Method of producing heat conductive sheet

US10336929B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10336929-B2
Application numberUS-201314404741-A
CountryUS
Kind codeB2
Filing dateJul 5, 2013
Priority dateJul 7, 2012
Publication dateJul 2, 2019
Grant dateJul 2, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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A method of producing a heat conductive sheet without using a high-cost magnetic field generator. This is achieved by allowing a large amount of a fibrous filler to be contained in a thermosetting resin composition, so that good heat conductivity is obtained without applying a load that may interfere with the normal operation of a heat generating body and a radiator to the heat generating body and the radiator when the heat conductive sheet is disposed therebetween. The method includes: a step (A) of dispersing a fibrous filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition according to an extrusion molding method or a die molding method; a step (C) of slicing the formed molded block into a sheet; and a step (D) of pressing the sliced surface of the obtained sheet.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of producing a heat conductive sheet, the method comprising: dispersing a fibrous filler in a binder resin to prepare a heat conductive sheet-forming composition; forming a molded block using the prepared heat conductive sheet-forming composition according to an extrusion molding method or a die molding method; slicing the formed molded block into a sheet; pressing a sliced surface of the obtained sheet to smooth the sliced surface; and disposing the smooth sliced surface of the sheet between a heat generating body and a heat dissipator. 2. The production method according to claim 1 , wherein carbon fibers, metal fibers, glass fibers, or ceramic fibers having an average diameter of 8 to 12 μm and an aspect ratio of 2 to 50 are used as the fibrous filler. 3. The production method according to claim 1 , wherein the binder resin is a silicone resin. 4. The production method according to claim 1 , wherein a contained amount of the fibrous filler in the heat conductive sheet-forming composition based on 100 parts by mass of the binder resin is 120 to 300 parts by mass. 5. The production method according to claim 1 , wherein a direction in which the molded block formed by an extrusion molding method is 60 to 120° with respect to a direction of extrusion. 6. The production method according to claim 1 , wherein a pressure applied to the sheet during the pressing is 1 to 8 kgf/cm 2 . 7. The production method according to claim 1 , wherein a spacer is used during the pressing, and the pressing is performed at a set pressure of 0.1 to 30 MPa. 8. The production method according to claim 1 , wherein the pressing is performed while heating at a glass transition temperature of the binder resin or higher. 9. The production method according to claim 1 , wherein the pressing is performed so that a compression ratio of the sheet is 2 to 15%. 10. The production method according to claim 1 , wherein the pressing is performed such that a glossiness of the surface of the sheet after pressing is 0.1 or higher. 11. The production method according to claim 1 , wherein the sliced surface is pressed such that a thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing.

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What does patent US10336929B2 cover?
A method of producing a heat conductive sheet without using a high-cost magnetic field generator. This is achieved by allowing a large amount of a fibrous filler to be contained in a thermosetting resin composition, so that good heat conductivity is obtained without applying a load that may interfere with the normal operation of a heat generating body and a radiator to the heat generating body …
Who is the assignee on this patent?
Dexerials Corp
What technology area does this patent fall under?
Primary CPC classification C09K5/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).