Pixel array medical systems, devices and methods

US10335190B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10335190-B2
Application numberUS-201715585679-A
CountryUS
Kind codeB2
Filing dateMay 3, 2017
Priority dateDec 6, 2013
Publication dateJul 2, 2019
Grant dateJul 2, 2019

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  5. First independent claim

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Abstract

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Systems, instruments, methods, and compositions are described involving removing a portion of the epidermis within a donor site on a subject, and harvesting dermal plugs within the donor site. An injectable filler is formed by mincing the dermal plugs. The injectable filler is configured for injecting into a recipient site on the subject.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: identifying a donor site on a subject; removing a portion of the epidermis within the donor site; harvesting a plurality of dermal plugs within the donor site; forming an injectable filler by mincing the dermal plugs; and injecting the injectable filler into a recipient site on the subject, wherein the recipient site is different from the donor site. 2. The method of claim 1 , wherein the injectable filler comprises a live autologous dermal matrix (LADMIX) injectable filler. 3. The method of claim 2 , wherein the injectable filler comprises live fibroblasts. 4. The method of claim 1 , wherein the removing the portion of the epidermis comprises removing the portion of the epidermis in a region of the donor site. 5. The method of claim 1 , wherein the removing the portion of the epidermis comprises removing the portion of the epidermis in a plurality of regions of the donor site. 6. The method of claim 1 , wherein the removing the portion of the epidermis comprises delaminating the epidermis from the dermis in at least one region of the donor site. 7. The method of claim 6 , wherein the delaminating comprises blistering skin. 8. The method of claim 6 , wherein the delaminating comprises blistering skin at the donor site. 9. The method of claim 6 , wherein the delaminating comprises vibratory shearing. 10. The method of claim 9 , wherein the vibratory shearing comprises at least one of vacuum and heat. 11. The method of claim 6 , wherein the delaminating comprises superficial injection. 12. The method of claim 11 , wherein the superficial injection comprises at least one of saline and anesthetic. 13. The method of claim 1 , wherein the removing the portion of the epidermis comprises dermabrasion of the epidermis from the dermis in at least one region of the donor site. 14. The method of claim 1 , wherein the harvesting the plurality of dermal plugs comprises fractionally resecting at least one dermal plug from at least one region of the donor site. 15. The method of claim 14 , wherein the harvesting the plurality of dermal plugs comprises fractionally resecting at least one dermal plug from each of a plurality of regions of the donor site. 16. The method of claim 1 , wherein the harvesting the plurality of dermal plugs comprises at least one fractional resection application at the donor site. 17. The method of claim 16 , wherein the at least one fractional resection application includes a staggered fractional resection application at the donor site. 18. The method of claim 16 , wherein the at least one fractional resection application at the donor site comprises a first fractional resection application and a second fractional resection application. 19. The method of claim 18 , wherein the first fractional resection application comprises removal of epidermis. 20. The method of claim 18 , wherein the second fractional resection application comprises fractional resection through the dermis. 21. The method of claim 20 , wherein the second fractional resection comprises a partial-thickness fractional resection through the dermis. 22. The method of claim 20 , wherein the second fractional resection comprises a full-thickness fractional resection through the dermis. 23. The method of claim 20 , wherein a fractional defect skin edge of the second fractional resection application comprises additional clearance relative to the fractional defect skin edge of the first fractional resection application. 24. The method of claim 20 , comprising inserting at least one scalpet into the at least one donor region and, when fully inserted, rotating the at least one scalpet. 25. The method of claim 16 , wherein the fractionally resecting comprises positioning at a target site a housing comprising a scalpet assembly, wherein the scalpet assembly includes a scalpet array and at least one guide plate, wherein the scalpet array includes a plurality of scalpets, wherein the at least one guide plate maintains a configuration of the plurality of scalpets. 26. The method of claim 25 , wherein at least one scalpet of the scalpet array comprises a cylindrical scalpet including a cutting surface on a distal end of the scalpet. 27. The method of claim 25 , wherein the fractionally resecting comprises deploying the scalpet array from the housing into tissue at the target site and generating a plurality of incised dermal plugs at the target site when deployed, wherein the deploying includes coupling a force of a drive system of the scalpet assembly to the scalpet array. 28. The method of claim 27 , wherein the fractionally resecting comprises applying rotational force to the scalpet array, wherein the rotational force is configured to rotate at least a set of the plurality of scalpets. 29. The method of claim 28 , wherein the plurality of scalpets passively extrude the dermal plugs through a plurality of lumens of the plurality of scalpets. 30. The method of claim 27 , comprising delivering a vacuum to the target site via the housing, wherein the vacuum comprises pressure relatively lower than ambient air pressure, and capturing the plurality of incised dermal plugs using the vacuum. 31. The method of claim 27 , wherein the fractionally resecting comprises retracting the scalpet array into the housing from the target site. 32. The method of claim 31 , comprising capturing the plurality of incised dermal plugs using an adherent substrate. 33. The method of claim 32 , comprising transecting the incised dermal plugs using a cutting member. 34. The method of claim 16 , wherein the fractionally resecting comprises applying a scalpet array to a target skin site, wherein the scalpet array comprises a plurality of scalpets positioned on an investing plate, wherein the investing plate is a perforated plate. 35. The method of claim 34 , wherein the fractionally resecting comprises circumferentially incising dermal plugs at the target skin site by applying a load via the scalpet array onto subjacent skin surface that includes the target skin site. 36. The method of claim 35 , wherein the applying the load comprises applying the load with a dermatome. 37. The method of claim 36 , wherein the dermatome includes a flat dermatome. 38. The method of claim 36 , wherein the dermatome includes a drum dermatome. 39. The method of claim 35 , wherein the fractionally resecting comprises capturing a plurality of incised dermal plugs on an adherent substrate, wherein the incised dermal plugs are extruded through the scalpet array. 40. The method of claim 39 , comprising coupling the adherent substrate to the dermatome. 41. The method of claim 39 , wherein the fractionally resecting comprises transecting bases of incised dermal plugs extruded through the scalpet array. 42. The method of claim 41 , wherein the transecting comprises transecting with a cutting member. 43. The method of claim 42 , wherein the cutting member is coupled to the drum dermatome. 44. The method of claim 1 , comprising collecting the plurality of dermal plugs harvested at the donor s

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What does patent US10335190B2 cover?
Systems, instruments, methods, and compositions are described involving removing a portion of the epidermis within a donor site on a subject, and harvesting dermal plugs within the donor site. An injectable filler is formed by mincing the dermal plugs. The injectable filler is configured for injecting into a recipient site on the subject.
Who is the assignee on this patent?
Knowlton Edward, Srgi Holdings Llc
What technology area does this patent fall under?
Primary CPC classification A61B17/322. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Jul 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).