Light for room and building illumination

Patent metadata

Field	Value
Publication number	US-10330287-B2
Application number	US-201815982617-A
Country	US
Kind code	B2
Filing date	May 17, 2018
Priority date	Jun 27, 2017
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

A light for room and building illumination, the light comprising an illuminant, including a circuit board including a carrier material, an insulation layer applied to the carrier material at least on one side, conductive paths applied to the insulation layer, and at least one LED that is arranged on the insulation layer and functions as the illuminant, at least one light permeable cover arranged subsequent to the LED in a light exit direction, a light housing in which the circuit board is arranged, characterized in that the circuit board is a metal core circuit board which forms the light housing.

First claim

What is claimed is:

1. A light for room and building illumination, the light comprising:
an illuminant, including:
a circuit board including a carrier material, an insulation layer applied to the carrier material at least on one side, conductive paths applied to the insulation layer, and at least one LED that is arranged on the insulation layer and functions as the illuminant,
at least one light permeable cover arranged subsequent to the LED in a light exit direction,
a light housing in which the circuit board is arranged,
wherein the circuit board is a metal core circuit board which forms the light housing,
wherein the light housing is formed along at least two forming lines of the metal core circuit board, and wherein an insulation layer with the conductive paths and with the LED is arranged between the at least two forming lines of the metal core circuit board,
wherein a surface of the metal core circuit board is provided without an insulation layer in surface portions that are deflected from an arrangement plane of the LED,
wherein the surface portions are deflected from the arrangement plane of the LED substantially by a right angle and oriented substantially in the light exit direction, and
wherein an entire surface portion between the at least two forming lines is provided with the insulation layer.

2. The light according to claim 1 , wherein the metal core circuit board forms the light housing through at least one forming process of the metal core circuit board.

3. The light according to claim 2 , wherein housing sections of the metal core circuit board that are deflected from the arrangement plane of the LED provide dissipation of LED operating heat.

4. The light according to claim 3 , wherein the housing sections of the metal core circuit board that provide dissipation of the LED operating heat have a surface size that is sufficient to dissipate the LED operating heat.

5. The light according to claim 1 , wherein the metal core circuit board includes a channel shaped cavity in which the LED is arranged.

6. The light according to claim 5 , wherein the channel shaped cavity is defined by face side terminal elements which are configured as a lamp socket or as a lamp holder.

7. The light according to claim 1 , wherein the metal core circuit board forms retaining devices for the at least one light permeable cover.

8. A method for producing a light which includes a light housing which includes a circuit board with a LED configured as an illuminant, wherein the circuit board is a metal core circuit board, the method comprising the step:
forming the metal circuit board along at least two forming lines into a light housing so that the metal core circuit board forms the light housing, and arranging the LED between the forming lines,
wherein the surface of the metal core circuit board does not include an insulation layer in the surface portions that are deflected from an arrangement plane of the LED by the forming, and
wherein the surface portions are deflected from the arrangement plane of the LED substantially by a right angle and oriented substantially in the light exit direction, and
wherein an entire surface portion between the at least two forming lines is provided with the insulation layer.

9. The method according to claim 8 , wherein the surface of the metal core circuit board is provided with retaining devices for a cover.

Assignees

• Bjb Gmbh & Co Kg

Inventors

• Baumeister Olaf
• Pieper Markus

Classifications

• F21V15/01 Primary

  Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04}) · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K1/05

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

• F21V29/507

  of means for protecting lighting devices from damage, e.g. housings · CPC title

• F21V5/043

  the lens having cylindrical faces, e.g. rod lenses, toric lenses · CPC title