Assembly

Patent metadata

Field	Value
Publication number	US-10342117-B2
Application number	US-201715724336-A
Country	US
Kind code	B2
Filing date	Oct 4, 2017
Priority date	Apr 10, 2015
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

The invention relates to an electrical assembly having a printed circuit board and having a component. The component can be, in particular, an electromechanical component, such as an electrical switching contact, an electrical switch, a relay or the like. The component is electrically and/or mechanically connected to the printed circuit board. A fork-shaped element is arranged between the component and the printed circuit board for the purpose of electrically and/or mechanically connecting the component to the printed circuit board.

First claim

The invention claimed is:

1. An assembly comprising a first subassembly, a second subassembly and an adapter part, wherein the first subassembly is electrically and/or mechanically connected to the second subassembly, wherein the adapter part is arranged between the first subassembly and the second subassembly for the purpose of electrically and/or mechanically connecting the first subassembly to the second subassembly, and wherein the adapter part is a fork-shaped element having a base area from which four fork-shaped prongs extend, with each of the four fork-shaped prongs being secured to the first subassembly, and the base area being secured to the second subassembly such that forces acting between the two subassemblies are absorbed by the adapter part.

2. The assembly as claimed in claim 1 , wherein the first subassembly is a printed circuit board, wherein the second subassembly is a component, and wherein the component is electrically and/or mechanically connected to the printed circuit board.

3. The assembly as claimed in claim 1 , wherein the base area is one of screwed, riveted, welded, or soldered to the second subassembly.

4. The assembly as claimed in claim 1 , wherein each of the four fork-shaped prongs is soldered to the first subassembly, which is a printed circuit board, and wherein electrical contact points are provided on the printed circuit board for the soldering.

5. The assembly as claimed in claim 4 , wherein the printed circuit board is a high-current printed circuit board having solid copper elements embedded in the printed circuit board for the purpose of conducting a high current.

6. The assembly as claimed in claim 1 , wherein the four fork-shaped prongs extend from the base area in an approximately perpendicular manner, wherein the base area has an approximately rectangular shape in a plan view, wherein the four fork-shaped prongs are arranged at the sides of the rectangular base area, and wherein the four fork-shaped prongs are secured to electrical contact points.

7. The assembly as claimed in claim 1 , wherein the base area is secured to the second subassembly, which is a component.

8. The assembly as claimed in claim 1 , wherein a connection part protrudes from the base area, in a direction opposite to the four fork-shaped prongs with respect to the base area, and wherein the connection part is secured to the second subassembly.

9. The assembly as claimed in claim 1 , wherein the fork-shaped element is produced from sheet metal as a stamped and bent part.

10. The assembly as claimed in claim 2 , wherein the component is an electromechanical component selected from one of an electrical switching contact, an electrical switch and a relay, and wherein the assembly is an electrical assembly.

11. The assembly as claimed in claim 8 , wherein the second subassembly is a component.

Assignees

• Marquardt Gmbh

Inventors

• Hamma Andreas
• Thum Christian
• Ebner Guenter

Classifications

• H05K2201/10083

  Electromechanical or electro-acoustic component, e.g. microphone · CPC title

• H05K3/301 Primary

  by means of a mounting structure (H05K3/325 takes precedence) · CPC title

• H05K2201/10053

  Switch · CPC title

• H01R4/34

  Conductive members located under head of screw · CPC title

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title