Optical sensor package module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10340299-B2
Application number	US-201715701051-A
Country	US
Kind code	B2
Filing date	Sep 11, 2017
Priority date	Sep 11, 2017
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

First claim

What is claimed is:

1. An optical sensor package module comprising:
a substrate;
a sensor chip disposed on the substrate and including an array of pixels located at a top side thereof for receiving light; and
a shielding assembly disposed on the substrate and surrounding the sensor chip for limiting influx of light onto the sensor chip, wherein the shielding assembly includes a shielding element disposed on the sensor chip by an adhesive structure, and the shielding element has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light;
wherein the adhesive structure is an adhesive layer disposed between the sensor chip and the shielding element and having a through hole to expose the first subset of the pixels, the through hole corresponding to the first aperture.

2. The optical sensor package module according to claim 1 , wherein a wavelength of the corresponding light falls within a first predetermined wavelength range.

3. The optical sensor package module according to claim 2 , further comprising a first light-emitting component for emitting light of a wavelength within the first predetermined wavelength range, the first light-emitting component being disposed on the substrate.

4. The optical sensor package module according to claim 1 , further comprising a first light-emitting component disposed on the substrate, wherein the shielding assembly includes a frame disposed on the substrate, wherein the frame includes a top plate and a partition wall extending downward from the top plate for separating the sensor chip from the first light-emitting component, and the top plate has a light receiving opening in alignment with the sensor chip.

5. The optical sensor package module according to claim 4 , wherein the shielding assembly further includes a shielding structure, the shielding structure together with a part of the partition wall forming a space that accommodates the first light-emitting component.

6. The optical sensor package module according to claim 5 , wherein the shielding element has a second aperture to expose a second subset of the pixels receiving light of wavelength within a second predetermined wavelength range.

7. The optical sensor package module according to claim 6 , wherein the second predetermined wavelength range and the first predetermined wavelength range partially overlap or do not overlap.

8. The optical sensor package module according to claim 6 , wherein a size of the first aperture is different from that of the second aperture.

9. The optical sensor package module according to claim 6 , further comprising a second light-emitting component for emitting light of a wavelength within the second predetermined wavelength range, the second light-emitting component being disposed on the substrate and accommodated in the space.

10. The optical sensor package module according to claim 1 , wherein the adhesive structure has a plurality of substructures separated from each other, the substructures not covering the first subset of the pixels.

11. The optical sensor package module according to claim 1 , wherein the adhesive structure is made of a material with Young's modulus of less than 2000 MPa.

12. The optical sensor package module according to claim 1 , wherein the shielding element is a metal sheet, and a thickness of the shielding element ranges from 20 to 250 μm.

13. The optical sensor package module according to claim 1 , wherein a diameter of the first aperture ranges from 20 to 500 μm.

14. The optical sensor package module according to claim 1 , further comprising a color filter covering the first set of the pixels.

15. A manufacturing method of an optical sensor package module, comprising:
disposing a sensor chip on a substrate, the sensor chip including an array of pixels located at a top side thereof for receiving light; and
forming and disposing a shielding assembly having an aperture on the substrate to cover the sensor chip, wherein the aperture is in alignment with the sensor chip to expose at least a first subset of pixels that is configured to receive corresponding light;
wherein the step of forming the shielding assembly includes forming a shielding element having the aperture by etching or punching a metal sheet.

16. The manufacturing method of the optical sensor package module according to claim 15 , wherein the step of forming the shielding assembly includes:
forming a frame having a top plate with an light receiving opening and a partition wall extending downward from the top plate by an insert injection molding process, with the shielding element being an inserted component during the insert injection process so that a portion of the shielding element is embedded in the top plate and the other portion protrudes from the edges of the frame and defines the aperture, the edges of the frame defining the opening.

17. An optical sensor package module comprising:
a substrate;
a first light-emitting component for emitting light of a wavelength within a first predetermined wavelength range, the first light-emitting component being disposed on the substrate;
a sensor chip disposed on the substrate and including an array of pixels located at a top side thereof for receiving light; and
a shielding assembly disposed on the substrate and surrounding the sensor chip for limiting influx of light onto the sensor chip, wherein the shielding assembly includes a shielding element, a frame disposed on the substrate, and a shielding structure, the shielding element has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light, and a wavelength of the corresponding light falls within the first predetermined wavelength range;
wherein the frame includes a top plate and a partition wall extending downward from the top plate for separating the sensor chip from the first light-emitting component, the top plate has a light receiving opening in alignment with the sensor chip, and the shielding structure together with a part of the partition wall form a space that accommodates the first light-emitting component.

18. The optical sensor package module according to claim 17 , wherein the shielding element has a main portion that is embedded in the frame and a protruding portion that protrudes from edges of the frame defining the light receiving opening for limiting influx of light onto the sensor chip.

19. The optical sensor package module according to claim 17 , wherein the shielding element is disposed on the sensor chip by an adhesive structure, the adhesive structure is an adhesive layer covering the first subset of the pixels and transparent to the corresponding light of the first predetermined wavelength range.

Assignees

• Pixart Imaging Inc

Inventors

• Shen Chi-Chih
• Li Kuo-Hsiung
• Chuang Jui-Cheng

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title

• H01L27/14618 Primary

  Electricity · mapped topic

• H01L27/14685

  Electricity · mapped topic