Ruggedized photonic crystal sensor packaging

Patent metadata

Field	Value
Publication number	US-10338328-B2
Application number	US-201815957784-A
Country	US
Kind code	B2
Filing date	Apr 19, 2018
Priority date	May 9, 2012
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

A method, system, and apparatus are disclosed for a ruggedized photonic crystal (PC) sensor packaging. In particular, the present disclosure teaches a ruggedized packaging for a photonic crystal sensor that includes of a hermetic-seal high-temperature jacket and a ferrule that eliminate the exposure of the optical fiber as well as the critical part of the photonic crystal sensor to harsh environments. The disclosed packaging methods enable photonic crystal based sensors to operate in challenging environments where adverse environmental conditions, such as electromagnetic interference (EMI), corrosive fluids, large temperature variations, and strong mechanical vibrations, currently exclude the use of traditional sensor technologies.

First claim

We claim:

1. A method for hermetically sealing a sensor chip, the method comprising:
coating the sensor chip, wherein the sensor chip is a photonic crystal (PC) sensor chip;
centering the sensor chip to a center axis of an end of a ceramic tube;
soldering the sensor chip to the end of the ceramic tube to form a sensor chip assembly;
assembling a ceramic ferrule with a fiber;
inserting the ceramic ferrule inside the ceramic tube of the sensor chip assembly;
aligning an end of the fiber to the sensor chip of the sensor chip assembly; and
soldering at least a portion of an outer surface of the ceramic ferrule to at least a portion of an inner surface of the ceramic tube of the sensor chip assembly.

2. The method of claim 1 , wherein the coating of the sensor chip is performed with a glass solder donut pattern.

3. The method of claim 2 , wherein the glass solder donut pattern matches a diameter and a wall thickness of the ceramic tube.

4. The method of claim 1 , wherein the assembling of the ceramic ferrule with the fiber is performed by soldering the fiber inside the ceramic ferrule.

5. The method of claim 1 , wherein the centering of the sensor chip to the center axis of the ceramic tube is performed by a three-axis stage tool.

6. The method of claim 1 , wherein the centering of the sensor chip to the center axis of the ceramic tube is performed by a three-axis stage and microscope.

7. The method of claim 1 , wherein the aligning of the end of the fiber to the sensor chip is performed by a three-axis stage tool.

8. The method of claim 1 , wherein the soldering of the sensor chip to the end of the ceramic tube is performed by localized thermal heating.

9. The method of claim 1 , wherein the soldering of the sensor chip to the end of the ceramic tube is performed by localized thermal heating with solder glass.

10. The method of claim 1 , wherein the soldering of the outer surface of the ceramic ferrule to the inner surface of the ceramic tube is performed by localized thermal heating.

11. The method of claim 1 , wherein the soldering of the outer surface of the ceramic ferrule to the inner surface of the ceramic tube is performed by localized thermal heating and a donut-shaped glass solder preform.

12. The method of claim 1 , wherein the fiber is a multi-mode fiber.

13. An apparatus for a hermetically sealed sensor chip, the apparatus comprising:
a sensor chip assembly comprising the sensor chip soldered to an end of a ceramic tube, wherein the sensor chip is a photonic crystal (PC) sensor chip;
a fiber; and
a ceramic ferrule, wherein the fiber is disposed inside the ceramic ferrule, the ceramic ferrule is disposed inside the ceramic tube of the sensor chip assembly, an end of the fiber is aligned with the sensor chip of the sensor chip assembly, and at least a portion of an outer surface of the ceramic ferrule is soldered to at least a portion of an inner surface of the ceramic tube of the sensor chip assembly.

14. The apparatus of claim 13 , wherein the sensor chip is soldered to the end of the ceramic tube by localized thermal heating with solder glass.

15. The apparatus of claim 13 , wherein the sensor chip is coated with a glass solder donut pattern.

16. The apparatus of claim 15 , wherein the glass solder donut pattern matches a diameter and a wall thickness of the ceramic tube.

17. The apparatus of claim 13 , wherein the sensor chip is located at a center axis of an end of the ceramic tube.

18. The apparatus of claim 13 , wherein the fiber is soldered inside the ceramic ferrule.

19. The apparatus of claim 13 , wherein the outer surface of the ceramic ferrule is soldered to the inner surface of the ceramic tube by localized thermal heating and a donut-shaped glass solder preform.

20. The apparatus of claim 13 , wherein the fiber is a multi-mode fiber.

Assignees

• Boeing Co

Inventors

• Carralero Michael A
• Chan Eric Y
• Koshinz Dennis G

Classifications

• G02B6/4225

  by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element · CPC title

• G02B6/366

  the additional structures allowing for adjustment or alignment in all dimensions, i.e. 3D microoptics arrangements, e.g. free space optics on the microbench, microhinges or spring latches, with associated microactuating elements for fine adjustment or alignment · CPC title

• G02B6/4277

  Protection against electromagnetic interference [EMI], e.g. shielding means (shielding of electric apparatus H05K9/00, of instruments G12B17/00) · CPC title

• G01D5/268

  using optical fibres (G01D5/28 - G01D5/38 take precedence) · CPC title

• G01F23/292

  Light {, e.g. infrared or ultraviolet} · CPC title