Self-assembled or reconfigurable structures for heat flow control devices

Patent metadata

Field	Value
Publication number	US-10330400-B2
Application number	US-201514659671-A
Country	US
Kind code	B2
Filing date	Mar 17, 2015
Priority date	Mar 17, 2015
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

First claim

What is claimed is:

1. A self-assembling heat flow object comprising:
a material having one or more self-assembling properties that cause the material to be reactive to an environmental stimulus selected from at least one of an introduction of a magnetic field adjacent to the self-assembling heat flow object, an introduction of an electrical current, and an induced illumination; and
one or more thermal pathways,
wherein an application of the environmental stimulus causes the self-assembling heat flow object to deploy from an undeployed state where the self-assembling heat flow object is not contacting an additional self-assembling heat flow object to a deployed state where the self-assembling heat flow object contacts the additional self-assembling heat flow object and arranges the one or more thermal pathways for directing thermal energy to one or more locations.

2. The self-assembling heat flow object of claim 1 , further comprising a second material disposed on the material having the self-assembling properties, wherein the second material defines the one or more thermal pathways.

3. The self-assembling heat flow object of claim 2 , wherein the second material is a thermally conductive material configured as a plurality of thermally conductive traces.

4. The self-assembling heat flow object of claim 1 , wherein the environmental stimulus comprises an induced temperature change.

5. The self-assembling heat flow object of claim 1 , wherein the self-assembling heat flow object is disposed on a substrate.

6. The self-assembling heat flow object of claim 5 , wherein the substrate is a printed circuit board or a paper-based substrate.

7. The self-assembling heat flow object of claim 1 , wherein the material is a ferromagnetic material, a diamagnetic material, or a paramagnetic material.

8. The self-assembling heat flow object of claim 1 , wherein the material comprises at least one of iron, nickel, cobalt, copper, silver, gold, magnesium, molybdenum, lithium, and tantalum.

9. The self-assembling heat flow object of claim 1 , wherein the material is an alloy comprising at least one of silver, copper, gold, aluminum, magnesium, molybdenum, zinc, lithium, tungsten, nickel, iron, cobalt, palladium, platinum, tin, lead, titanium, tantalum, and mercury.

10. The self-assembling heat flow object of claim 1 , wherein the material comprises a shape memory polymer.

11. A method of forming a device configured to direct heat flow, the method comprising:
placing one or more materials having one or more of self-assembling properties on a substrate, wherein the self-assembling properties cause the shape memory material to react to an environmental stimulus;
providing one or more thermal pathways, wherein providing one or more thermal pathways comprises placing a thermally conductive material on the one or more materials; and
causing the environmental stimulus such that the one or more materials deploy from an undeployed state where the substrate having the one or more materials is not contacting an additional substrate to a deployed state where the substrate contacts the additional substrate and arranges the one or more thermal pathways for movement of heat at one or more locations adjacent to the device, wherein the environmental stimulus is selected from at least one of an introduction of a magnetic field adjacent to the substrate, an introduction of an electrical current to the substrate, and an illumination of the substrate.

12. The method of claim 11 , wherein the environmental stimulus is further selected from a heating or a cooling of the substrate.

13. A device configured to direct heat flow, the device comprising:
a plurality of self-assembling heat flow objects, each one of the plurality of self-assembling heat flow objects comprising:
a substrate;
a shape memory material disposed on the substrate, wherein the shape memory material comprises one or more self-assembling properties that cause the shape memory material to be reactive to an environmental stimulus selected from at least one of an introduction of a magnetic field adjacent to the self-assembling heat flow object, an introduction of an electrical current, and an induced illumination; and
one or more thermal pathways,

wherein an application of the environmental stimulus causes the plurality of self-assembling heat flow objects to deploy from an undeployed state where the plurality of self-assembling heat flow objects do not contact one another to a deployed state where each one of the plurality of self-assembling heat flow objects contacts at least one other of the plurality of self-assembling heat flow object and arrange the one or more thermal pathways for directing thermal energy to one or more locations adjacent to the self-assembling heat flow object.

14. The device of claim 13 , further comprising a second material disposed on the shape memory material having the self-assembling properties, wherein the second material comprises the one or more thermal pathways.

15. The device of claim 14 , wherein the second material is a thermally conductive material.

16. The device of claim 13 , wherein the substrate comprises a high thermally conductive material and wherein the device further comprises a second substrate comprising a low thermally conductive material disposed on the high thermally conductive material.

Assignees

• Toyota Eng & Mfg North America

Inventors

• Dede Ercan Mehmet

Classifications

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H02S40/40

  Thermal components (H02S10/30 takes precedence) · CPC title

• F28F2255/00

  Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes · CPC title

• H01F7/206

  Electromagnets for lifting, handling or transporting of magnetic pieces or material (electromagnets for guidance of vehicles, workpieces B65G21/2009; for magnetic suspension or levitation H02N15/00) · CPC title