Polishing apparatus for detecting abnormality in polishing of a substrate

Patent metadata

Field	Value
Publication number	US-10343252-B2
Application number	US-201715654594-A
Country	US
Kind code	B2
Filing date	Jul 19, 2017
Priority date	Sep 24, 2012
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

An apparatus for detecting an abnormality in polishing of an edge portion of a substrate is provided. The apparatus includes: a substrate holder configured to rotate the substrate; a pressing device configured to press a polishing tool against the edge portion of the substrate to polish the edge portion; a measuring device configured to measure a position of the polishing tool relative to a surface of the substrate; and a controller configured to determine an amount of polishing of the substrate from the position of the polishing tool, calculate a polishing rate from the amount of polishing of the substrate, and judge that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.

First claim

What is claimed is:

1. An apparatus for detecting an abnormality in polishing of an edge portion of a substrate, said apparatus comprising:
a substrate holder configured to rotate the substrate;
a pressing device configured to press a polishing tool against the edge portion of the substrate to polish the edge portion;
a measuring device configured to measure a position of the polishing tool relative to a surface of the substrate; and
a controller configured to determine an amount of polishing of the substrate from the position of the polishing tool, calculate a polishing rate from the amount of polishing of the substrate, and judge whether or not an abnormality in polishing of the edge portion of the substrate has occurred, the abnormality occurring if a number of times the polishing rate goes beyond a predetermined range reaches a predetermined number.

2. The apparatus according to claim 1 , wherein the controller is configured to terminate polishing of the edge portion of the substrate if the abnormality in polishing of the edge portion of the substrate is judged to have occurred.

3. The apparatus according to claim 1 , wherein the controller is configured to generate an alarm if the abnormality in polishing of the edge portion of the substrate is judged to have occurred.

4. The apparatus according to claim 1 , wherein the polishing tool is a polishing tape.

5. The apparatus according to claim 1 , wherein the polishing tool is a fixed abrasive.

6. The apparatus according to claim 1 , wherein the pressing device is configured to increase a pressure to be applied from the polishing tool to a subsequent substrate if the polishing rate is lower than the predetermined range.

7. The apparatus according to claim 1 , wherein the substrate holder is configured to increase a rotational speed of a subsequent substrate if the polishing rate is lower than the predetermined range.

8. An apparatus for detecting an abnormality in polishing of a substrate, said apparatus comprising:
a substrate holder configured to rotate the substrate;
a pressing device configured to press a polishing tool against an edge portion of the substrate in a direction perpendicular to a surface of the substrate to polish the edge portion to form a horizontal surface which is parallel to the surface of the substrate and a vertical surface which is perpendicular to the surface of the substrate, the surface of the substrate being located more inwardly than the edge portion;
a measuring device configured to measure a position of the polishing tool relative to the surface of the substrate; and
a controller configured to determine an amount of polishing of the substrate from the position of the polishing tool, calculate a polishing rate from the amount of polishing of the substrate, and judge whether or not an abnormality in polishing of the edge portion of the substrate has occurred, the abnormality occurring if the polishing rate is out of a predetermined range, the occurrence of the abnormality indicating a non-flatness of the vertical surface.

9. The apparatus according to claim 8 , wherein the controller is configured to terminate polishing of the edge portion of the substrate if the abnormality in polishing of the edge portion of the substrate is judged to have occurred.

10. The apparatus according to claim 8 , wherein the controller is configured to generate an alarm if the abnormality in polishing of the edge portion of the substrate is judged to have occurred.

11. The apparatus according to claim 8 , wherein the polishing tool is a polishing tape.

12. The apparatus according to claim 8 , wherein the polishing tool is a fixed abrasive.

13. The apparatus according to claim 8 , wherein the pressing device is configured to increase a pressure to be applied from the polishing tool to a subsequent substrate if the polishing rate is lower than the predetermined range.

14. The apparatus according to claim 8 , wherein the substrate holder is configured to increase a rotational speed of a subsequent substrate if the polishing rate is lower than the predetermined range.

Assignees

• Ebara Corp

Inventors

• Togawa Tetsuji
• Seki Masaya
• Takenaka Hiroyuki

Classifications

• B24B9/065

  of thin, brittle parts, e.g. semiconductors, wafers · CPC title

• B24B21/002

  for grinding edges or bevels · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title