Pipe structure and semiconductor module testing equipment including the same

Patent metadata

Field	Value
Publication number	US-10330722-B2
Application number	US-201715670379-A
Country	US
Kind code	B2
Filing date	Aug 7, 2017
Priority date	Oct 17, 2016
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

First claim

What is claimed is:

1. Semiconductor module testing equipment, comprising:
a test board;
a plurality of pipe structures disposed directly on an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board;
a plurality of semiconductor module sockets disposed between a pair of neighboring pipe structures of the plurality of pipe structures,
wherein each of the plurality of semiconductor module sockets is configured to receive a corresponding semiconductor module board therein; and
a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid in a lateral direction with respect to a central axis of the plurality of pipe structures, wherein the central axis being parallel to the first direction.

2. The semiconductor module testing equipment of claim 1 , wherein the plurality of semiconductor module sockets and the plurality of pipe structures are alternately disposed.

3. The semiconductor module testing equipment of claim 1 ,
wherein each semiconductor module socket of the plurality of semiconductor module sockets extends in the first direction.

4. The semiconductor module testing equipment of claim 1 ,
wherein the plurality of pipe structures comprises a first pipe structure, a second pipe structure and a third pipe structure that is disposed between the first and second pipe structures,
wherein the third pipe structures comprise a first nozzle array and a second nozzle array spaced apart from one another in the first direction,
wherein the first nozzle array and the second nozzle array are substantially parallel to each other and spaced apart from each other in the second direction, and
wherein each of the first nozzle array and the second nozzle array corresponds to a respective adjacent semiconductor module socket of the plurality of semiconductor module sockets.

5. The semiconductor module testing equipment of claim 4 , wherein each of the first and second pipe structures comprises a third nozzle array,
wherein the third nozzle array of the first pipe structure and the third nozzle array of the second pipe structure, respectively, corresponds to a respective adjacent semiconductor module socket of the plurality of semiconductor module sockets.

6. The semiconductor module testing equipment of claim 1 , wherein the at least one semiconductor module socket is configured to mount a semiconductor module, the semiconductor module extending in the first direction and comprising at least one semiconductor stack,
wherein at least one nozzle of the plurality of nozzles is configured to discharge the fluid toward the at least one semiconductor stack after the semiconductor module is mounted.

7. The semiconductor module testing equipment of claim 6 , wherein the semiconductor module comprises a dual in-line memory module (DIMM).

8. The semiconductor module testing equipment of claim 6 , wherein each semiconductor socket of the plurality of semiconductor sockets is configured to mount a semiconductor module, and each semiconductor module includes a first semiconductor stack,
wherein each nozzle of the plurality of nozzles is configured to discharge the fluid toward one respective first semiconductor stack.

9. The semiconductor module testing equipment of claim 6 , wherein the semiconductor module comprises a first semiconductor stack and a second semiconductor stack,
wherein a center of the first semiconductor stack is spaced apart from a center of the second semiconductor stack is by a first distance,
wherein a distance in the first direction between a first nozzle of the plurality of nozzles and a second nozzle of the plurality of nozzles is equal to the first distance, and
wherein the first nozzle is configured to discharge the fluid toward the first semiconductor stack and the second nozzle is configured to discharge the fluid toward the second semiconductor stack.

10. A pipe structure, comprising:
a pair of curved end portions elevated with respect to, a test board;
a flat center portion disposed between the pair of curved end portions and disposed directly on the test board;
at least one nozzle array comprising a plurality of nozzles configured to discharge a fluid laterally,
wherein the pipe structure is disposed between a pair of neighboring semiconductor module sockets of a plurality of semiconductor module sockets, wherein the pair of neighboring semiconductor module sockets of the plurality of semiconductor module sockets is disposed on the test board and extends in a first direction, or
wherein the pipe structure is disposed adjacent to a side of an outermost semiconductor module sockets of the plurality of semiconductor module sockets, and
wherein the pipe structure comprises a first sub-pipe structure corresponding to a portion from central portions of the plurality of semiconductor module sockets to ends of the plurality of semiconductor module sockets and a second sub-pipe structure corresponding to portion from the central portions of the plurality of semiconductor module sockets to the other ends of the plurality of semiconductor module sockets.

11. The pipe structure of claim 10 , wherein the pipe structure is disposed on the test board and extends in the first direction.

12. The pipe structure of claim 10 , further comprising a plurality of pipe structures, wherein the plurality of semiconductor module sockets and the plurality of pipe structures are alternately arranged, and at least one pipe structure of the plurality of pipe structures is disposed at an outermost portion of the test board.

13. The pipe structure of claim 10 , wherein the pipe structure comprises
a first array and a second nozzle array each comprising a plurality of nozzles.

14. The pipe structure of claim 13 , wherein the first nozzle array is configured to discharge the fluid toward a first semiconductor module socket of the plurality of semiconductor module sockets that is adjacent to the first nozzle array, and the second nozzle array is configured to discharge the fluid toward a second semiconductor module socket of the plurality of semiconductor module sockets that is adjacent to the second nozzle array.

15. Semiconductor module testing equipment, comprising:
a board;
a first semiconductor module disposed on the board, the first semiconductor module comprising a plurality of semiconductor stacks disposed on a first side of the first semiconductor module and arranged in a first direction; and
a first pipe structure disposed directly on an upper surface of the board adjacent to the first side of the first semiconductor module, the first pipe structure extending in the first direction;
wherein the first pipe structure includes a plurality of holes, and
wherein each of the plurality of holes of the first pipe structure is configured to discharge a heating fluid or a cooling fluid toward the plurality of semiconductor stacks of the first side of the first semiconductor module to heat or cool the plurality of semiconductor stacks of the first side of the first semiconductor module.

16. The semiconductor module testing equipment of claim 15 , further comprising a second pipe structure extending in the first direction, wherein the first semiconductor module further comprises a plurality of semiconductor stacks disposed on a second side of the first semiconductor module in the first direction, wherein the first and

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Min-Woo
• Ha Yong-Dae
• Lee Chang-Ho
• Han Seul-Ki

Classifications

• G01R31/2886

  Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title

• G01R31/2642

  Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests · CPC title

• G01R31/2637

  for testing other individual devices (G01R31/2608 - G01R31/2632, G01R31/27 take precedence) · CPC title

• G01R31/003

  Environmental or reliability tests (of individual semiconductors G01R31/2642; of PCB's G01R31/2817; of IC's G01R31/2855; of other circuits G01R31/2849) · CPC title

• G01R31/2891

  related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05) · CPC title