Flame retardant laser direct structuring materials

Patent metadata

Field	Value
Publication number	US-10329422-B2
Application number	US-201715673583-A
Country	US
Kind code	B2
Filing date	Aug 10, 2017
Priority date	May 23, 2008
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

Flame retardant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic resin, a laser direct structuring additive, and a flame retardant. The compositions offer flame retardant characteristics while also substantially maintaining the mechanical properties of the base thermoplastic resin, such as the impact strength and/or HDT of the composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone and other such communications equipment.

First claim

What is claimed is:

1. A thermoplastic composition, comprising:
a) from 70 to 85 wt % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyamide resin;
b) from 0.5 to 15 wt % by weight of a laser direct structuring additive, wherein the laser direct structuring additive is a copper chromium oxide spinel; and
c) 0.1 to 15 wt % of a flame retardant, wherein the flame retardant comprises resorcinol bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), or a combination thereof;
wherein amounts are based on a total weight of the thermoplastic composition,
wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.6 mm (±10%), and
wherein laser activation of an area of the thermoplastic composition exposes and activates metal atoms of the laser direct structuring additive such that a metal plating layer can be plated on the area activated by the laser.

2. The composition of claim 1 , wherein the polyamide resin comprises polyamide-6, polyamide-6,6, polyamide-4,6, polyamide-11, polyamide-12, polyamide-6,10, polyamide-6,12, polyamide 6/6,6, polyamide-6/6,12, polyamide MXD,6, polyamide-6,T, polyamide-6,I, polyamide-6/6,T, polyamide-6/6,I, polyamide-6,6/6,T, polyamide-6,6/6,I, polyamide-6/6,T/6,I, polyamide-6,6/6,T/6,I, polyamide-6/12/6,T, polyamide-6,6/12/6,T, polyamide-6/12/6,I, polyamide-6,6/12/6,I, or a combination comprising at least one of the foregoing polyamide resins.

3. The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.2 mm (±10%).

4. The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.0 mm (±10%).

5. The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 0.8 mm (±10%).

6. The composition of claim 1 , wherein the thermoplastic composition includes from 10 to 15 wt. % of the flame retardant, and the flame retardant comprises resorcinol bis(diphenyl phosphate).

7. An article of manufacture comprising the composition of claim 1 .

8. The article of claim 7 , wherein the article is selected from a personal computer, a notebook computer, a portable computers, a cell phone, or a personal digital assistant.

9. A method of forming a thermoplastic composition comprising the step of: blending in an extruder:
a) from 70 to 85 wt % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyamide resin;
b) from 0.5 to 15 wt % of a laser direct structuring additive, wherein the laser direct structuring additive is a copper chromium oxide spinel; and
c) 0.1 to 15 wt % of a flame retardant, wherein the flame retardant comprises resorcinol bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), or a combination thereof;
wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.6 mm (±10%), and
wherein laser activation of an area of the thermoplastic composition exposes and activates metal atoms of the laser direct structuring additive such that a metal plating layer can be plated on the area activated by the laser.

10. The method of claim 9 , wherein the polyamide resin comprises polyamide-6, polyamide-6,6, polyamide-4,6, polyamide-11, polyamide-12, polyamide-6,10, polyamide-6,12, polyamide 6/6,6, polyamide-6/6,12, polyamide MXD,6, polyamide-6,T, polyamide-6,I, polyamide-6/6,T, polyamide-6/6,I, polyamide-6,6/6,T, polyamide-6,6/6,I, polyamide-6/6,T/6,I, polyamide-6,6/6,T/6,I, polyamide-6/12/6,T, polyamide-6,6/12/6,T, polyamide-6/12/6,I, polyamide-6,6/12/6,I, or a combination comprising at least one of the foregoing polyamide resins.

11. The method of claim 9 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.2 mm (±10%).

12. The method of claim 9 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.0 mm (±10%).

13. The method of claim 9 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 0.8 mm (±10%).

14. The method of claim 9 , wherein the thermoplastic composition includes from 10 to 15 wt. % of the flame retardant, and the flame retardant comprises resorcinol bis(diphenyl phosphate).

Assignees

• Sabic Global Technologies Bv

Inventors

• Li Yanjun Frank
• Meng Jiru
• Zou Xiangping David

Classifications

• C08K5/5399

  Phosphorus bound to nitrogen · CPC title

• C08L47/00

  Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers (C08L45/00 takes precedence; of conjugated diene rubbers C08L9/00 - C08L21/00) · CPC title

• C08K2003/2251

  of chromium · CPC title

• C08L71/12

  Polyphenylene oxides · CPC title

• C08K5/0066

  Flame-proofing or flame-retarding additives · CPC title