an internal lateral side; a first electrode and a second electrode on the body part; a light emitting device provided on a bottom surface of the body part and electrically connected with the first electrode and the second electrode; a molding member provided in the cavity of the body part to surround the light emitting device; and a lens member on the body part, wherein the lens member has an air trap part, wherein the air trap part is a groove formed in a bottom surface of the lens member and above a top surface of the molding member, wherein the air trap part is disposed on the outer periphery of the upper surface of the molding member, wherein the groove of the air trap part is vertically formed in an area of the lens member provided at a circumference of the cavity of the body part, and wherein the air trap part does not vertically overlap the light emitting device. 2. The light emitting device package of claim 1 , wherein the groove is vertically formed in an area of the lens member arranged at the circumference of the cavity of the body part. 3. The light emitting device package of claim 1 , wherein the groove is formed in the bottom surface of the lens member corresponding to the circumference of the cavity of the body part. 4. The light emitting device package of claim 1 , wherein the lens member has a bottom surface to cover the cavity of the body part. 5. The light emitting device package of claim 1 , wherein an upper portion of the lens member has a dome shape. 6. The light emitting device package of claim 1 , wherein the molding member includes a liquid-phase material or gel-phase material. 7. The light emitting device package of claim 1 , wherein the molding member includes a silicon or epoxy. 8. The light emitting device package of claim 1 , wherein the molding member has the refractive index in the range of 1.2 to 1.7. 9. The light emitting device package of claim 1 , wherein the groove of the air trap part is formed in the bottom surface of the lens member corresponding to the circumference of the cavity of the body part. 10. The light emitting device package of claim 9 , wherein the air trap part is provided along the circumference of the cavity of the body part and away from a light extraction path of the light emitting device. 11. The light emitting device package of claim 10 , wherein the filling agent includes at least one of Al 2 O 3 or TiO 2 . 12. The light emitting device package of claim 9 , wherein the molding member includes a filling agent.

Assignees

Inventors

Classifications

  • Lighting devices intended to be free-standing (F21S9/00, F21S10/00, {F21S13/12} take precedence {lighting devices specially adapted to be transported from place to place, e.g. lighting devices carried on wheeled supports F21L; details of supports for lighting devices F21V21/00}) · CPC title

  • between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

  • characterised by arrangements for sealing or adhesion · CPC title

  • Encapsulations, e.g. protective coatings · CPC title

  • Forming coatings · CPC title

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Frequently asked questions

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What does patent US10347803B2 cover?
A light emitting device package may include a package body, a light emitting device on the package body, a first molding member that surrounds the light emitting device, and a second molding member having a hemi-spherical structure to surround the first molding member. The molding member includes a viscous material.
Who is the assignee on this patent?
Lg Innotek Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01L33/54. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 09 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).