Rack mount-type information processing apparatus and rack mount-type information processing system

Patent metadata

Field	Value
Publication number	US-10342164-B2
Application number	US-201715725319-A
Country	US
Kind code	B2
Filing date	Oct 5, 2017
Priority date	Nov 4, 2016
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.

First claim

What is claimed is:

1. A rack mount-type information processing apparatus comprising:
a plurality of slots, into which a plurality of electronic devices is inserted, respectively;
a liquid-cooled element provided in a cooling target included in each of the plurality of electronic devices, a liquid coolant to cool the cooling target being circulated in the liquid-cooled element;
a manifold pipe extending in a direction where the slots are arranged; and
a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots,
the liquid-cooled element is connected to a first connection pipe that supplies the liquid coolant to the liquid-cooled element, and a second connection pipe that discharges the liquid coolant from the liquid-cooled element, among the plurality of connection pipes.

2. The apparatus according to claim 1 , wherein the liquid-cooled element are provided as a plurality of liquid-cooled elements in the cooling target, and
the plurality of connection pipes are connected to the liquid-cooled elements, respectively.

3. The apparatus according to claim 1 , wherein the liquid-cooled element are provided as a plurality of liquid-cooled elements in the cooling target, and
each of the plurality of liquid-cooled elements is connected to a first connection pipe that supplies the liquid coolant to the liquid-cooled element, and a second connection pipe that discharges the liquid coolant from the liquid-cooled element, among the plurality of connection pipes.

4. The apparatus according to claim 1 , wherein the plurality of slots are provided in a plurality of rows, and
the plurality of connection pipes are coupled to a first electronic device in a first slot of one row of the plurality of rows and a second electronic device in a second slot of another row of the plurality of rows.

5. The apparatus according to claim 4 , wherein the manifold pipe is disposed between one of the plurality of rows and another of the plurality of rows.

6. A rack mount-type information processing system comprising:
a rack mount-type information processing apparatus having a plurality of slots, into which a plurality of electronic devices is inserted, respectively;
a coolant circulation device configured to supply a liquid coolant to the rack mount-type information processing apparatus; and
a pipe configured to interconnect the rack mount-type information processing apparatus and the coolant circulation device,
the rack mount-type information processing apparatus includes:
a liquid-cooled element provided in a cooling target included in each of the plurality of electronic devices, the liquid coolant to cool the cooling target being circulated in the liquid-cooled element;
a manifold pipe extending in a direction where the slots are arranged; and
a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots,
the liquid-cooled element is connected to a first connection pipe that supplies the liquid coolant to the liquid-cooled element, and a second connection pipe that discharges the liquid coolant from the liquid-cooled element, among the plurality of connection pipes.

7. The system according to claim 6 , wherein the liquid-cooled element are provided as a plurality of liquid-cooled elements in the cooling target, and
the plurality of connection pipes are connected to the liquid-cooled elements, respectively.

8. The system according to claim 6 , wherein the liquid-cooled element are provided as a plurality of liquid-cooled elements in the cooling target, and
each of the plurality of liquid-cooled elements is connected to a first connection pipe that supplies the liquid coolant to the liquid-cooled element, and a second connection pipe that discharges the liquid coolant from the liquid-cooled element, among the plurality of connection pipes.

9. The system according to claim 6 , wherein the plurality of slots are provided in a plurality of rows, and the plurality of connection pipes are coupled to a first electronic device in a first slot of one row of the plurality of rows and a second electronic device in a second slot of another row of the plurality of rows.

10. The system according to claim 9 , wherein the manifold pipe is disposed between one of the plurality of rows and another of the plurality of rows.

11. The apparatus according to claim 4 , wherein the first electronic device of the first slot and the second electronic device of the second slot share the manifold pipe.

12. The system according to claim 9 , wherein the first electronic device of the first slot and the second electronic device of the second slot share the manifold pipe.

13. The apparatus according to claim 1 , wherein the plurality of connection pipes are configured to directly interconnect the liquid-cooled element and the manifold pipe.

14. The system according to claim 6 , wherein the plurality of connection pipes are configured to directly interconnect the liquid-cooled element and the manifold pipe.

Assignees

• Fujitsu Ltd

Inventors

• So Tsuyoshi
• Aizawa Osamu
• Hirai Keita
• Nakagawa Koji
• Uzuka Yoshinori
• Aoki Nobumitsu
• Kosugi Naofumi

Classifications

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20781

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