System and methods for three-dimensional printing

US10338567B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10338567-B2
Application numberUS-201515509257-A
CountryUS
Kind codeB2
Filing dateSep 9, 2015
Priority dateSep 9, 2014
Publication dateJul 2, 2019
Grant dateJul 2, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A fast and economical system and methods directed to low-fidelity fabrication of three-dimensional (3D) objects using 3D printing. The invention facilitates rapid prototyping by providing a wireframe structure in the form of the underlying design structure of a 3D model, which may be useful for a variety of reasons including to provide a prototype preview that may be used for design validation of a 3D model.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for fabricating a wireframe structure of a 3D object on a surface comprising the steps of: providing a processor, the processor operatively connected to a controller and a print head; creating a wireframe mesh pattern of the 3D object; registering parameters of the print head, wherein the parameters include an angle of the print head defined from a horizontal axis and a diameter of the print head; calculating from the angle and the diameter a depth value defined along a vertical axis at which the print head is configured to deposit a material; defining a plane at the angle of the print head at which the print head is configured to deposit the material, the depth value and the plane defining an area for printing the wireframe structure on the surface; moving the print head along a path defined by both the wireframe mesh pattern and the parameters of the print head while extruding material; and solidifying the extruded material of a portion of the wireframe structure before continuing to extrude material of another portion of the wireframe structure of the 3D object. 2. The method according to claim 1 , wherein the material is filament material. 3. The method according to claim 2 , wherein the filament material is selected from the group consisting of: Acrylonitrile Butadiene Styrene (ABS), Polylactic Acid, Polylactide (PLA), and high-density polyethylene (HDPL). 4. The method according to claim 1 , wherein the solidifying step further comprises the step of cooling the extruded material using an air flow from one or more air jets or built-in fans attached to the print head. 5. The method according to claim 4 , wherein the solidifying step further comprises the step of pausing the print head for a period of time. 6. The method according to claim 1 , wherein the moving step further comprises the step of repeatedly moving vertically the print head. 7. The method according to claim 1 , wherein the wireframe mesh pattern is in a format selected from the group consisting of: a stereolithography (STL) format, a polygon file format, and a triangle format (PLY). 8. The method according to claim 1 , wherein the wireframe mesh pattern is a zig-zag type pattern. 9. The method according to claim 1 , wherein the method is performed up to a factor of 10 compared to traditional layer-by-layer printing. 10. The method according to claim 1 , wherein the method is implemented by a 3D printer. 11. The method according to claim 10 , wherein the 3D printer is one selected from the group consisting of: a stereolithography (SLA), a fused deposition modeling (FDM), a selective laser sintering (SLS), a selective laser melting (SLM), an electronic beam melting (EBM), a laminated object manufacturing (LOM), and a degree of freedom (DOF) printing device. 12. The method according to claim 10 , wherein the 3D printer is one selected from the group consisting of: a delta design printer and a Cartesian-based printer. 13. The method according to claim 1 , wherein the method is implemented on a device operatively connected to a 3D printer. 14. The method according to claim 1 , wherein the method further comprises the step of fabricating a solid structure of the 3D object using layer-wise printing to form a hybrid structure incorporating both the wireframe structure and the solid structure. 15. The method according to claim 1 , wherein the print head deposits the material as an overhang of up to 90°. 16. The method according to claim 1 , wherein the creating step further comprises the step of specifying each edge of the 3D object at which two mathematically continuous smooth surfaces meet. 17. The method according to claim 1 , wherein the creating step further comprises the step of connecting constituent vertices of the 3D object using straight lines or curves. 18. The method according to claim 1 , wherein the depth value of the print head is a maximum value to avoid collisions with extruded material defined by: max depth=(∅/2)tan α wherein ∅ is the diameter of the print head and α is the angle of the print head. 19. The method according to claim 1 , wherein the creating step further comprises the steps of: slicing the 3D object into segments, each segment defined by a first layer positioned from a second layer at a distance equal to the depth value; and defining the wireframe mesh pattern joining the first layer and the second layer, the wireframe mesh pattern including a support edge connected to a downward edge, the downward edge limited by the angle of the print head from the horizontal axis.

Assignees

Inventors

Classifications

  • Surface or curve machining, making three-dimensional [3D] objects, e.g. desktop manufacturing · CPC title

  • Data acquisition or data processing for additive manufacturing · CPC title

  • Data acquisition or data processing for additive manufacturing · CPC title

  • 3-D printing, layer of powder, add drops of binder in layer, new powder · CPC title

  • Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] · CPC title

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What does patent US10338567B2 cover?
A fast and economical system and methods directed to low-fidelity fabrication of three-dimensional (3D) objects using 3D printing. The invention facilitates rapid prototyping by providing a wireframe structure in the form of the underlying design structure of a 3D model, which may be useful for a variety of reasons including to provide a prototype preview that may be used for design validation …
Who is the assignee on this patent?
Univ Cornell
What technology area does this patent fall under?
Primary CPC classification G05B19/4099. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).