Light emitting diode component

Patent metadata

Field	Value
Publication number	US-10340424-B2
Application number	US-201314062169-A
Country	US
Kind code	B2
Filing date	Oct 24, 2013
Priority date	Aug 30, 2002
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

First claim

The invention claimed is:

1. A lighting device comprising: at least one solid state light emitter, said solid state light emitter having an illumination surface; and at least one luminescent element, said luminescent element comprising at least one luminescent material, said luminescent element being spaced from said solid state light emitter by a distance which is at least two times the length of the solid state light emitter, said lighting device having a package efficiency of greater than 70%.

2. The lighting device as recited in claim 1 , wherein said solid state light emitter is a light emitting diode chip or laser.

3. The lighting device of claim 2 wherein the light emitting diode chip or laser is a blue light emitting chip or a UV light emitting chip.

4. The lighting device as recited in claim 1 , wherein said luminescent element having a luminescent element surface, said luminescent element surface being at least ten times as large as said illumination surface.

5. A lighting device as recited in claim 1 , wherein said illumination surface is substantially planar.

6. A lighting device as recited in claim 1 , wherein said luminescent element surface is substantially planar.

7. A lighting device as recited in claim 1 , wherein said luminescent element comprises an encapsulant in which a luminescent material is contained.

8. A lighting device as recited in claim 7 , wherein said encapsulant comprises a plastic material.

9. A lighting device as recited in claim 8 , wherein said plastic has been cured.

10. A lighting device as recited in claim 1 , wherein said at least one luminescent material comprises at least one phosphor.

11. A lighting device as recited in claim 1 , wherein said luminescent element comprises particles of luminescent material, said particles of luminescent material having an average particle size of between 3 and 30 microns.

12. The lighting device of claim 1 wherein the at least one luminescent element is in the form of a hemisphere.

13. The lighting device of claim 1 wherein the at least one luminescent element is in the form of a sphere.

14. The lighting device of claim 1 wherein the at least one luminescent element is in the form of a planar surface.

15. The lighting device of claim 1 wherein the at least one luminescent element is in the form of an elongated semi-cylinder.

16. The lighting device of claim 1 wherein the at least one luminescent element is in the form of a prolate hemispheroid.

17. The lighting device of claim 1 wherein the lighting device has a package efficiency of greater than 90%.

18. The lighting device of claim 1 further comprising a printed circuit board supporting the at least one solid state light emitter and including printed circuitry connecting with the at least one solid state light emitter to enable electrically energizing the at least one solid state light emitter.

19. The lighting device of claim 18 wherein the printed circuit board comprises a reflective surface.

20. The lighting device of claim 19 wherein the printed circuit board, the reflective surface and the at least one luminescent element are dimensioned and arranged respective the at least one solid state light emitter such that most of the light scattered back from the luminescent element strikes the reflective surface or the luminescent element.

21. The lighting apparatus of claim 19 further comprising a second reflecting surface surrounding the perimeter of the at least one solid state light emitter wherein the second reflecting surface includes reflecting sidewalls extending from the support surface to the luminescent element.

22. The lighting apparatus of claim 21 wherein the first reflecting surface, the second reflecting surface and the luminescent element are arranged in respect to the at least one solid state light emitter to form a light mixing chamber.

23. A lighting device comprising: at least one solid state light emitter; and at least one luminescent element, said luminescent element comprising at least one luminescent material, said luminescent element being spaced from said solid state light emitter, said solid state light emitter having an illumination surface facing said luminescent element, said luminescent element having a luminescent element surface facing said solid state light emitter, said luminescent element surface being at least ten times as large as said illumination surface, said lighting device having a package efficiency of greater than 70%.

24. A lighting device as recited in claim 23 , wherein said luminescent element is spaced from said solid state light emitter by a distance which is at least two times the length of the solid state light emitter.

25. A lighting device as recited in claim 23 , wherein said solid state light emitter is a light emitting diode chip or laser.

26. A lighting device as recited in claim 23 , wherein said illumination surface is substantially planar.

27. A lighting device as recited in claim 23 , wherein said luminescent element surface is substantially planar.

28. A lighting device as recited in claim 23 , wherein said luminescent element comprises an encapsulant in which a luminescent material is contained.

29. A lighting device as recited in claim 28 , wherein said encapsulant comprises a plastic material.

30. A lighting device as recited in claim 29 , wherein said plastic material has been cured.

31. A lighting device as recited in claim 23 , wherein said at least one luminescent material comprises at least one phosphor.

32. The lighting device of claim 23 wherein the at least one luminescent element is in the form of a hemisphere.

33. The lighting device of claim 23 wherein the at least one luminescent element is in the form of a sphere.

34. The lighting device of claim 23 wherein the at least one luminescent element is in the form of a planar surface.

35. The lighting device of claim 23 wherein the at least one luminescent element is in the form of an elongated semi-cylinder.

36. The lighting device of claim 23 wherein the at least one luminescent element is in the form of a prolate hemispheroid.

37. The lighting device of claim 23 wherein the lighting device has a package efficiency of greater than 90%.

38. The lighting device of claim 23 further comprising a printed circuit board supporting the at least one solid state light emitter and including printed circuitry connecting with the at least one light emitting die to enable electrically energizing the at least one solid state light emitter.

39. The lighting device of claim 38 wherein the printed circuit board comprises a reflective surface.

40. A lighting device comprising: at least one solid state light emitter; and at least one luminescent element, said luminescent element comprising at least one luminescent material, said luminescent element being spaced from said solid state light emitter, said solid state light emitter having an Illumination surface facing said luminescent element, said luminescent element having a luminescent element surface facing said solid state light emitter, said luminescent element surface being at least ten times as large as said illumination surface

Assignees

• Aanegola Srinath K
• Radkov Emil V
• Reginelli James
• Stadelman Larry R
• Mrakovich Matthew
• Stimac Tomislav J
• Ge Lighting Solutions Llc

Inventors

• Aanegola Srinath K
• Radkov Emil V
• Reginelli James
• Stadelman Larry R
• Mrakovich Matthew
• Stimac Tomislav J

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H01L33/502

  Electricity · mapped topic

• H01L2924/00014

  Electricity · mapped topic

• H01L33/44 Primary

  Electricity · mapped topic

• H01L2224/48091

  Electricity · mapped topic