Electronic gaming die

Patent metadata

Field	Value
Publication number	US-10335673-B2
Application number	US-201815876084-A
Country	US
Kind code	B2
Filing date	Jan 19, 2018
Priority date	Jul 11, 2013
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

First claim

What is claimed is:

1. An electronic gaming die comprising:
an enclosure having N sides where N is equal to or greater than 4;
a flexible substrate that folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N;
a number of light emitting diodes disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate;
a sensor disposed on one of the inner faces of the flexible substrate;
a processor disposed on one of the inner faces of the flexible substrate and communicably coupled to the sensor and the one or more light emitting diodes; and
a battery disposed on one of the inner faces of the flexible substrate and electrically connected to the one or more light emitting diodes, the sensor and the processor.

2. The electronic gaming die as recited in claim 1 , wherein the sensor, the processor and the battery are disposed on an outer face of one or more additional sides of the flexible substrate that fold inside the N sides.

3. The electronic gaming die as recited in claim 1 , further comprising an insert disposed within an interior of the flexible substrate and sized to maintain a position of the flexible substrate against the interior of the enclosure.

4. The electronic gaming die as recited in claim 3 , wherein the insert is rigid, semi-rigid, hollow.

5. The electronic gaming die as recited in claim 1 , further comprising an adhesive or one or more connectors that attach one or more edges of the sides of the flexible substrate together to maintain a shape of the flexible substrate.

6. The electronic gaming die as recited in claim 1 , further comprising an expanding foam sealant disposed within an interior of the flexible substrate.

7. The electronic gaming die as recited in claim 1 , wherein N equals 4, 6, 8, 10 or 20.

8. The electronic gaming die as recited m claim 1 , wherein each light emitting diode represents a pip of the electronic gaming die.

9. The electronic gaming die as recited in claim 1 , wherein the number of light emitting diodes are greater than the number of the integer assigned to the side of the flexible substrate such that the number of light emitting diodes are arranged to display a numeric character corresponding to the integer.

10. The electronic gaming die as recited in claim 1 , wherein the enclosure is transparent or semi-transparent.

11. A method for manufacturing an electronic gaming die comprising the steps of: fabricating a flexible substrate that folds into N sides where N is equal to or greater than 4, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N, a number of light emitting diodes disposed on the outer face of each side of the flexible substrate such that the number of light emitting diodes equals the integer assigned to the side of the flexible substrate, a sensor is disposed on one of the inner faces of the flexible substrate, a processor is disposed on one of the inner faces of the flexible substrate and communicably coupled to the sensor and the one or more light emitting diodes, and a battery is disposed on one of the inner faces of the flexible substrate and electrically connected to the one or more light emitting diodes, the sensor and the processor;
providing an enclosure having N sides;
folding the flexible substrate such that the folded flexible substrate fits into an interior of the enclosure;
inserting the folded flexible substrate into the interior of the enclosure; and sealing the enclosure.

12. The method as recited in claim 11 , wherein the sensor, the processor and the battery are disposed on an outer face of one or more additional sides of the flexible substrate that fold inside the N sides.

13. The method as recited in claim 11 , further comprising the step of placing an insert within an interior of the folded flexible substrate, wherein the insert is sized to maintain a position of the flexible substrate against the interior of the enclosure.

14. The method as recited in claim 13 , wherein the insert is rigid, semi-rigid, or hollow.

15. The method as recited in claim 11 , further comprising the step of attaching one or more edges of the sides of the flexible substrate together to maintain a shape of the folded flexible substrate using an adhesive or one or more connectors.

16. The method as recited in claim 11 , further comprising the step of depositing an expanding foam sealant within an interior of the folded flexible substrate.

17. The method as recited in claim 11 , wherein N equals 4, 6, 8, 10 or 20.

18. The method as recited in claim 11 , wherein each light emitting diode represents a pip of the electronic gaming die.

19. The method as recited in claim 11 , wherein the number of light emitting diodes are greater than the number of the integer assigned to the side of the flexible substrate such that the number of light emitting diodes are arranged to display a numeric character corresponding to the integer.

20. The method as recited m claim 11 , wherein the enclosure 1 s transparent or semitransparent.

Assignees

• Univ Texas

Inventors

• Muse Danny W
• Wicker Ryan
• Macdonald Eric
• Salas Rodolfo
• Medina Francisco

Classifications

• A63F2009/2447

  Motion detector · CPC title

• A63F2009/0497

  Manufacturing of dice · CPC title

• Y10T29/49146

  with encapsulating, e.g., potting, etc. · CPC title

• A63F2009/2454

  with LED · CPC title

• A63F9/0415 Primary

  Details of dice, e.g. non-cuboid dice · CPC title