Sensing system and method
US-2017138922-A1 · May 18, 2017 · US
US10342136B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10342136-B2 |
| Application number | US-201715711689-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 21, 2017 |
| Priority date | Sep 23, 2016 |
| Publication date | Jul 2, 2019 |
| Grant date | Jul 2, 2019 |
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A monitoring device includes a substrate having a circuit trace disposed thereon and a circuit carrier having a recessed portion. The substrate includes a flexible flange portion having a component disposed thereon. The substrate is disposed on the circuit carrier such that the flange portion and the component are disposed in the recessed portion.
Opening claim text (preview).
We claim: 1. A monitoring device, comprising: a substrate having a circuit trace disposed thereon, wherein the substrate includes a flexible flange portion including a living hinge and wherein the flexible flange portion has a component disposed thereon; and a circuit carrier that includes a recessed portion; wherein the substrate is disposed on the circuit carrier such that the flange portion and the component are disposed in the recessed portion. 2. The monitoring device of claim 1 , further including a protective covering disposed on top of the substrate and an actuator disposed on the substrate, wherein the actuator may be manually actuated through the protective covering. 3. The monitoring device of claim 2 , wherein the protective covering includes first edge portions, the circuit carrier includes second edge portions, and the first edge portions are affixed to the second edge portions. 4. The monitoring device of claim 3 , wherein the protective covering and the circuit carrier are affixed to one another such that the interior of the monitoring device is substantially impermeable to liquids. 5. The monitoring device of claim 3 , wherein the protective covering and the circuit carrier encase the substrate. 6. The monitoring device of claim 1 , wherein the substrate comprises a first substrate and further including a second substrate, wherein the second substrate includes indicia on a surface thereof, the second substrate is disposed between the substrate and the protective covering, and the indicia are visible through the protective covering. 7. The monitoring device of claim 1 , wherein the circuit carrier includes a plurality of protrusions that protrude outwardly away from the substrate. 8. The monitoring device of claim 7 , wherein each of the plurality of protrusions is frustum shaped and includes a flat portion. 9. The monitoring device of claim 8 , wherein the substrate comprises a first substrate and further including an adhesive and a second substrate, wherein the adhesive secures the second substrate to the flat portion of at least one of the protrusions. 10. The monitoring device of claim 1 , wherein the component is a battery. 11. The monitoring device of claim 1 , wherein the substrate includes a top surface opposite a bottom surface, and the component includes a top surface opposite a bottom surface, wherein a portion of the bottom surface of the substrate contacts the circuit carrier, a bottom surface of the component contacts the flange, and the top surface of the component does not substantially extend outwardly from the top surface of the substrate. 12. The monitoring device of claim 11 , further including a connector that electrically couples the top surface of the component with the circuit trace. 13. The monitoring device of claim 12 , wherein a portion of the connector is disposed over the flange and includes a top surface opposite a bottom surface, the bottom surface of such portion of the connector is in contact with the top surface of the component, and a top surface of such portion of the connector does not substantially extend outwardly beyond the top surface of the substrate. 14. The monitoring device of claim 1 , wherein the flange portion is defined by a plurality of slits cut through the substrate and partially surrounds the component disposed on the flange portion. 15. The monitoring device of claim 14 , further including a hinge that connects the flange portion to the substrate.
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Physical layout of the record carrier · CPC title
associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title
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