Thermal flow meter with thin resin portion sealing temperature detection element

Patent metadata

Field	Value
Publication number	US-10337899-B2
Application number	US-201715451572-A
Country	US
Kind code	B2
Filing date	Mar 7, 2017
Priority date	Jun 15, 2012
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element. A thermal flow meter 300 of the present invention includes an air flow sensing portion 602 that detects a flow rate by performing heat transfer with a measurement target gas passing through the main passage 124 using a heat transfer surface, a temperature detection element 518 that detects a temperature of the measurement target gas, a circuit package 400 obtained by connecting a processing unit 604 that processes signals of the air flow sensing portion 602 and the temperature detection element 518 to a lead and sealing the processing unit 604 using a first molding resin through a first molding process, and a housing 302 where the circuit package 400 is fixed using a second molding resin through a second molding process, wherein, in the circuit package 400, a thickness of a temperature detecting portion 452 for sealing the temperature detection element 518 is thinner than that of a package body portion 426 for sealing the processing unit 604.

First claim

The invention claimed is:

1. A thermal flow meter comprising:
a circuit package including a temperature detection element that detects a temperature of a measurement target gas and a processing unit that processes a signal of the temperature detection element, wherein the temperature detection element and the processing unit are entirely sealed with a single molding resin, and
wherein a thickness of a portion of the single molding resin sealing the temperature detection element is thinner than that of a portion of the single molding resin sealing the processing unit.

2. The thermal flow meter according to claim 1 ,
wherein the circuit package has a package body portion sealing the processing unit and a protrusion sealing the temperature detection element.

3. The thermal flow meter according to claim 2 ,
wherein the protrusion comprises a first lead, a second lead and a connection line connects the first lead and the second lead electrically, the first lead on which mounts the temperature detection element,
wherein the diameter of the connection line is smaller than the first lead and the second lead.

4. The thermal flow meter according to claim 1 ,
wherein the circuit package further comprising an air flow sensing portion that detects a flow rate of the measurement target gas, and
wherein the processing unit processes the signal from the air flow sensing portion.

5. The thermal flow meter according to claim 4 ,
wherein the molding resin seals the air flow sensing portion so that a part of the air flow sensing portion is exposed.

6. A thermal flow meter comprising:
a circuit package including a temperature detection element and a processing unit that processes a signal of the temperature detection element, wherein the temperature detection element and the processing unit are entirely sealed with a single molding resin, and
wherein the single molding portion sealing the circuit package comprises a stepped portion between a portion for sealing the temperature detection element and a portion for sealing the processing unit.

7. The thermal flow meter according to claim 6 ,
wherein the circuit package has a package body portion sealing the processing unit and a protrusion sealing the temperature detection element.

8. The thermal flow meter according to claim 7 ,
wherein the protrusion comprises a first lead, a second lead and a connection line connects the first lead and the second lead electrically, the first lead on which mounts the temperature detection element,
wherein the diameter of the connection line is smaller than the first lead and the second lead.

9. The thermal flow meter according to claim 6 ,
wherein the circuit package has a package body portion sealing the processing unit and a protrusion sealing the temperature detection element,
wherein the stepped portion is formed on the protrusion.

10. The thermal flow meter according to claim 9 ,
wherein the protrusion comprises a first lead, a second lead and a connection line connects the first lead and the second lead electrically, the first lead on which mounts the temperature detection element,
wherein the stepped portion is formed closer to the temperature detection element than the connection line.

11. The thermal flow meter according to claim 6 ,
wherein the circuit package further comprising an air flow sensing portion that detects a flow rate of the measurement target gas, and
wherein the processing unit processes the signal from the air flow sensing portion.

12. The thermal flow meter according to claim 11 ,
wherein the molding resin seals the air flow sensing portion so that a part of the air flow sensing portion is exposed.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Tokuyasu Noboru
• Tashiro Shinobu
• Hanzawa Keiji
• Kono Tsutomu

Classifications

• F02M35/1038

  for temperature or pressure · CPC title

• G01F15/02

  Compensating or correcting for variations in pressure, density or temperature · CPC title

• G01F1/6965

  comprising means to store calibration data for flow signal calculation or correction · CPC title

• G01F5/00

  Measuring a proportion of the volume flow · CPC title

• G01F15/043

  using electrical means · CPC title